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Supplier: Zygo Corporation
Description: Simultaneously measures multiple parameters
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-line, Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, CVD / PVD Films, Electroplated Films, Etching - Plasma / Wet, Photolithography / Patterning, Polishing / CMP, Other
- Measurement Capability: Critical Dimension / Trench Geometry, Roughness / Waviness, Thickness - Film / Layer, Other
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Supplier: Park Systems, Inc.
Description: Atomic Force Microscopy (AFM) is emerging as an essential tool in many industries. With its ability to accurately measure critical dimensions in the micrometer to nanometer regime, the AFM is becoming an essential tool choice in applications involving surface roughness, trench width, depth, sidewall
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
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Supplier: Unitron Ltd.
Description: Modular microscope system that readily adapts to instrumentation
- Form Factor: Other
- Mounting / Loading: In-situ / System Mounted
- Applications: Semiconductor Wafers
- Technology: Optical / Imaging System
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Supplier: ULVAC Technologies, Inc.
Description: High resolution, long life span, flexible deposition program
- Form Factor: Monitor / Instrument, Controller
- Mounting / Loading: In-situ / System Mounted
- Applications: Semiconductor Wafers, CVD / PVD Films, Flat Panel Displays, Optical Components
- Measurement Capability: Deposition Rate, Endpoint Detection / Plasma Diagnostics, Thickness - Film / Layer
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Supplier: Cascade Microtech, Inc.
Description: Features high-temperature ceramic low-noise probes
- Form Factor: Wafer Probing System
- Mounting / Loading: Manual Loading
- Applications: Semiconductor Wafers
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: WDI Wise Device Inc.
Description: WDI's Laser Auto-Focus ATF6 sensor is an active optical device (incorporating a class II semiconductor laser) designed to provide focusing servo systems with fast feedback signals needed to quickly and accurately focus all types of infinity corrected microscopes.
- Form Factor: Sensor / Sensing Element
- Applications: Semiconductor Wafers, CVD / PVD Films, Photolithography / Patterning
- Technology: Optical / Imaging System
- Non-contact: Yes
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Supplier: MicroSense, LLC
Description: of the magnetic properties of entire wafers up to 300 mm. The system is available in a manual loading or fully-automated configuration for use in R&D and/or production. Using the proprietary direct field control technique of MicroSense magnetic metrology tools, the Polar Kerr for MRAM system offers high
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Magnetic Properties (Coercivity / Shift)
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Supplier: Olympus America Inc.
Description: The Olympus MX51 industrial inspection microscope is optimized for the inspection requirements of a variety of electronic components including semiconductor wafer inspection. Its compact size, ease of operation, 6"x6" stage travel and cost effectiveness make the MX51 an ideal inspection microscope
- Form Factor: Monitor / Instrument
- Mounting / Loading: Autoloading / In-line, Manual Loading
- Applications: Semiconductor Wafers
- Measurement Capability: Defects / ADC, Particle Contamination
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Supplier: Bruker Nano Surfaces Division
Description: The ContourGT-X8 PSS provides highly repeatable, high-throughput, precision surface metrology of high-brightness light-emitting diode (HB-LED) patterned sapphire substrates (PSS). Based on the flagship ContourGT™ X8, this special configuration combines advanced non-contact 3D measurement
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, Other
- Measurement Capability: Roughness / Waviness
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Supplier: Martek Automation
Description: The IC3000 Work/Inspection Station is a flexible modular work station that can be used for multiple purposes. The on-board conveyor accepts product from upstream systems or from Martek Automation’s 1110U Magazine Un-loader and positions them at the work station for assembly, rework, or
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Supplier: Precitec, Inc.
Description: 5 Channel Optical Sensor: Contactless measurement of wafers and solar cells. The new CHRocodile MI5 is the modular 5 channel version of the already well established CHRocodile IT sensor. It performs high-precision, non-contact distance and layer thickness measurements on wafers and solar cells at
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Supplier: NanoAndMore USA Corp.
Description: The new NanoAndMore Tuning Fork Sensor Controller is an electronic device to control the self-oscillation of a quartz tuning fork based sensor and to measure its frequency. The new NanoAndMore Tuning Fork Sensor Controller offers our customers the convenience of a ready to use electronic device to
- Form Factor: Controller
- Mounting / Loading: Manual Loading
- Applications: Semiconductor Wafers
- Measurement Capability: Critical Dimension / Trench Geometry, Roughness / Waviness, Shape / Flatness
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Supplier: TELOPS, Inc.
