Products & Services
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Supplier: KLA-Tencor Corporation
Description: The P-6 stylus profiler and surface analysis system offers a combination of advanced features for process development and manufacturing control of scientific research, photovoltaic solar manufacturing, data storage, MEMS, opto-electronics, and other industrial metrology applications. The P-6 stylus
- Surface Metrology: Surface Profilometry
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
- Technology: Contact / Stylus Based
- Industrial Applications: Coatings (Thin Films, Plating, etc.)
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Supplier: KLA-Tencor Corporation
Description: Archer XT+ is KLA-Tencor's latest generation advanced optical metrology solution for the > 45-nm node. Based on the widely adopted Archer platforms, the tool further reduces the measurement uncertainty (>50%) associated with traditional overlay metrology at shrinking design rules. Compared
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Photolithography / Patterning
- Measurement Capability: Defects / ADC
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Supplier: Bruker Nano Surfaces Division
Description: Get the highest performance device characterization and etch depth metrology available with the Dimension Atomic Force Profiler. It is the world's only AFM single-tool fab solution designed for chemical mechanical planarization and etch metrology at 65 nm. Features Combines the outstanding
- Technology: Other
- Surface Metrology: 3D / Areal Topography
- Industrial Applications: Semiconductor Manufacturing
- Mounting / Loading: Floor / Free Standing
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Supplier: Park Systems, Inc.
Description: in the market today. Providing the highest resolution and the lowest gauge sigma value for repeatability and reproducibility, the XE-WAFER is the perfect solution for the semiconductor and hard disk drive industries which, until now, had very limited choices for industrial grade in-line inspection tools
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
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Supplier: WDI Wise Device Inc.
Description: from infrared (1064 nm) to deep ultraviolet (266 nm). This innovation facilitates efficient trimming of metals, silicon and ITO as well as open line repair, within a single piece of repair equipment. The MIC4 is fully compatible with the ATF4, ATF5, and LLC6 linear lens changer products which
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: CVD / PVD Films, Electroplated Films, Packaged ICs / Ceramic Substrates, Photolithography / Patterning, Other
- Measurement Capability: Defects / ADC, Other
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Supplier: Xenemetrix Ltd.
Description: RoHS Vision The Fast and Easy Method for Ensuring Compliance with Regulations for Hazardous Substances The Restriction of Hazardous Substances Directive (RoHS) restricts toxic metals in electrical and electronic equipment. Xenemetrix’s new RoHS Vision uses a high resolution detector
- Form Factor: Monitor / Instrument
- Mounting / Loading: Floor Mounted / Stand-alone, Manual Loading
- Applications: Semiconductor Wafers, CVD / PVD Films, Electroplated Films
- Measurement Capability: Composition
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Supplier: Corning Specialty Materials
Description: Designed for volume wafer manufacturing
- Surface Metrology: Form Measurement
- Measurement Capability: 3D / Areal Topography, Flatness, Thickness, Warp / Bow
- Technology: Non-contact - Optical / Laser
- Industrial Applications: Automotive, Mechanical Parts (Bearings, Shafting), Optics / Photonics, Precision Machining / Grinding, Semiconductor Manufacturing
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Supplier: Bytewise Measurement Systems
Description: Use CrossCheck for faster startups and changeovers while reducing product scrap and rework. Easily diagnose root causes of product variation to improve dimensional quality and operator variability, enabling 100% product certification.
- Technology: Non-contact - Optical / Laser
- Surface Metrology: 2D / Line Profile, 3D / Areal Topography
- Measurement Capability: Flatness, Step Height, Thickness, Warp / Bow
- Common Specific Parameters: Average Peak Profile Height (Rpm), Maximum Valley Depth (RV), Peak Count (PC)
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Supplier: Zygo Corporation
Description: Fast 3D noncontact profilometer, automated high performance unit
- Surface Metrology: Form Measurement, Surface Profilometry
- Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Defects / ADC, Flatness, Hybrid Parameters, Lay / Pattern, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Spacing Parameters (PC, Sm), Step Height, Thickness, Waviness Parameters (Wa,Wt ), Warp / Bow,
- Standards Compliance: ASME, ISO / EN, DIN, JIS
- Technology: Non-contact - Optical / Laser
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Supplier: MTI Instruments Inc.
