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RF Test Probe

 

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Parts by Number for RF Test Probe Top

Part # Distributor Manufacturer Product Category Description
MM121454 Digi-Key Murata Electronics North America Connectors, Interconnects TEST PROBE
6006-2 Digi-Key Pomona Electronics Test and Measurement PROBE RF X10 INSULATED RED
6006-8 Digi-Key Pomona Electronics Test and Measurement PROBE RF X10 INSULATED GRAY
6104 Digi-Key Pomona Electronics Test and Measurement PROBE RF DMM KIT 30MHZ
MXHS83QE3000 Digi-Key Murata Electronics North America Connectors, Interconnects TEST PROBE MANUL FOR MM8430-8130
MM126036 Digi-Key Murata Electronics North America Connectors, Interconnects TEST PROBE AUTO FOR MM8430-8130
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Conduct Research Top

  • RF Test Gage R&R Improvement
    of variation in RF probe measurements. Tester Gage study results are presented. Evaluations of factors including test instrument repeatability, probe card wear, probe tip planarity, probe pressure, and probe placement within the bond pad are presented. The data indicated the repeatability of the test
  • Evaluating pHEMT Process Improvements Using Wafer Level RF Tests
    , and the. DISCUSSION. interaction of the design with the process. While good. Wafer level tests employed by Skyworks include PCM. PCM and DC circuit test results are necessary, they are. and DC and RF wafer probe of the switch die. The PCM's. not sufficient to guarantee acceptable RF performance. are used
  • Reducing Parametric Test Costs with Faster, Smarter Parallel Test Techniques
    to achieve up to. 85% capital equipment reuse over five or more process nodes. · Parametric test involves measuring a wide array of signal types, ranging from. femtoamp DC leakage to 40GHz RF s-parameters. Applying a typical cost of ownership model to parametric test as used in volume. production
  • Frequency Response of Double-Ended Socket and Probe Configuration (.pdf)
    and Probes. A network analyzer was. used to measure the frequency response characteristics of a wide variety of probe configurations. Initial. testing of Double-Ended Sockets utilized an RF network analyzer covering the frequency range of 300. KHz to 3 GHz. Subsequent testing using a newer microwave
  • High Volume Test Methodology for HBT Device Ruggedness Characterization
    of. or manufacturing process variations. Moreover, the test. all, since we are forcing the devices into bias points beyond. is non-destructive. breakdown, we need to avoid oscillations. To achieve this. we use devices which are laid out with GSG (Ground-. Signal-Ground) pads and use RF probes (these are standard
  • A Closed-Loop Drive-train Model for HIL Test Bench (.pdf)
    This paper presents a hardware-in-the-loop (HIL) test bench for the validation of production transmission controls software, with a focus on a closed-loop vehicle drive-train model incorporating a detailed automatic transmission plant dynamics model developed for certain applications. Specifically
  • A Test Lab Based Solution to Optimize 3G Networks to Maximize Revenue for Data Services Through Good End User Quality of Experience (.pdf)
    probe. data to reproduce real traffic scenarios in the lab. As signal. strength data is available from the Iub data, these scenarios will. include full simulation of the actual phone mobility recorded in the. probe data log. The test output from the SystemAT can be configured to provide. a range
  • Cost Effective Testing with a BRIC Matrix
    , but applications requiring the highest amount of switching usually arise from what appear to be simple test requirements. It is rare for test applications to demand the switching of large numbers of RF and microwave signals or for high signal powers. The most complex switching problems usually

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