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  • Leveraging New Monolithic Integration of CMOS and MEMS Integration Technology
    technology [1] of its kind to. allow direct post-processing of high-quality MEMS layers on top of advanced RF/mixed-signal CMOS. technology (0.18 µm and below), thereby leveraging the scalability of state-of-the-art CMOS. manufacturing as a modular back-end-of-line option attached to the same
  • Low Distortion Tunable RF Components, a Compound Semiconductor Opportunity
    An overview is given for the current state-of-the-art. of semiconductor based tunable RF elements. For this. purpose, semiconductor based capacitive switch banks. and varactors are reviewed and compared with the. recently developed ultra-low distortion semiconductor. based varactors. It reveals
  • The Next Big Thing For Discrete RF Semiconductors: Health Care
    specific integrated circuit (ASIC) that reads the MEMS sensors, stores the. data, and transmits it on command to an internal or external appliance, and. •. Schottky diodes that rectify the RF energy transmitted from the external device to charge at. least one tiny super capacitor to store electrical
  • Design Concepts for Semiconductor based Ultra-Linear Varactor Circuits (Invited)
    diode. perfectly cancelled, yielding distortion-free device. topologies have been developed and implemented. operation for RF signals. [11]-[18]. These proposed varactor configurations act. • The high-tuning range varactor stack (HTRVS). as variable capacitors between their RF terminals. [11
  • Digital Compass Reference Design with the SiRFstar2t GPS Chipset
    inputs from the 3-axis. GPS satellite reception is intermittent. Vehicle. MEMS accelerometers, the tilt-compensated (flattened). telematics systems use pointing with the vehicle. X’ and Y’ values can be converted into a heading. Both. direction, plus location information to harvest provider
  • Will CMOS Amplifiers Ever Kick-GaAs?
    (for devices that are more rugged), linearity. amplifier modules (PAMs) in the future. We have previously. issues, design/manufacturing support issues, RF model. discussed opportunities for BiCMOS[5] – where some of the. inaccuracies, lack of high-voltage capacitors, through wafer. same challenges remain

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