Description: The Microtrak™ 3 laser displacement sensor head is the ideal solution for quality and process control applications. Using the latest CMOS sensor technology, the Microtrak™ 3 precisely monitors the intensity of light received on a pixel array and optimizes itself to the sensed conditions.
- Technology: Non-contact - Optical / Laser
- Form Parameters: Flatness, Runout, Step Height, Thickness, Warp / Bow
- Industrial Applications: Aerospace / Defense, Automotive, Electronics, Mechanical Parts (Bearings, Shafting), Medical, MEMS, Nanomaterials, Optics / Photonics, Precision Machining / Grinding, Semiconductor Manufacturing
- Factory / Production Use: Yes
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Supplier: Inspec Inc.
Description: Inspec, Inc. uses a variety of measuring techniques and equipment to best provide you with real-time information of any deviation between subject parts and their design intent. Our services include 3D scanning / measurement, contact and non contact inspection, surface analysis and more to suit your
- Capabilities: Certification, Component / Product Comparison, Consulting / Training, Field Evaluation / On-site Inspection, First Article / Contract QA, In-process / In-line Testing, Proficiency Testing / Interlaboratory, Reverse Engineering / Digitization, Test Fixtures / Equipment, Specialty / Other
- Forms Tested / Certified: Capital Equipment, Components / Parts, Products, Samples or Materials, Services
- Services Offered: Alignment, CMM Inspection, Dimensional Gaging / Metrology, Engineering / Design Verification (DVT), Form / Geometry (Straightness, Roundness, etc.), NDT / Inspection, Surface Profilometry, Visual / Video Inspection, Specialty / Other
- Industry: Appliances, Aerospace / Avionics, Automotive, Battery / Energy Products, Building & Construction, Combustion Equipment, Consumer Products, Health Care / Medical, HVAC, Plumbing and Lighting, Industrial / Machinery, Instrument & Sensors / Laboratory, Materials, Motors and Control
Find Suppliers by Category Top
Semiconductor Metrology Instruments
(193 Companies)
Semiconductor Cluster Tools
(72 Companies)
Dimensional Measurement and Metrology Services
(227 Companies)
Semiconductor Equipment Repair Services
(43 Companies)
Featured Products for Semiconductor Metrology Equipment Top
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Precitec, Inc.
CHRocodile Sensors
materials. A wide range of optical probes allows topographic measurements from 10nm - 25mm and chromatic thickness measurements from 30 μm - 35mm. Interferometric mode enables measurement of transparent materials from 2 μm - 150 μm. The CHRocodile IT series and MI5 use infrared light with an advanced interferometric technique to measure the distance and thickness of semiconductor materials. With speeds up to 4kHz, it is possible to measure silicon wafers up to 1mm thick. APPLICATIONS... (read more)
Browse Surface Metrology Equipment Datasheets for Precitec, Inc. -
MTI Instruments Inc.
Solar Wafer Thickness Tool from MTI
solutions, condition based monitoring systems, portable balancing equipment and semiconductor wafer inspection tools. MTI Instruments' products use a comprehensive array of technologies to solve complex real world applications in numerous industries including manufacturing, semiconductor, commercial/military aviation, automotive and data storage. Our products consist of electronic gaging instruments for position, displacement and vibration applications within the design, manufacturing... (read more)
Browse Semiconductor Metrology Instruments Datasheets for MTI Instruments Inc. -
MTI Instruments Inc.
