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Semiconductor Laminate

 

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RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
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Parts by Number for Semiconductor Laminate Top

Partb # Distributor Manufacturer Product Category Description
A421-064142-02 ASAP Semiconductor GuardianEl Not Provided AC LAMINATE SOLENOID
V-80 ASAP Semiconductor BIC AMERICA Not Provided Cable - 100W (RMS) - Black Laminate
173303 ASAP Semiconductor ADVANCE TAPES Not Provided TAPE, POLYCLOTH, LAMINATE, BLACK; Tape Type:Sealing; Material:Po
S100X150VAC ASAP Semiconductor PANDUIT Not Provided PANDUIT - S100X150VAC - Self-Laminating Cable ID Label Cassette
PDL-2G ASAP Semiconductor PANDUIT Not Provided SELF LAMINATING DOT MATRIX LABEL VINYL GREEN/WHITE
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Conduct Research Top

  • Industry Reference: Semiconductor and Wafer Production
    Etched foil element heaters to heat acid in portable wafer processing baths, High Temperature Binder Inorganic and Organic coatings and with fabrication materials such as fiberglass cloth, fiberglass mat, mica, and ceramic fiber insulating carriers, etc... Thermal Circuits -Semiconductor etched
  • More metal parts go to composites
    compounds -- and employ a variety of fiber reinforcement singularly or in combination. An ultrahigh modulus carbon-fiber and epoxy combination, CP-9800, is a lightweight laminate used for robotic end effectors that handle semiconductor wafers during processing. "The laminate provides a highly rigid
  • Large Thin Organic PTFE Substrates for Multichip Applications
    capable of based laminate was originally designed to utilize optimized. interconnecting one or a few ASIC semiconductor devices laminate properties for overall system performance and. with packaged memory devices. The electrical advantages extreme reliability ­ for a single die [1-6]. It is available
  • MICRO:April 98:Movin' On
    since 1979, and most recently has overseen the laminates business in Asia. . . . Dexter Electronic Materials has appointed L. Walter Guy vp and gm of Asian operations. He joins Dexter from Motorola's semiconductor business unit, where he was director of Asian manufacturing strategy. . . . Eaton's
  • MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
    Reliability for a Laminate CSP Akito Yoshida, Toshiba; and Curtis Hart, XeTel Reliability Performance and Failure Mode of High I/O Thermally Enhanced Ball Grid Array Packages R. J. Coyle, T. I. Ejim, and A. Holliday, Lucent Technologies Bell Laboratories Semiconductor Processing II Chairs: Dave Kayton
  • Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
    manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader. This design works very well, but is highly dependent on the ability of the thermal interface material (TIM) to transfer
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    semiconductor materials covered in report series U.S. government to press China on chip value-added tax Laminates to lead growth says packaging materials report Teradyne blasts U.S. export controls for ATE in China Camera phones in steep growth curve, says study MEMS audio to
  • MICRO:Semicon Southwest p.2 (Oct '99)
    Laminate Circuit Process Toshio Yamazaki, Kazuhisa Suzuki, Yoshiaki Wakashima, Naoya Suzuki, and Naoki Fukutomi, Hitachi Chemical The Effect of Au Plating Thickness of BGA Substrates on Ball Shear Strength under Reliability Tests S. C. Hung, P. J. Zheng, S. C. Lee, and J. J. Lee, Advanced Semiconductor

Engineering Web Search: Semiconductor Laminate Top