Description: The laser diode bar tester picks up each laser diode bar from the tape and measures LIV, wavelength and FFP characteristics for each die.
- Form Factor: Monitor / Instrument, Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Packaged ICs / Ceramic Substrates, Other
- Measurement Capability: Electrical Test - Parametric / In-line, Electrical Test - Wafer Sort / Functional, Other
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Supplier: Hitachi High Technologies America, Inc.
Description: The HITACHI NB5000 FIB-SEM integrates a superior 40kV Ga ion FIB column with an ultra-high-resolution Schottky FE-SEM. The HITACHI NB5000 FIB-SEM integrates a superior 40kV Ga ion FIB column with an ultra-high-resolution Schottky FE-SEM. Like all our products, all components have been designed
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, CVD / PVD Films
- Measurement Capability: Critical Dimension / Trench Geometry, Shape / Flatness, Thickness - Film / Layer
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Supplier: Nikon Metrology, Inc.
Description: Built to accept the latest technology in wafer transport, and incorporating its own integrated ULPA filtration system, the Optistation-7 easily exceeds new fab automation requirements. Nikon semiconductor inspection stations are designed to provide ultra-high precision and throughput
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Defects / ADC, Particle Contamination
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Supplier: Corning Specialty Materials
Description: Specifically designed for the photomask industry
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, Optical Components
- Measurement Capability: Roughness / Waviness
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Supplier: Xenemetrix Ltd.
Description: X-Calibur SDD Bench Top EDXRF Spectrometer versatile, high energy resolution Our X-Calibur SDD EDXRF spectrometer features similar configuration like X-Calibur but with Silicon Drift Detector. Thanks to SDD high count rates the instrument improves its response time thus minimizing down time.
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone, Manual Loading
- Applications: Semiconductor Wafers, CVD / PVD Films, Electroplated Films
- Measurement Capability: Composition
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Supplier: StellarNet, Inc.
Description: as anti-reflection coatings can all be measures with StellarNet Thin Film Measurement systems. Semiconductors StellarNet systems can measure thickness of non-metallic semiconductor process films. Also, StellarNet Thin Film Measurement systems can be used to locate and identify the cause of failure
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
- Applications: Semiconductor Wafers, CVD / PVD Films, Data Storage / Memory, Flat Panel Displays, Optical Components , Polishing / CMP, Polymers / Photoresists, Other
- Measurement Capability: Thickness - Film / Layer, Thickness - Wafer / Disc (TTV)
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Supplier: CeramTec North America
Description: CeramTec North America pioneered the science of ceramic-to-metal sealing more than 53 years ago and today remains the world leader in ceramic-to-metal sealing technology. Hermetically sealed electrical & optical components include feedthroughs, multipin connectors, coaxial connectors,
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Supplier: Filmetrics, Inc.
Description: Turn Your Microscope into a Film Thickness Measurement Tool The F40 product family is for applications that require a spot size as small as 1 micron. For most microscopes the F40 simply attaches to the c-mount adapter, which is the industry standard for video camera mounting. The F40 comes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
- Applications: Semiconductor Wafers, CVD / PVD Films
- Measurement Capability: Optical Constants (n, k)
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Supplier: MTI Instruments Inc.
Description: The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built
- Form Factor: Wafer Probing System, Sensor / Sensing Element
- Mounting / Loading: Manual Loading
- Applications: Semiconductor Wafers
- Measurement Capability: Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
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Supplier: KLA-Tencor Corporation
Description: 282x Series: Provides high sensitivity at high production throughputs for ≤32nm logic and memory devices.
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Photolithography / Patterning
- Measurement Capability: Defects / ADC
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Supplier: Hiden Analytical
Description: Low power, high brightness, surface ionisation source coupled to a compact ion column, providing high performance in a small package.
- Form Factor: Other
- Applications: Semiconductor Wafers, CVD / PVD Films
- Measurement Capability: Defects / ADC
- Area Mapping: Yes
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Supplier: KLA-Tencor Corporation
Description: The HRP-350 is an automated, advanced surface topography metrology tool, featuring high resolution/high-aspect ratio, stylus-based surface profiling for leading edge 300mm applications. This surface profile measurement tool's ultra-fine 20nm stylus tip option enables down to 45nm-generation
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Roughness / Waviness
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Supplier: JEOL USA, Inc.
