Resin Electronic Shielding

Description: A two component, silver-filled, electrically conductive epoxy designed for hybrid micro-electronic packaging and assemblies. It can be used for die-attach or SMD attach onto ceramic substrates as well as package grounding or EMI/Rf shielding.

• Substrate / Material Compatibility: Metal, Plastic
• Industry: Electronics
• Chemical / Polymer System Type: Epoxy (EP)
• Filled / Reinforced: Yes

Description: ; Edge Seals, Fast-Drop ™ Fiber Bend Radius Control Modules for Cable Management, EMI/RFI Shielding and Thermal Management Materials, and a wide selection of collaborative custom designed products.

• Use: Conformal Coating
• Form: Powder, Specialty / Other
• Chemical / Polymer System Type: Epoxy (EP), Polyamide, Polyester (PET), Specialty / Other
• Cure Type / Technology: UV / Radiation Cured (also EB, Light), Specialty / Other

Description: 3M™ Electrically Conductive Acrylic Pads (eCAP), 7830N Series, provide a good electrical conductive path for EMI shielding and grounding in electronic devices. eCAP is a conductive fabric laminate coated on one side with an acrylic adhesive which contains aligned conductive filler, providing

• Compound Type: Electrically Conductive
• Cure Type / Technology: Single Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Chemical / Polymer System Type: Acrylic / Polyacrylate

Description: Bonded laminate, copper shield between layers or Sil-Pad

• Compound Type: Electrical Insulation / Dielectric, EMI / RFI Shielding Material, Thermal Compound / Thermally Conductive
• Form / Function: Specialty / Other
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Industry Applications: OEM / Industrial

Description: of greater than 10 BTU•in/ft²•hr•°F. It can be used for bonding electronic components onto substrates as well as for applications where EMI/RFI shielding is needed. Master Bond FL901S film adhesive offers the convenience of easy to apply non-mix system along with the high

• Type / Form: Adhesive, Thermal Compound / Interface, Specialty / Other
• Electrically Conductive: Yes
• Anti-static / ESD Control: Yes
• Industry: Electronics, Optical Grade / Material

Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version

• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy
• Filler Material: Carbon / Graphite
• Resins & Compounds: Liquid

Description: Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured

• Product Type: Specialty Polymers and Resins
• Technology Type: Solid, Specialty / Other
• Features: Anti-Static / Electrostatic, Electrically Nonconductive, EMI / RFI Shielding
• Industry: Aerospace, Automotive, Electronics, OEM / Industrial, Semiconductor, Other

Description: Bond EP21CLV system is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

• Product Type: Specialty Polymers and Resins
• Technology Type: Solid, Specialty / Other
• Features: Anti-Static / Electrostatic, Electrically Nonconductive, EMI / RFI Shielding
• Industry: Aerospace, Automotive, Electronics, OEM / Industrial, Semiconductor, Other

Description: . Superior resistor aliment Minimized contact resistance Guarding and shielding Materials of high insulation resistance and low absorption are employed. Guard circuits are provided to insure stable operation even In highly humid atmospheres. The instrument is housed in a {grey} metal case

• Product Type: Wheatstone Bridge