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Developing the workforce for a high-yield semiconductor fab
that help fab employees build high-yield microchip devices still need to be developed in the workplace. Fab employee Gary Stephens practices wafer handling in the skill training room. Photos by Reagan Bradshaw. Semiconductor device fabrication technology has advanced quickly, but most operators have...
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MICRO:Archives of 1998 Issues
On: 'Round the Circuit: Ball Semi is on a roll; Leica, Applied demonstrate against defects VIEWPOINT Viewpoint: Assessing future trends in automated defect inspection and yield management TECHNICAL ARTICLES Mapping the Roadmap: The series concludes with a look at the challenges facing...
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MICRO:June 98:Semicon West Exhibitors - page 2
, Asyst Software; and Ray Peterson, Tokyo Electron America SEMI Chemical and Gas Manufacturers Group 10 11:30 a.m. Fab Layout Design Methodology: Case of the 300-mm Fabs 1 5 p.m. Moscone Center Instructors: Doron Meyersdorf and Jose Padillo, Tefen Guest Speakers: Theron Colvin, PRI...
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MICRO:Semicon Southwest p.2 (Oct '99)
Jeff Ellison, AMD In Pursuit of Efficiency (Integrating SEMI E10, SEMI E58, and SEMI E79 to Optimize Equipment Performance) Tom Pomorski, Fairchild Semiconductor Tool Availability, MTBF, MTBI and Parts Availability and How They Impact Productivity Andrew Melnyk, KLA-Tencor Fab Economics...
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MICRO:
to build Israeli fab. Europe: LGInternational signs ITS as European distributor. 300-mm Imperative: Japanese firm orders Entegris FOUPs; 300-mm wafer toolmakers to see eightfold jump in revenues; FEI inspection tools installed at pilot facility; electronics manufacturer buys Axcelis dry resist removal...
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MICRO:Semicon West '99 (June '99)
such as low-k dielectric and copper interconnect technology, lithography challenges and opportunities, contamination-free and green manufacturing techniques, software inspections and testing, and advanced silicon wafer developments dot the educational docket. Lest we forget the standards warriors, over 100 SEMI...
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MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
SUNDAY, OCTOBER 18 8:00 a.m. 5:00 p.m. Fab Automation Instructors: Gerald T. Mackulak, Arizona State University; and Theron Colvin, PRI Automation MONDAY, OCTOBER 19 9:00 a.m. 4:30 p.m. A Partnership for PFC Emissions Reductions (cosponsored by SEMI, SIA, SSA, and Sematech) Program Chairs...
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MICRO: Archive: Back Issue TOC
devices Achieving process utility conservation and cost reductions in a 300-mm fab environment; a case study details a DRAM fab's. MICRO: Archive: Back Issue TOC. MICRO Advertiser and Product Information Buyers Guide. Chip Shots blog. Greatest Hits of 2005. Featured Series Web Sightings Media Kit...
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MICRO:Archive:Back Issue TOC
low-k material integration through low-ion plasma dry strip processes Improving work-in-progress visibility with active product tags Using bitmap analysis to help identify yield-critical issues in the fab Using laser-based patterned-wafer inspection for. MICRO:Archive:Back Issue TOC. MICRO Advertiser...
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MICRO: Archive: Back Issue TOC
carbide production into a silicon fab. Dry Surface Technologies: Using a tungsten plasma clean process to reduce metal shorts caused by CMP microscratches. Critical Materials: Understanding the new SEMI standards for stainless-steel welding applications. Green Manufacturing : Achieving closed-loop...