Description: Has a focused ion beam (FIB) milling system, automated wafer metrology
- Application: Semiconductor Inspection
- Grade: Research
- Microscope Type: Scanning Electron Microscope (SEM)
- Computer Interface: Yes
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Supplier: CoorsTek
Description: Structural Ceramic for Metrology and Machine Components CoorsTek offers a full line of air-bearing guideways and structural precision components. A high specific stiffness and excellent thermal stability make our ceramic beams and stage components ideal for coordinate measurement machines
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Featured Products for Semiconductor Metrology Top
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MTI Instruments Inc.
Semiconductor Wafer Thickness Gage
The ProformaTM 300 Advantage... One Package for ALL Wafer Sizes and Materials. Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including: · Silicon. · Gallium-Arsenide. · Indium Phosphide. · Germanium. ... without recalibrating or electrically grounding the wafer!. Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV). Portable and Easy to Set... (read more)
Browse Semiconductor Metrology Instruments Datasheets for MTI Instruments Inc. -
MAZeT GmbH
MAZeT solutions for communication interfaces
Industrial Metrology. MAZeT offers customer-specific solutions for communication interfaces of the automation engineering industries. . The master component series for the EnDat2.2 is MAZeT ‘s IP solution utilized as interface between absolute value encoders from HEIDENHAIN and subsequent electronics. Aside the EnDat2.2, other encoders with EnDat2.1 or SSI interfaces are supported. The extensive options of the EnDat master IP series allow an effective layout of the control tasks... (read more)
Browse Semiconductor Metrology Instruments Datasheets for MAZeT GmbH -
MicroSense, LLC
Polar Kerr System for Perpendicular MRAM
field control technique of MicroSense magnetic metrology tools, the Polar Kerr for MRAM system offers high field capabilities and low field resolution to characterize free and pinned layer properties in a single system. Benefits. • Non-contact mapping of the magnetic properties of perpendicular MRAM wafers up to 300mm. • Maximum field of ± 2.5 T for full stack measurements, field resolution of 0.05 Oe for free layer measurements in a single system. • Measurement of patterned... (read more)
Browse Semiconductor Metrology Instruments Datasheets for MicroSense, LLC -
Precitec, Inc.
CHRocodile IT Keeps an Eye on Wafer Thickness
nbsp;The CHRocodile IT line of sensors from Precitec Optronik offers a highly accurate thickness measurement for infrared transparent materials. They are capable of non-contact scanning with a small spot size for use on all portions of the device. The background to this non-destructive measuring process is a sensor that works with interferometry, using infrared rather than white light. The advantage: One measuring point with very bright light allows measuring speeds up to five times faster... (read more)
Browse Semiconductor Metrology Instruments Datasheets for Precitec, Inc. -
MTI Instruments Inc.
Solar Wafer Thickness Tool from MTI
solutions, condition based monitoring systems, portable balancing equipment and semiconductor wafer inspection tools. MTI Instruments' products use a comprehensive array of technologies to solve complex real world applications in numerous industries including manufacturing, semiconductor, commercial/military aviation, automotive and data storage. Our products consist of electronic gaging instruments for position, displacement and vibration applications within the design, manufacturing... (read more)
Browse Semiconductor Metrology Instruments Datasheets for MTI Instruments Inc. -
Bruker Nano Surfaces Division
Metrology for Process Quality Control
operation and analysis software to automated staging and integrated vibration isolation. The ContourGT-X is simply the most robust metrology available for high-volume manufacturing of ophthalmic lenses, medical devices, high-brightness LEDs, semiconductor devices, precision machined parts, and much more. (read more)
Browse Specialty Microscopes Datasheets for Bruker Nano Surfaces Division -
Bruker Nano Surfaces Division
Unrivaled Non-Contact Surface Metrology
for advanced QA/QC and R &D precision machining and manufacturing applications within the automotive/aerospace, high-brightness LED, solar, semiconductor, and medical device markets, Bruker has a 3D optical solution that will fit your application and budget. (read more)
Browse Measuring Microscopes Datasheets for Bruker Nano Surfaces Division -
Precitec, Inc.
