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  • Solid-state RF switches
    The simplest solid-state RF switch employs a PIN diode as a switching element. PIN diodes are named for a region of undoped intrinsic semiconductor lying between their p and n-type material. This area eliminates capacitance effects between the n and p-type areas that can otherwise lower device
  • RF Circuit Design, Second Edition
    RF Circuit Design, Second Edition. Explaining how to design and integrate an RF component in a very practical fashion, this comprehensive guide has been updated to include today's integrated circuit (IC) and system-level design issues as well as keeping its classic "wire lead" material.
  • RF Power: GaN Moves In for the Kill
    Is gallium nitride (GaN) the wide bandgap material that will turn RF power generation on its head and relegate gallium arsenide (GaAs) and LDMOS (Laterally Diffused Metal Oxide Semiconductor) to the annals of history? Well you'd certainly think so, based on articles in the trade press, symposium
  • How Digital Laser Material Processing Works: Understanding the Fundamentals of DC Glass and RF Metal Lasers
    There are major differences between DC glass and RF metal lasers that impact the speed and quality of laser processing, operator safety, laser service life and requirements for additional support equipment.
  • Comparison of RF Terminations with BeO and ALN Substrates
    Terminations designed to dissipate significant amounts of power at RF frequencies have traditionally been fabricated on beryllium oxide (BeO) substrates. The high thermal conductivity and moderate dielectric constant make BeO an ideal choice for this application. Increased regulation regarding
  • Investigation of Trim Notch and its Effect on Surface Mount Resistors in RF Circuits
    Surface mount (SMD) resistors are often employed in microstrip circuitry at RF frequencies. Typical SMD resistors designed for general purpose circuitry are usually trimmed using plunge trim or "L" trim techniques. This involves removal of material in a narrow groove either perpendicular
  • Dampening Cavity Resonance Using Absorber Material- RF Design, May 2004
    Today, many microwave circuit designers are noticing that their circuits do not perform as well as predicted when they enclose them with circuit board covers. As a result, cavity resonances are set up inside the cavity, which changes the impedance conditions required for proper operation of some
  • Enhanced High-Frequency LTCC for RF and Microwave Packaging (.pdf)
    Previous work has demonstrated that Ferro A6M is the proven leader for high frequency, low loss Low Temperature Cofire Ceramic (LTCC) applications where reliable performance is critical. More than one million electronic packages have been made from this material in the past 20 years for critical

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