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  • Surface Texture Parameters
    roughness and waviness data. Proper selection of the correct filter cutoff in software is critical to measurement accuracy. Evaluation Length- The area from which data is obtained. It is a three dimensional area that corresponds to the instrument field of view, or a two dimensional profile
  • Why Use a Surface Finish Chart?
    A surface finish chart is a reference material we at Metal Cutting sometimes use internally as part of our quality assurance process. (You can read more about our quality measures on the Quality Commitment page of our website.) Typically, such charts provide guidelines regarding the measurement
  • Improved Interferometric Optical Testing
    Interferometry is used for testing optical components and optical systems as well as the metrology of many other components, such as the flatness and roughness of hard disk drive platters and the shape of magnetic recording heads and machined parts. This article describes three recent advances
  • MICRO: Spotlight
    PTFE wetted surfaces and encapsulated electronics. By delivering simultaneous pressure and flow measurements, the unit enables users to monitor process parameters and set alarms. (S.F., North Hall, Booth 5944A) The VCA-3000 contact-angle analyzer from incorporates computerized video imaging
  • 3D Atomic Force Microscopy as an Alternative to X-SEM and TEM for Advanced Process Metrology (AN91) (.pdf)
    development due to development costs up, process the long turnaround times. developers seek new metrology Whereas the available error budget solutions to better address today's of TEM is consumed by LWR and line stringent process requirements. edge roughness (LER), the X3D atomic Traditional
  • MICRO:Product News
    . The CS-5000 is a combination instrument for the analysis of precision forms and surface roughness parameters. An automatic temperature compensation function adjusts measured data to the reference temperature. LaserHologage measuring technology provides a resolution of 2.0 nm. Geometric analysis commands
  • MICRO:Product Technology News (April '99)
    accommodates both 200- and 300-mm wafers and can be upgraded to measure critical dimensions on sub-0.13- um geometries. The system's process variation monitoring technology uses a column design and special algorithms to measure line edge roughness, line edge width variation, and open or closed

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