CHRocodile Sensors
materials. A wide range of optical probes allows topographic measurements from 10nm - 25mm and chromatic thickness measurements from 30 μm - 35mm. Interferometric mode enables measurement of transparent materials from 2 μm - 150 μm. The CHRocodile IT series and MI5 use infrared light with an advanced interferometric technique to measure the distance and thickness of semiconductor materials. With speeds up to 4kHz, it is possible to measure silicon wafers up to 1mm thick. APPLICATIONS... (read more)
Browse Surface Metrology Equipment Datasheets for Precitec, Inc. -
LOT Vacuum America
HD120 Dry Screw Vacuum Pump
Load Locks for General Vacuum, Transfer, Metrology, Semiconductor Manufacturing, Evaporative Chambers, and Implant. They feature Ethernet, RS485/232, VFD control and Optional N2 purging. (read more)
Browse Vacuum Pumps and Vacuum Generators Datasheets for LOT Vacuum America
Conduct Research Top
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Designing Safe, Low-cost Vacuum and Exhaust Gas Management Systems for Semiconductor Processes (.pdf)
Vacuum and exhaust gas management are critical components of semiconductor manufacturing. While these systems are usually hidden away out of sight-and out of mind-in the process tool or the sub fab, they are vital to efficient and safe manufacturing. Vacuum systems remove potentially hazardous
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MICRO: Ad hoc metrology
For Brad Van Eck and the other members of the Integrated Measurement Association (IMA), the benefits of incorporating metrology in semiconductor processes are beyond question. Their next steps are figuring out the most efficient methods, and then convincing the authors of the International
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Vantage Point: Mechatronics in semiconductor fab automation
Historically, the semiconductor industry has been driven by physics and chemistry. These are the disciplines that have led to perfecting manufacturing processes that, in turn, have brought remarkable advances in microelectronic technology. In semiconductor manufacturing, the focus has mainly been
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MICRO: Metrology Start-ups
to be a semiconductor equipment supplier, right? Some vendors plying their trade in metrology and advanced process control (APC) certainly hope so. Although it seems counterintuitive, it's a truism that when the industry's notorious roller-coaster business cycle heads for the dips, chipmakers actually
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MICRO: Integrated metrology beginning to measure up to expectations
Integrated metrology beginning to measure up to expectations Linewidths aren't the only things that are shrinking in the semiconductor industry. Put profit margins in that category, too, asserts Bob Johnson. The principal analyst for Gartner Dataquest says the reasons for this squeeze are fairly
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MICRO: Defect/Yield Analysis and Metrology - Collins (June 2000)
The need to improve yield and avoid process errors has been a part of semiconductor manufacturing since the first integrated circuit was made. According to Jack Kilby, a coinventor of the IC, in the early 1960s a respectable yield on a single transistor was 10 or 20%. Today, wafers containing
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Top technical challenges in semiconductor manufacturing
Immersion lithography, low-k materials, and metrology are on the list. Chip lithography and front-end fab processes weigh heavily in current research efforts, but also important is the conservation of energy consumption in manufacturing tools, and the growth of environmental regulations. So says
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MICRO:Analysis and Metrology (Jan '99)
and Kelly J. Taylor, David A. Rothenbury, Mark Chavis, Timothy Hoff, and Craig H. Huffman, Early detection of process gas contamination is critical to preventing misprocessing of semiconductor product wafers, which usually results in scrap. Waiting for catastrophic contamination to occur
Engineering Web Search: Semiconductor Metrology Top
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Semiconductor metrology products | Rigaku - X-ray analytical...
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Semiconductor and Dimensional Metrology Division
The Semiconductor and Dimensional Metrology Division (SDMD) provides leadership in conducting research in the areas of dimensional, nanometer-scale,
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Semiconductor device fabrication - Wikipedia, the free...
Semiconductor device fabrication From Wikipedia, the free encyclopedia (Redirected from Semiconductor fabrication)
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Used Semiconductor and Scientific Equipment for Science and...
Semiconductor Hybrid / Assembly Semiconductor Wafer Metrology
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Carl Zeiss SMT, Germany
Semiconductor Metrology Systems Laser Optics
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Carl Zeiss, Inc.
Semiconductor-/ Nanotechnology Industrial Metrology
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4Semi - Used and Surplus Semiconductor Equipment
Welcome to 4semi.com, your source for Used Semiconductor Equipment Find used semiconductor equipment in this live database of up-to-the-minute
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Compound Semiconductor IC Symposium Homepage
2013 IEEE Compound Semiconductor IC Symposium