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  • [Chapter 6] 6.2 A Case for Study<
    Lenny, on our staff, was having difficulty converting a document coded for Scribe to our macro package, because of font changes. The problems he encountered are quite interesting, apart from the task he was trying to do. The Scribe convention for putting text in a bold font is: This font change
  • Laser Scribing of Ceramics
    in the automotive industry, amplifiers in telecoms and military applications. It is principally scribed, 60% cut and then broken. The performance of the SPI 200W fiber laser for the scribe and Break of alumina investigated here. Above 350 Hz repetition rate, (20% duty cycle, 40W average power) there was a clear
  • Fiber Laser Cutting of Silicon
    ") thick and 100-300mm(4"-12") diameter. Traditionally silicon wafers have been cut with diamond saws, occasionally using a scribe and break process, which have the limitation that they can only cut straight lines and suffer from edge chipping, and frequency doubled vanadate lasers which are both slow
  • Semiconductor Micromachining Using Diode-Pumped Solid-State Lasers
    ) industries for aplications including wafer dicing, scribing, direct via forming, and three-dimensional structuring. In the current study, two Qswitched and one mode-locked diode-pumped solid-state (DPSS) 355 nm lasers have been used to scribe grooves on silicon and sapphire wafer substrates
  • Laser Scribing Thin Film Molybdenum for Photovoltaic Cells
    . Of the major types of thin film solar cells, one of the most widely exploited to date is based on a CIGS (Copper Indium Gallium diSelenide) active layer. These cells typically use a thin layer of molybdenum as a back contact layer deposited directly onto the glass. Laser scribing or 'cutting
  • Compact slide helps "board breaker " squeeze into cramped quarters
    . The singulator, developed by TSG Automation, Ivyland, Pa., automates the process of breaking ceramic snapstrate panels into individual parts used to produce hybrid components. The machine features dual breaker units that both clamp and strip to insure a clean break on the scribe line. At the first
  • MICRO:Product Technology News (May '99)
    A laser cutting tool for flat-panel display glass makes high-quality cuts without creating particles. While glass has traditionally been cut using a mechanical scribe-and-break process that causes fragmentation, edge chips, and microcracks that may generate particles, the laser technique uses
  • MICRO: STI Process Control
    , such as a large pad or scribe line. In order to point the beam at the nonpatterned area, a vision system and pattern-recognition algorithms are used in conjunction with an accurate mechanical stage to move the wafer to the target measurement coordinates. However, the need to isolate the measurement site

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