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Supplier: Epoxy TechnologyDescription: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.
- Chemical / Polymer System Type: Epoxy
- Resins & Compounds: Liquid
- Compound Type: Casting Resin
- Features: Biocompatible, Optical Grade
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Supplier: Teledyne InstrumentsDescription: With superior low-level detection, Phoenix 8000 is perfect for applications requiring high sensitivity such as drinking, pharmaceutical grade, Clean-in-Place, Water-for-Injection, ground, surface, semiconductor grade, steam power and ultra-pure water.
- Analysis Method: UV Persulfate Oxidation
- Analytes Measured: Total Organic Carbon
- Sample Introduction: Other
- Local Interface: Digital Front Panel
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Supplier: Dow Water & Process SolutionsDescription: AMBERLITE™ UP900 resin is a semiconductor grade strongly basic anion exchanger. Due to the very high quality of the raw materials and the cleaning procedure carried out at the end of the manufacturing process, this resin can be used as a component of mixed beds for the production
- Base Fluid: Water
- Filter Media Material: Ion Exchange Resin
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Supplier: Hubbard-Hall, Inc.Description: Partnering with the leading suppliers of high purity advanced materials, Hubbard-Hall distributes the broadest line of semiconductor grade wet process chemicals in the Northeast. Purities range from standard Class 10 (SEMI) to parts-per-trillion (PPT) level Product range includes acids
- Halogenated: All Halogenated
- Type: Acid
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Supplier: Terra Universal, Inc.Description: Continuously filters process chemistry to increase purity and maximize product yield Reduced acid consumption generally pays for bath in three months Select semiconductor-grade natural polypropylene or PVDF seamless process tank 360° serrated overflow weir enhances particulate removal
- Configuration: Controlled Bath
- Temperature Control: Heating, Cooling
- Local Interface: Analog Front Panel
- Programmable: Yes
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Supplier: Enviro-AnalyticalDescription: /full-flow or side-stream operation Units of measurement g/m3, g/Nm3, %w/w, %v/v, ppmv Built-in ozone destruct capability Pressure, temperature, and molecular weight compensation Microprocessor-based electronics Analog and digital outputs Semiconductor-grade wetted materials for high purity
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Plastic Plate, Rod, and Stock Shapes - Semi-Conductor Grade Plastic -- Semi-Conductor Redco™ PlasticSupplier: Redwood PlasticsDescription: Semi-conductor charges & conductivity can easily be buffered and insulated with Redco™ PTFE (Teflon®), Redco™ PVC, Redco™ Polypropylene and Redco™ Phenolic. We will work with you to ensure the material is up to specification for applications where conductivity
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Description: was recently expanded to include ultra high purity (UHP) grades for applications requiring low metal and anion extractables and low outgassing.
- Material Form: Extrusion Grade Resin, Molding Resin
- Electrical / Electronics Applications: Semiconductors / IC Packaging
- Industry Applications: OEM / Industrial
- Polymer / Chemical Type: Fluoropolymer (PTFE / PVDF), Specialty / Other
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Supplier: AltafloDescription: ALTAFLUOR 480® Tubing & Pipe ALTAFLUOR 480 UHP PFA (ultra high purity perfluoroalkoxy) tubing and pipe are the products of choice for applications such as semiconductor and pharmaceutical process that require extreme chemical resistance while maintaining highest purity levels. Although HP
- Material: Fluoropolymers (PFA, FEP, ETFE, etc.), Other
- Standard Nominal English Sizes: 1/4"
- Pipe Schedule (if applicable): 40
- Section Shape: Round
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Supplier: Parker Hannifin ChinaDescription: Parofluor® O-rings in perfluoro rubber (FFKM). Resistant to nearly all chemicals at temperatures from 30 to +310 °C. Special grades for food applications and semiconductor manufacturing are available. See dedicated brochure and compatibility table. For further information, please contact
- Hardness Rating (Shore A Scale): 75 durometer
Featured Products for Semiconductor Grade Top
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process has been designed to deposit ultra-clean, semiconductor grade metals and dielectric films. The process includes an in-situ RF etch (also known as sputter etch) which ensures good film adhesion and Ohmic contact to underlying conductive layers. Rogue Valley Microdevices can also provide the conductive layers and metal adhesion and/or metal barrier layers. Our facility has Photolithography, Metal Lift-Off, Plasma Etch, and PECVD Films as some of the several process capabilities to design... (read more)Browse MEMS Foundry Datasheets for Rogue Valley Microdevices, Inc. -
Our PECVD Nitride can be a great alternative to LPCVD Nitride when it becomes important to stay within lower temperature ranges. Widely used in MEMS and Semiconductor processing, PECVD nitride is a tensile stress film that can be used as a passivation layer, or to help balance film stress within a stack. Using PECVD Nitride in addition to PECVD Oxide will help to reduce overall film stress, preventing delaminating and micro-cracking. This is a Semiconductor Grade Single Side Deposition Film... (read more)Browse Thin Film Coating Services Datasheets for Rogue Valley Microdevices, Inc.
