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Semiconductor Molding Compound
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Supplier: PolyOne CorporationDescription: Heat transfer and cooling capabilities of metal
- Material Type / Grade: Composite Material, Thermoplastic
- Chemical / Polymer System Type: Polyamide / Nylon
- Features: Thermally Conductive
- Industry: Electronics, Electric Power, Semiconductor / IC's
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Description: in a variety of markets and applications such as automotive (low-permeation fuel systems), chemical processing industry, semiconductor manufacturing, solar energy, polymer optical fiber and architectural and protective coatings. Product Features Exceptional optical clarity and light
- Material Type / Grade: Thermoplastic
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF), Specialty / Other
- Filler Material: Unfilled, Carbon / Graphite
- Pellets: Yes
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Supplier: Victrex plc.Description: High performance thermoplastic material, unreinforced PolyEtherKetone (PEK), semi crystalline, coarse powder for extrusion compounding, easy flow, FDA food contact compliant, colour natural.
- Material Type / Grade: Thermoplastic
- Chemical / Polymer System Type: PEEK
- Filler Material: Unfilled
- Pellets: Yes
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Supplier: Henkel Corporation - ElectronicsDescription: Low water absorption, low stress, and high physical strength
- Material Type / Grade: Thermoset
- Industry: Electronics
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Supplier: PANJIT SemiConductorDescription: Schottky Barrier Rectifiers feature a plastic package with UL Flammability Classification 94V-O utilizing flame retardant Epoxy Molding Compound and are in compliance with EU RoHS 2002/95/EC directives. They exceed environmental standards of MIL-S-19500/288 and are for use in low voltage, high
- Rectifier Configuration / Technology: Schottky
- Package Type: DO-41
- Life Cycle Stage: Maturity
- RoHS Compliant: Yes
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Supplier: Victrex plc.Description: High performance thermoplastic material, unreinforced PolyEtherEtherKetone (PEEK), semi crystalline, fine powder for composite manufacture, easy flow, FDA food contact compliant, colour natural.
- Material Type / Grade: Thermoplastic
- Chemical / Polymer System Type: PEEK
- Filler Material: Unfilled
- Compound Type: Extrusion Grade Resin, Molding Resin
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Description: 3M™ PFA (a polymer of tetrafluoroethylene and perfluorovinylether) has exceptional heat resistance, excellent electrical properties and excellent chemical and weather resistance. It is also used in several chemical industry and home appliance coatings applications. This product line was
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF), Specialty / Other
- Filler Material: Unfilled
- Resins & Compounds: Pellets
- Compound Type: Extrusion Grade Resin, Molding Resin
Featured Products for Semiconductor Molding Compound Top
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Simrit Introduces New Fluorocarbon Compounds for Demanding Semiconductor Sealing. VO628 and VO793 materials offer extremely high-purity with ultra-low metal ion impurities. As the fast-paced semiconductor industry continually develops the latest microelectronics innovations, smaller components - such as seals - are an often overlooked, but extremely critical, part of the process. To help its customers create the latest industry advancements, Simrit is debuting two new fluorocarbon (FKM... (read more)Browse Elastomer and Rubber Shapes Datasheets for Simrit -
Plastics Color Corporation (PCC), headquartered in Calumet City, Illinois, is a global provider of custom polymer compounds, solutions, colorants, and additive masterbatches in an extensive range of markets; from pharmaceuticals packaging to medical devices to consumer packaging to sporting goods and many more. (read more)Browse Molding Compounds and Resins Datasheets for Plastics Color Corporation
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EZ-Cast ™ 580N is a high temperature, flexible, high-tear-strength silicone-rubber molding compound ideal for producing high reliability master molds for casting ceramic fixtures. Material properties include a maximum temperature resistance of 400 °F (204 °C), Shore "A" Durometer of 40, tensile shear strength of 700 psi minimum, and tear strength of 110 minimum lb/in. EZ-Cast ™ 580N is supplied as a two-part system that mixes in a ratio of 10 lbs. resin to 1 lb. catalyst. It sets... (read more)Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Aremco Products, Inc.
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Compression Molding. Composite Compression Molding produces high quality cost competitive parts for all volume ranges. Parts produced from sheet molding compound (SMC) or bulk molding compound (BMC) have a high strength-to-weight ratio with low shrink rates. Furthermore, matching colors and textures can be molded in to eliminate the need for secondary finishing. Other advantages include reduced waste, the ability to mold-in inserts and structural reinforcements; and the ability to execute... (read more)Browse Molding Compounds and Resins Datasheets for Composites Group (The)
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and doors. "We are excited to debut Simriz 499, our latest Simriz material innovation for the semiconductor industry," said Vinay Nilkanth, vice president, business development, Simrit. "Simriz 499 is a testament to Simrit's commitment of continually striving to offer our customers the best, most evolved materials and technologies that meet their specific needs.". The 75 durometer clear perfluoroelastomer material has a service temperature range of -6 to 280 degrees Celsius (21 to 236 degrees... (read more)Browse O-rings Datasheets for Simrit
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nitrogen and cooling water),. · Reduced environmental emissions (noise, vibration, sub-fab particles, waste gas and waste water),. · Extended product lifetimes and reduction in on-going service costs. Serving all leading process tool OEMs and with a presence at every major semiconductor fab in the world, our systems are designed to meet the specific requirements of existing and developing processes. A variety of systems, such as dry vacuum pumps, turbomolecular pumps and point-of-use abatement systems... (read more)Browse Semiconductor Wet Process Equipment Datasheets for Edwards Vacuum
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Specialty custom machining of sapphire and ceramic wafers allows Insaco to respond to customer needs for nesting of wafers in larger carriers. Insaco capability to machine and jig grind precise features to extreme tolerance in ceramic materials allows developmental engineers in the semiconductor and compound semiconductor industries to handle small process wafers on a large wafer line. Insaco is a precision machining company that fabricates parts from all technical ceramics, sapphire and quartz... (read more)Browse Glass Fabrication Services Datasheets for Insaco, Inc.
