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Semiconductor Metrology Monitor

 

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Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.  
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  • MICRO: Metrology Start-ups
    to be a semiconductor equipment supplier, right? Some vendors plying their trade in metrology and advanced process control (APC) certainly hope so. Although it seems counterintuitive, it's a truism that when the industry's notorious roller-coaster business cycle heads for the dips, chipmakers actually
  • MICRO: Integrated metrology beginning to measure up to expectations
    Integrated metrology beginning to measure up to expectations Linewidths aren't the only things that are shrinking in the semiconductor industry. Put profit margins in that category, too, asserts Bob Johnson. The principal analyst for Gartner Dataquest says the reasons for this squeeze are fairly
  • MICRO:Analysis and Metrology (Jan '99)
    in the semiconductor industry to have purity monitors along the bulk gas distribution system, it would make good sense to install PPAs on process tools for gas-purity sampling. Full-time PPA monitoring has the potential to decrease wet clean recovery times, to detect cross-chamber contamination in cluster tools when
  • MICRO: Defect/Yield Analysis and Metrology - Collins (June 2000)
    The need to improve yield and avoid process errors has been a part of semiconductor manufacturing since the first integrated circuit was made. According to Jack Kilby, a coinventor of the IC, in the early 1960s a respectable yield on a single transistor was 10 or 20%. Today, wafers containing
  • MICRO: Defect/Yield Analysis and Metrology
    commenced when it was discovered that memory devices were suffering from serious yield loss. As illustrated in the wafer-yield bin maps of good versus low-yield wafers in Figure 1, the devices at the wafer edge were primarily responsible. MICRO: Defect/Yield Analysis and Metrology. MICRO Advertiser
  • MICRO:Analysis & Metrology by Reinhold Ott p.48 (June '99)
    source parameters are evaluated and corrective action is taken. Besides being time-consuming, this approach does not guarantee that defect samples will represent the entire population. This article describes the implementation at White Oak Semiconductor (Richmond, VA) of a wafer inspection system
  • Designing Safe, Low-cost Vacuum and Exhaust Gas Management Systems for Semiconductor Processes (.pdf)
    Vacuum and exhaust gas management are critical components of semiconductor manufacturing. While these systems are usually hidden away out of sight-and out of mind-in the process tool or the sub fab, they are vital to efficient and safe manufacturing. Vacuum systems remove potentially hazardous
  • MICRO:New Technologies-Analysis & Metrology, by Patrick J. McCann, p.93 (July '99)
    results in relatively low device operating temperatures. Three types of compound semiconductor materials are used to make mid-IR lasers: IV-VI materials (lead. MICRO:New Technologies-Analysis & Metrology, by Patrick J. McCann, p.93 (July '99). MICRO Advertiser and Product Information Buyers Guide

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