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for wafers that require metal lift-off processing. Rogue Valley Microdevices has the ability to provide the complete device fabrication for our customers. All films are processed in a class 100 cleanroom and we use only high grade ultra-clean semiconductor grade metals. Rogue Valley Microdevices can provide the starting wafer substrates, Dielectric Films, Nitride Films, Photolithography, Metal Films, Resist, Exposure, Metal Lift-Off, and Etch. Here is a current list of Sputtered Films and Evaporated... (read more)Browse Semiconductor Foundry Services Datasheets for Rogue Valley Microdevices, Inc.
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We understand the importance of a clean process and all films are processed in a class 100 cleanroom. Our Sputter process has been designed to deposit ultra-clean, semiconductor grade metals and dielectric films. The process includes an in-situ RF etch (also known as sputter etch) which ensures good film adhesion and Ohmic contact to underlying conductive layers. Rogue Valley Microdevices can also provide the conductive layers and metal adhesion and/or metal barrier layers. Our facility has... (read more)Browse Semiconductor Foundry Services Datasheets for Rogue Valley Microdevices, Inc.
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stability. Lowest permeation (even with aggressive chemicals such as HCL). Smoothest surface finish resulting in less area of particle entrapment. Translucent. Moisture absorption nearly zero. FDA compliant for food contact. Non-flammable. Suitable for use with flare or conventional fittings. Also available in coiled hose and convoluted constructions. Applications: Semiconductor. Chemical process. Heat exchangers. Laboratory applications. Flow monitoring. Pharmaceutical. Specifications: General... (read more)Browse Tubing Datasheets for Altaflo
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New High Quality, Low Cost Underfill Encapsulant Developed for Semiconductor Packaging and Assembly Industries. LORD ME-555 underfill encapsulant is a high purity, semiconductor grade epoxy underfill material for the encapsulation of flip chip devices. Developed to meet technical requirements of customers, LORD has been able to present this material with a significant cost reduction compared to competitive underfill materials. LORD Corporation has announced a new, low cost underfill encapsulant... (read more)Browse Epoxy Adhesives Datasheets for LORD Corporation
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Small, Medium, Large and Extra Large. Quantity per pack: 5 gross (720). Natural in color. Cleanroom class: 100. Stand-up pouch for easy product identification. Packaged in gas-impermeable film flushed with semiconductor grade N2. Packed for ISO 5 (Class 100) applications. Eliminates contamination risk from silicone oils, skin salts, particulates and plasticizers. Compliant with ASTM abd IEST-RP-CC 005.3 standards... (read more)Browse Cleanroom Supplies and Accessories Datasheets for All-Spec Industries
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Our PECVD Nitride can be a great alternative to LPCVD Nitride when it becomes important to stay within lower temperature ranges. Widely used in MEMS and Semiconductor processing, PECVD nitride is a tensile stress film that can be used as a passivation layer, or to help balance film stress within a stack. Using PECVD Nitride in addition to PECVD Oxide will help to reduce overall film stress, preventing delaminating and micro-cracking. This is a Semiconductor Grade Single Side Deposition Film... (read more)Browse Thin Film Coating Services Datasheets for Rogue Valley Microdevices, Inc.
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for wafers that require metal lift-off processing. All films are processed in a class 100 cleanroom and our process has been designed to deposit ultra-clean using semiconductor grade metals. Rogue Valley Microdevices can process standard blanket metal film stack or custom patterns with metal film stacks to customer requirements. We can provide the starting wafer substrate and any conductive/dielectric layers that may be required. Here is a current list of metals available for E-Beam Evaporation... (read more)Browse Thin Film Coating Services Datasheets for Rogue Valley Microdevices, Inc.
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for wafers that require metal lift-off processing. Rogue Valley Microdevices has the ability to provide the complete device fabrication for our customers. All films are processed in a class 100 clean room and we use only high grade ultra-clean semiconductor grade metals. Rogue Valley Microdevices can provide the starting wafer substrates, Dielectric Films, Nitride Films, Photolithography, Metal Films, Resist, Exposure, Metal Lift-Off, and Etch. Here is a current list of Sputtered Films and Evaporated... (read more)Browse MEMS Foundry Datasheets for Rogue Valley Microdevices, Inc.
