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  • RF Measurement Techniques
    The RF and microwave characteristics commonly used to define the performance of components are typically measured using a vector network analyzer. Since the packages of devices manufactured by Barry Industries, Inc. typically do not have coaxial connectors, the issue of the most appropriate
  • Is There A Shortage Of Good RF Applications Engineers?
    of circuit design and. optimization. A working knowledge of material science and even chemical engineering has become. required in order to understand the nuances of wafer processes (bipolar transistor, heterojunction. bipolar transistor, RF diode, RF CMOS, RF BiCMOS, pHEMT, etc.), metal layers
  • Comparison of RF Terminations with BeO and ALN Substrates
    Terminations designed to dissipate significant amounts of power at RF frequencies have traditionally been fabricated on beryllium oxide (BeO) substrates. The high thermal conductivity and moderate dielectric constant make BeO an ideal choice for this application. Increased regulation regarding
  • Optimize Your RF/MW Coaxial Connections
    In summary, coaxial connectors range from DC through millimeter-wave frequencies and are available for RF/microwave applications through 125 GHz. Some high-frequency connectors increase in cost as they decrease in size. Connectors are available in grades from commercial to high precision
  • How Digital Laser Material Processing Works: Understanding the Fundamentals of DC Glass and RF Metal Lasers
    There are major differences between DC glass and RF metal lasers that impact the speed and quality of laser processing, operator safety, laser service life and requirements for additional support equipment. Low_cost_lasers How Digital Laser Material Processing Works: Understanding
  • Solid-state RF switches
    The simplest solid-state RF switch employs a PIN diode as a switching element. PIN diodes are named for a region of undoped intrinsic semiconductor lying between their p and n-type material. This area eliminates capacitance effects between the n and p-type areas that can otherwise lower device
  • RF Wafer Testing: An Acute Need, and Now Practical (.pdf)
    devices have comparable RF. test requirements. Characterizing equivalent oxide thickness (EOT) on high D gate dielectrics is critical. in high performance logic devices at the 130nm node and beyond, in the development of new. materials, and for continued scaling of future IC generations. For example
  • Investigation of Trim Notch and its Effect on Surface Mount Resistors in RF Circuits
    Surface mount (SMD) resistors are often employed in microstrip circuitry at RF frequencies. Typical SMD resistors designed for general purpose circuitry are usually trimmed using plunge trim or "L" trim techniques. This involves removal of material in a narrow groove either perpendicular

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