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Semiconductor Metrology Instruments

 

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Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.  
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  • MICRO: Ad hoc metrology
    For Brad Van Eck and the other members of the Integrated Measurement Association (IMA), the benefits of incorporating metrology in semiconductor processes are beyond question. Their next steps are figuring out the most efficient methods, and then convincing the authors of the International
  • MICRO: Defect Analysis and Metrology - Ge (Feb 2000)
    Larry M. Ge, formerly of Digital Instruments, Veeco Metrology Group Digital Instruments, Veeco Metrology Group Driven by the critical need for product yield management and process control of deep submicron silicon device manufacturing, defect engineering has become increasingly important. Commonly
  • MICRO:Analysis and Metrology (Jan '99)
    and Kelly J. Taylor, David A. Rothenbury, Mark Chavis, Timothy Hoff, and Craig H. Huffman, Early detection of process gas contamination is critical to preventing misprocessing of semiconductor product wafers, which usually results in scrap. Waiting for catastrophic contamination to occur
  • Developing an exit charge specification for semiconductor production equipment
    and Julian A. Montoya, Static charge can cause several kinds of problems in semiconductor manufacturing, including process equipment malfunctions, damaged products, and contamination attraction to product surfaces. Simple calculations indicate that the costs of these problems run in the hundreds
  • MICRO:Analysis and Metrology-Yield Management, by David Guidry (Oct '99)
    Shawn Smith and David Guidry, Knights Technology, a division of Electroglas In the semiconductor industry, bitmapping has always been a key element in yield enhancement engineers' tool set for determining the root cause of low-yielding materials. Indeed, in the mid- to-late 1980s, memory bitmapping
  • MICRO:February 1998:Anaysis & Metrology Post-CMP; by Cheri Dennison, (p 31)
    manufacturing in place of the traditional local oxidation of silicon process, STI makes it possible to achieve the closer packing density necessary for 0.25-um logic processes. In this application, oxide is polished down to a nitride. MICRO:February 1998:Anaysis & Metrology Post-CMP; by Cheri Dennison, (p 31
  • MICRO:New Technologies-Analysis & Metrology, by Patrick J. McCann, p.93 (July '99)
    results in relatively low device operating temperatures. Three types of compound semiconductor materials are used to make mid-IR lasers: IV-VI materials (lead. MICRO:New Technologies-Analysis & Metrology, by Patrick J. McCann, p.93 (July '99). MICRO Advertiser and Product Information Buyers Guide
  • INDUSTRY NEWS
    A new reference material for calibrating the accuracy of metrology equipment is being evaluated by a 13-member consortium of semiconductor manufacturers and metrology tool vendors. Advanced Micro Devices, Benchmark Technologies, KLA Instruments, Lucent Technologies, Nanometrics, and Opal are among

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