Semiconductor Wafer Thickness Gage
The ProformaTM 300 Advantage... One Package for ALL Wafer Sizes and Materials. Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including: · Silicon. · Gallium-Arsenide. · Indium Phosphide. · Germanium. ... without recalibrating or electrically grounding the wafer!. Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV). Portable and Easy to Set... (read more)
Browse Semiconductor Metrology Instruments Datasheets for MTI Instruments Inc. -
MAZeT GmbH
MAZeT solutions for communication interfaces
Industrial Metrology. MAZeT offers customer-specific solutions for communication interfaces of the automation engineering industries. . The master component series for the EnDat2.2 is MAZeT ‘s IP solution utilized as interface between absolute value encoders from HEIDENHAIN and subsequent electronics. Aside the EnDat2.2, other encoders with EnDat2.1 or SSI interfaces are supported. The extensive options of the EnDat master IP series allow an effective layout of the control tasks... (read more)
Browse Semiconductor Metrology Instruments Datasheets for MAZeT GmbH -
MicroSense, LLC
Polar Kerr System for Perpendicular MRAM
field control technique of MicroSense magnetic metrology tools, the Polar Kerr for MRAM system offers high field capabilities and low field resolution to characterize free and pinned layer properties in a single system. Benefits. • Non-contact mapping of the magnetic properties of perpendicular MRAM wafers up to 300mm. • Maximum field of ± 2.5 T for full stack measurements, field resolution of 0.05 Oe for free layer measurements in a single system. • Measurement of patterned... (read more)
Browse Semiconductor Metrology Instruments Datasheets for MicroSense, LLC -
Precitec, Inc.
CHRocodile IT Keeps an Eye on Wafer Thickness
nbsp;The CHRocodile IT line of sensors from Precitec Optronik offers a highly accurate thickness measurement for infrared transparent materials. They are capable of non-contact scanning with a small spot size for use on all portions of the device. The background to this non-destructive measuring process is a sensor that works with interferometry, using infrared rather than white light. The advantage: One measuring point with very bright light allows measuring speeds up to five times faster... (read more)
Browse Semiconductor Metrology Instruments Datasheets for Precitec, Inc. -
Leica Microsystems, Inc.
Macro to Micro - Defects don't stand a chance
Inspection, process control and defect analysis of wafers or LCDs and TFTs has to be fast, accurate and ergonomic. Leica Microsystems has many years of experience in developing inspection systems for the semiconductor industry. Using this expertise, we have developed a totally new line of products for the inspection of 8 and 12 inch wafers. New optical features offered by the Leica DM8000 M such as the optional macro mode or the oblique UV illumination (OUV, with i-line UV option) not only... (read more)
Browse Surface Metrology Equipment Datasheets for Leica Microsystems, Inc. -
PremaTech Advanced Ceramics
Semiconductor Components
in the global semiconductor manufacturing marketplace typically between 100-300mm wafer size, as well as sizes beyond. Materials processed: Alumina. Quartz. Silicon Carbide. Sapphire. Proprietary Silicon formulations. Naturally our ISO 9001 certification, quality policy, and state-of-the-art metrology equipment provide reliable and exacting measurements with complete material traceability capabilities. Please call 508.791.9549 upon us to review your prototype and production requirements. PremaTech... (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for PremaTech Advanced Ceramics -
Bruker Nano Surfaces Division
Unrivaled Non-Contact Surface Metrology
for advanced QA/QC and R &D precision machining and manufacturing applications within the automotive/aerospace, high-brightness LED, solar, semiconductor, and medical device markets, Bruker has a 3D optical solution that will fit your application and budget. (read more)
Browse Measuring Microscopes Datasheets for Bruker Nano Surfaces Division -
Bruker Nano Surfaces Division
Metrology for Process Quality Control
operation and analysis software to automated staging and integrated vibration isolation. The ContourGT-X is simply the most robust metrology available for high-volume manufacturing of ophthalmic lenses, medical devices, high-brightness LEDs, semiconductor devices, precision machined parts, and much more. (read more)
Browse Specialty Microscopes Datasheets for Bruker Nano Surfaces Division -
LOT Vacuum America
HD120 Dry Screw Vacuum Pump
Load Locks for General Vacuum, Transfer, Metrology, Semiconductor Manufacturing, Evaporative Chambers, and Implant. They feature Ethernet, RS485/232, VFD control and Optional N2 purging. (read more)
