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Developing the workforce for a high-yield semiconductor fab
. This specific skill training is what actually creates experts on the various tool sets run by production employees. Since tool-generated contaminants are the cause of major yield losses, fab personnel also need to learn how to keep tools free of contamination. Although the equipment vendor is a good...
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MICRO:Archives of 1998 Issues
published 300-mm Imperative: IBM builds advanced chip research plant; Ferrofluidics withdraws from MEMC competition; Selete installs Applied RTP tool Expansions and Acquisitions: Comdisco buys ISI surplus tools; Raytheon sells chip biz to Fairchild; Tyecin, Promis combine fab software; Cintas...
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MICRO: Industry News: Breakout (June 2000)
With one eye on the future, this year's IEEE/SEMI semiconductor manufacturing conference will continue to reach beyond the process realm to target the array of issues confronting engineers and fab managers, says Pat Gabella, the event's technical chairperson. Sessions covering supply-chain issues...
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MICRO:Archive:Back Issue TOC
RTP; ASTM issues new wiper standard; SEMI hosts FPD show with EIAJ and JEIDA; ANSI okays IEST to write standards; MRS issues call for papers CMP system, dry pumps, inspection systems, lithography platform, birefringence measurement, SIMS tool, feedthrough actuator, XRF elemental analyzer, CMP slurry...
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MICRO:
to build Israeli fab. Europe: LGInternational signs ITS as European distributor. 300-mm Imperative: Japanese firm orders Entegris FOUPs; 300-mm wafer toolmakers to see eightfold jump in revenues; FEI inspection tools installed at pilot facility; electronics manufacturer buys Axcelis dry resist removal...
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MICRO:Semicon Southwest p.2 (Oct '99)
Jeff Ellison, AMD In Pursuit of Efficiency (Integrating SEMI E10, SEMI E58, and SEMI E79 to Optimize Equipment Performance) Tom Pomorski, Fairchild Semiconductor Tool Availability, MTBF, MTBI and Parts Availability and How They Impact Productivity Andrew Melnyk, KLA-Tencor Fab Economics...
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MICRO: Product Handling and Automation - Fosnight (May 2000)
, developing, etch, stripping/cleaning, and inspection steps. After a reticle is manufactured, it must again be safely and cleanly transported, this time to the IC fab, where it will be stored, transported, and used. There were very few standards covering the carriers and automation used to manufacture...
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MICRO: Archive: Back Issue TOC
carbide production into a silicon fab. Dry Surface Technologies: Using a tungsten plasma clean process to reduce metal shorts caused by CMP microscratches. Critical Materials: Understanding the new SEMI standards for stainless-steel welding applications. Green Manufacturing : Achieving closed-loop...
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
operates down to 0.4-V. Foundry to offer FRAM as standard offering. Headlines for Tuesday, December 6, 2011. Business. Former Intersil exec takes helm at Exar. Report: McAfee cuts jobs. Broadcom slips into top 5 in smartphone CPUs. Fab tool spending projected to decline in 2012. Technology. Video...
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MICRO: 2001 Back Issues
; Teamasia to build fab in Hyderabad Ion Systems moves Euro HQ; Eindhoven University receives software from Philips, Wright Williams & Kelly Semicon China, Semiconductor Safety Association conference, and more TSMC delivers first wafers; Dainippon builds tool plant SID adds two chapters; Delta...