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  • RF Probe Calibration
    Introduction: The calibration of RF Field. Probes is a complex process. Characterization is. a more correct term to use than calibration. The. probe must be properly characterized to reflect. how the end user uses his/her probe in their. measurement program. Differences as much as. +/- 6dB can
  • RF Test Gage R&R Improvement
    of variation in RF probe measurements. Tester Gage study results are presented. Evaluations of factors including test instrument repeatability, probe card wear, probe tip planarity, probe pressure, and probe placement within the bond pad are presented. The data indicated the repeatability of the test
  • Evaluating pHEMT Process Improvements Using Wafer Level RF Tests
    by the wafer process. DC. testing of circuit designs is used to evaluate the success of. the design, the success of the wafer processing, and the. interaction of the design with the process. While good. PCM and DC circuit test results are necessary, they are. not sufficient to guarantee acceptable RF
  • | Electronics Industry News for EEs & Engineering Managers
    this technology in its etchers, wafer track, and other systems by the middle of 2002. Hynix moves closer to wafer-level test of fast DRAMs SEOUL -- Korea's Hynix Semiconductor Inc. has demonstrated the ability to perform high-speed wafer-level testing of DRAM devices using a probe system from Teradyne Inc
  • Metrigraphics Article in Today's Medical Developments
    removal, by the time you got 10µm or 15µm deep, you would end up with no traces at all. An RF coupling device that Metrographics manufacturers puts the precision of the electroforming process into perspective. It could be implanted in the body to transmit data from outside to inside the body, or vice

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