Parts by Number for Semiconductor Grade Top
| Partb # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 1/4TNGCARBC1 | ASAP Semiconductor | GRADE | Not Provided | NEW/STOCK |
| AIRCRAFT-GRADE | ASAP Semiconductor | CESSNA AIRCRAFT | Not Provided | Not Provided |
| LQ104V1DG11-B-Grade | ASAP Semiconductor | SHARP MICROELECTRONICS | Not Provided | Not Provided |
| 2200MF 400V COMP GRADE | ASAP Semiconductor | MEPCO | Not Provided | Not Provided |
| 1000MF 450VDC COMP GRADE | ASAP Semiconductor | PHILIPS | Not Provided | Not Provided |
Conduct Research Top
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Characterizing organic impurities in semiconductor-grade hydrogen peroxide
As the semiconductor industry moves toward the 256-Mb chip generation with 0.15-um feature sizes on 300-mm wafers, wet chemical cleaning remains essential to the removal of particles and metallic and organic impurities from the wafer surface. Since semiconductor-grade hydrogen peroxide
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Stainless Steel for Semiconductor Applications (.pdf)
. Please note that these are. proposed chemistries, as the understanding of this in-. Semiconductor gas delivery components and. dustry about the effects of these limits is still evolving. tubing are typically electropolished and passivated. SEMI I grade is meant for use in bulk gas delivery sys
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Benchmark Water Use Against Semiconductor Industry
sanitizations, continuous operation of RO/CEDI units, no processing of water in distribution, sanitary design, etc. The semiconductor industry uses none of these approaches, for sound technical and economic reasons, yet produces water with far higher. Benchmark Water Use Against Semiconductor Industry. Digital
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Powering the Future: Induction Technologies to Reduce the Cost of Solar-Grade Silicon (.pdf)
The earlier generation of furnaces and silicon processing techniques, designed for small volume semiconductor devices, cannot satisfy the growing demand for solar grade silicon. The semiconductor furnace industry is trying to scale up equipment, but the resistive radiant heating elements
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Micro: Implementing enhanced ICP-MS technology to attain SEMI Grade 5 purity levels
into the ) as a Grade 4 specification. is widely used in semiconductor manufacturing, a next-generation (Grade 5) purity level of 10 ppt for 21 elements has already been proposed. Traditionally, inductively coupled plasma mass spectrometry (ICP-MS) has been the technique of choice for ultralow
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MICRO:July/August 98:Industry News:Order Desk
VG Elemental has received orders from two South Korean companies for its Axiom high-resolution ICP-MS. Samsung is one of the companies purchasing the analysis system. Dongwoo Pure Chemicals, a manufacturer of semiconductor-grade acids, also has ordered an Axiom. In contrast to conventional
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Instrument Grade Chassis for Vibration Test Equipment
Vibration Test equipment for semiconductor, automotive and aerospace industries. Their product is currently housed in Industrial Grade PCs which they integrate themselves. They currently purchase the chassis from an off-shore company. Their major problem is product differentiation: their product looks
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MICRO: Products Extra!
has come up with a new method to determine trace-metal contaminants in semiconductor-grade phosphoric acid. Employing the high detection capability of the company's Model 7500cs reaction cell ICP-MS, the method can determine parts-per-trillion-level impurities for all SEMI-specified elements. Users
Engineering Web Search: Semiconductor Grade Top
- Silicon - Wikipedia, the free encyclopedia
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Semiconductor device - Wikipedia, the free encyclopedia
For information on semiconductor physics, see semiconductor.
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Semiconductor Manufacturing - Main Index
Electronic Grade Silicon, Semiconductor Crystal Structure, Crystal Structure Applets and Viewer, Dislocations, Point Defects, Semiconductor Wafers,
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National Semiconductor Introduces Industry's Lowest-Power,...
Media Contact Mark Alden National Semiconductor (408) 721-6929 mark.alden@nsc.com
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National Semiconductor Introduces Precision Voltage Reference...
Media Contact Megan Carter National Semiconductor (408) 721-6929 megan.carter@nsc.com
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Recent News Semiconductor : Fujitsu Europe, Middle East and...
Semiconductor 15 December 2011 Germany
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Fujitsu Semiconductor America : Fujitsu United States
Fujitsu Semiconductor America News Press Releases
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Cognex Programmable Vision | Semiconductor Software
Semiconductor Software Semiconductor Software
