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  • Schottky Diodes
    Schottky diodes have been. used for several decades. as the key elements in frequency. mixer and RF power. detector circuits. In 1938 Walter. Schottky, the son of German. mathematician Friedrich. Schottky, explained the manner. in which a junction comprised. of specific combinations of metals
  • Medical Device Link .
    manufactures the system with high- and low-RF generators, computer and manual control systems, process temperature control, multiple gas flows, mass-gas-flow controllers, and automated vacuum chamber doors. Plasma Etch Inc., 3522 Arrowhead Dr., Carson City, NV 89706. Plasma treatment system A plasma
  • Medical Device Link .
    . Ceramaseal has designed an RF feedthrough that brings cooling water close to the seal at the conductor-insulator interface to control heat without complex cooling jackets. The ceramic-to-metal feedthrough is suitable for a variety of RF applications including sputtering, plasma generation, and induction
  • Copper Interconnect on GaAs pHEMT by Evaporation Process
    . deposition rates. We will discuss the challenges in the. development work. A comparison of DC and RF test. parameters between wafers that have Au and Cu interconnects. as well as reliability data will be presented. Microsoft Word - Mantech CuM1 final.docx. Copper Interconnect on GaAs pHEMT
  • MICRO: Process Tool Support
    plasma ashing with closed-loop temperature-controlled platen and lamp control, followed by a sulfuric/peroxide wet clean, has been shown to be effective in removing most high-dose implant resists with minimal popping and residue. Adding RF plasma to the microwave downstream plasma enables the
  • Charged Particle Analysis in Plasma Assisted Processes
    yields. • faster process transfer. • improved reproducibility. Process Characterisation. Plasma Processes. Techniques. Applications. ! ECR. ! PECVD. ! DC Magnetron. ! Plasma Etch. ! Pulsed Plasma & Laser. ! PVD. Ablation. ! Plasma Spray. ! RF Driven. ! Hard Coatings. ! TCP/ICP. ! Ion Implantation
  • Solder Powder: IPC
    High Temperature High Pb. Thermal Management. Burn-in and Test. Concentrated Photovoltaic. IGBT. RF Power Devices. TIM1, TIM1.5, TIM2. Thin-Film. Thermal Evaporation. Plating. PV Sputtering Targets. Target Bonding. PVD Coating Materials. Contact Us. Home Page. Return to Blog Summary Page ^. Reflow
  • Adding Solder to a NanoBond (R) Assembly
    Resistance Solutions. SnPb Including High Temperature High Pb. Thermal Management. Burn-in and Test. Concentrated Photovoltaic. IGBT. RF Power Devices. TIM1, TIM1.5, TIM2. Thin-Film. Thermal Evaporation. Plating. PV Sputtering Targets. Target Bonding. PVD Coating Materials. Contact Us. Home Page. Return