Browse Vacuum Pumps and Vacuum Generators Datasheets for LOT Vacuum America -
HEIDENHAIN Corporation
RSF’s Newest Small Profile Optical Encoder- MS 14
April 2013) – The new RSF MS 14 encoder system fulfills the need for a small package, high resolution encoder that has a repeatable optical reference mark, along with an easy visual display of signal quality. Available in North America through parent company HEIDENHAIN Corporation, this frictionless kit style encoder is perfect for motion feedback applications such as metrology, semiconductor, and medical markets where high resolution and small mechanical size... (read more)
Browse Linear Encoders Datasheets for HEIDENHAIN Corporation -
Metal Cutting Corporation
Metal Fabrication Services
Metal Cutting Corporation is an independent metal fabricating company, specializing in the burr-free abrasive cut-off of metal parts and the related capabilities required to meet their customer's tight tolerance requirements. They manufacture precision metal components for the medical device, automotive, electronic, biotechnology, semiconductor, aerospace, fiberoptic, electrical and general industries using abrasive cutting, grinding, lapping, polishing and related machining and metrology... (read more)
Browse Cutting Services Datasheets for Metal Cutting Corporation
Conduct Research Top
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Designing Safe, Low-cost Vacuum and Exhaust Gas Management Systems for Semiconductor Processes (.pdf)
Vacuum and exhaust gas management are critical components of semiconductor manufacturing. While these systems are usually hidden away out of sight-and out of mind-in the process tool or the sub fab, they are vital to efficient and safe manufacturing. Vacuum systems remove potentially hazardous
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MICRO: Ad hoc metrology
For Brad Van Eck and the other members of the Integrated Measurement Association (IMA), the benefits of incorporating metrology in semiconductor processes are beyond question. Their next steps are figuring out the most efficient methods, and then convincing the authors of the International
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Vantage Point: Mechatronics in semiconductor fab automation
Historically, the semiconductor industry has been driven by physics and chemistry. These are the disciplines that have led to perfecting manufacturing processes that, in turn, have brought remarkable advances in microelectronic technology. In semiconductor manufacturing, the focus has mainly been
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MICRO: Metrology Start-ups
to be a semiconductor equipment supplier, right? Some vendors plying their trade in metrology and advanced process control (APC) certainly hope so. Although it seems counterintuitive, it's a truism that when the industry's notorious roller-coaster business cycle heads for the dips, chipmakers actually
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MICRO: Integrated metrology beginning to measure up to expectations
Integrated metrology beginning to measure up to expectations Linewidths aren't the only things that are shrinking in the semiconductor industry. Put profit margins in that category, too, asserts Bob Johnson. The principal analyst for Gartner Dataquest says the reasons for this squeeze are fairly
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MICRO: Defect/Yield Analysis and Metrology - Collins (June 2000)
The need to improve yield and avoid process errors has been a part of semiconductor manufacturing since the first integrated circuit was made. According to Jack Kilby, a coinventor of the IC, in the early 1960s a respectable yield on a single transistor was 10 or 20%. Today, wafers containing
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Top technical challenges in semiconductor manufacturing
Immersion lithography, low-k materials, and metrology are on the list. Chip lithography and front-end fab processes weigh heavily in current research efforts, but also important is the conservation of energy consumption in manufacturing tools, and the growth of environmental regulations. So says
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MICRO:Analysis and Metrology (Jan '99)
and Kelly J. Taylor, David A. Rothenbury, Mark Chavis, Timothy Hoff, and Craig H. Huffman, Early detection of process gas contamination is critical to preventing misprocessing of semiconductor product wafers, which usually results in scrap. Waiting for catastrophic contamination to occur
Engineering Web Search: Semiconductor Metrology Equipment Top
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