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Through a unique manufacturing process, Simrit has created bonded gates for the semiconductor industry. In this process, seal profiles are bonded directly to process chamber gates, allowing for less seal movement and reducing contamination in process. Simrit, the industrial sealing products division of Freudenberg-NOK, debuted its bonded gates during the SEMICON West 2007 show in San Francisco. Simrit's bonded gates are available in a wide variety of compounds, from fluorocarbons for mild... (read more)Browse O-rings Datasheets for Simrit
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With over a century of combined experience Advanced Engineering & Molding Technology can take your project from concept to reality with the highest level of quality at the most competitive price, on time, every time. (read more)Browse Silicone Molding Services Datasheets for Advanced Engineering & Molding Technology
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The state-of-the-art manufacturing capability of Indo-MIM is a fusion of two units spread over 25,000 square meters - the world's largest installed capacity for metal injection molding. Located in Bangalore, India, our modern facilities have a combined strength of over 600 skilled engineers, scientists, technicians and manufacturing associates. Both facilities are ISO 9001:2000 & ISO/TS 16949:2002 certified. Indo-MIM uses the latest and most precise closed-loop injection molding equipment... (read more)Browse Metal Injection Molding (MIM) Services Datasheets for Indo-US MIM Tec Pvt. Ltd.
Conduct Research Top
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Polymers For Sealing
tried to keep up with the fast pace of developments in semiconductor manufacturing. Advanced analytical techniques have yielded novel seal geometries and rubber compounds with improved thermal, chemical, and cleanliness properties. There are a vast number of polymer choices available today
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New Roles For Ceramic Parts
, produces the parts with a proprietary injection-molding technique. Wafer carriers and other components used in semiconductor fabrication are traditionally made from quartz, but these are silicon carbide. A proprietary process from Poco Graphite, Decatur, Tex., converts the machined graphite structure
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Soft Solder Die-Attach (.pdf)
it provides the most reliable and effective. is required before the device is encapsulated in. means of conducting both electricity and heat. molding compound. · In the fl uxless solder wire process, the wire is. Although fl ip-chip and other package types are. auto-fed into an in-line system where
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Plastic Packaging and the Effects of Surface Mount Soldering Techniques
profile is provided as a reference. later. Moisture sensitivity of plastic packages has been a. concern for semiconductor manufacturers. Moisture. The electronics industry has moved to smaller and. can and will permeate any molding compound. The. thinner surface mount packaging in the progress. rate
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More metal parts go to composites
line resulting in higher process yields. Ports for the optical sensor can be easily machined in the CP-9800 composite to exacting tolerances. Hot properties. Another Vespel grade suitable for semiconductor applications is Vespel CR-6100. This sheet-molding composite is a Teflon PFA reinforced
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Application: Oscilloscope Feed Loops Use Reed Relays
and can carry digital pulse as. for 5 Ms. fast as 20 ps. DC Static contact. 250 mOhms. resistance. MEDER's reed relays use hermetically sealed reed switches that are further. Dynamic contact. 250 mOhms. packaged in strong high strength thermoset molding compound, and can. resistance. therefore
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MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
Tanner, University of Salford New Epoxy Molding Compound for SMT Packaging with PPF Lead Frame Akira Yoshizumi, Kazuhiro Sawai, Ken Uchida, Hirokazu Ibuki, Mototake Andoh, and Isao Yamamoto, Toshiba Chemical Surface Contamination of Bonding Pads Incapable of Au Wire Bonding M. Watanabe, Advantest
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Keeping contaminants out
of fluoropolymers make them candidates for semiconductor wet-bench processing, ultrahigh purity (UHP) chemical transport, dry-etching, gas-deposition, and thermal applications. High-purity materials used in these processes are vulnerable to contamination through contact with materials and surfaces
Engineering Web Search: Semiconductor Molding Compound Top
- Silicon - Wikipedia, the free encyclopedia
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Solder - Wikipedia, the free encyclopedia
of a non-eutectic solder can be exploited in plumbing as it allows molding of the solder during cooling, e.g. for ensuring watertight joint of pipes,
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THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS...
1. A method of packaging semiconductor devices comprising:molding a first surface of a wafer with a first mold compound, and in accordance therewith,
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SEMICONDUCTOR PACKAGE HAVING MARKING LAYER - Patent...
A method for fabricating a semiconductor device comprising the steps of:assembling a plurality of semiconductor chips on a substrate strip, the chips
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The effect of electron beam irradiation on insulating...
The effect of electron beam irradiation on insulating characteristics of molding compound for power semiconductor modules
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1.5KE6.8A thru 1.5KE540A, 1N6267A thru 1N6303A www.vishay.com...
A Case: Molded epoxy body over passivated junction TJ max. 175 ?C Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS compliant,
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Vishay Semiconductors The Constituents of Semiconductor...
H W Available Part in 2) No. Material and/or Group 1) M O A G in the Compound Weight T X S L K Used for Percent L D M N T H 1 Lead and lead
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in most IC molding compounds used by the Semiconductor industry, including TI. In response to environmental concerns, most mold compound suppliers
