Products & ServicesSee also: Categories | Featured Products | Parts by Number | Technical Articles | Engineering Web Results
Description: The use of screen printing processes in the semiconductor industry is a recent innovation. Progressive semiconductor manufacturers now use screen printing for a variety of advanced materials applications at wafer level and final package assembly. Why Choose a DEK Precision Screen? Semiconductor
Supplier: Epoxy Technology
Description: A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity alternative to EPO-TEK® H74.
- Material Form: Composite, Grease / Gel, Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors
- Substrate / Material Compatibility: Metal, Plastic
- Industry: Electronics, Semiconductors / IC Packaging
Supplier: Umicore Materials
Description: WTi10 is an important thin film sputtering material in the field of Semiconductors and is used as diffusion barrier for advanced packaging, e.g. Flip-Chip technology, and in a variety of compounds. To match customer needs, Umicore targets are available in several sizes and grades.
- Metal / Alloy Types: Refractory / Reactive (UNS R), Titanium / Titanium Alloy, Tungsten / Tungsten Alloy
- Applications: Electronics / RF-Microwave, Other
- Nonferrous Metals: Non-ferrous - Any Type, Refractory / Reactive (UNS R), Titanium / Titanium Alloy
Supplier: Protavic America, Inc.
Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum adhesive dispense and die
- Substrate / Material Compatibility: Metal
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
Find Suppliers by Category Top
Featured Products for Semiconductor Packaging Top
Custom Semiconductor Assembly & Packaging Material
Indium Corporation manufactures custom semiconductor assembly materials and semiconductor packaging materials to match your specifications. (read more)
Browse Semiconducting Materials Datasheets for Indium Corporation
Interplex Industries, Inc.
Options for Custom Semiconductor Packaging
Manufacturing Solutions for Product Technologies ™. Interplex Engineered Products (IEP) is a turnkey vertically integrated world-class supplier of application specific open cavity thermoplastic semi-conductor and Electronic Packages across all major markets. Interplex Engineered Products (IEP) designs, develops and manufactures electronic packages, for Photovoltaic , LED , RF power, MEMS, RF ID tag and other similar semi-conductor packaging applications... (read more)
Browse IC Package Converters and Adapters Datasheets for Interplex Industries, Inc.
Interplex Industries, Inc.
Custom Semi-Conductor and Chip Packaging
Manufacturing Solutions for Product Technologies ™. Interplex Engineered Products (IEP) is a turnkey vertically integrated world-class supplier of application specific open cavity thermoplastic semi-conductor and Electronic Packages across all major markets. Interplex Engineered Products (IEP) designs, develops and manufactures electronic packages, for Photovoltaic , LED , RF power, MEMS, RF ID tag and other similar semi-conductor packaging applications. Expertise in Application... (read more)
Browse IC Package Converters and Adapters Datasheets for Interplex Industries, Inc.
Control Plastics, Inc.
Assembly and Packaging Services
Blister and Clamshells. Heat and dielectric sealing. Packaging. Mechanical Assembly. Vacuum Form Packaging. From the initial design to your product selling on the market, let Control be your one stop shop and save your most precious commodity time. (read more)
Browse Mechanical Assembly Services Datasheets for Control Plastics, Inc.
Sunnex offers its all-in-one leveler and caster solution, the LevelCaster ™, for use with machinery and equipment in industrial, manufacturing, assembly, packaging, and semiconductor applications. Sunnex's innovative all-in-one level caster offers the flexibility of a caster while providing the full capability of leveling feet. Comprised of precision components and ball bearings, the LevelCaster allows for equipment to be adjusted and repositioned while in place. Its large, nylon wheels... (read more)
Browse Vibration Isolators and Machine Mounts Datasheets for Sunnex, Inc.
LCC and LCD Clean Process Benchtop Oven
LCC and LCD Clean Process Benchtop Ovens are built ruggedly with a stainless steel interior and exterior. Designed to be stacked, creating a small footprint, saving you valuable floor space. Included is a programmable process control along with multiple tailored options for your specific needs. Typical applications include die-bong curing and other semiconductor packaging processes, depyrogenation, sterilizing and drying for life sciences. For processes where minimal contamination is essential... (read more)
Browse Ovens (Industrial) Datasheets for Despatch Industries
TorquePower ™ Stepper Motors
develop - a TorquePower Plus motor that works best for your project. Contact us today and let us help power your innovation. Applications: Typical applications for TorquePower motors: - Custom OEM applications (OUR SPECIALTY!). - Packaging. - Semiconductor handling and testing. - Antenna positioning. - Laboratory equipment. - Electric braking systems for railway cars. - Medical. - Dispensing... (read more)
Browse Stepper Motors (Rotary) Datasheets for ElectroCraft
Galil Motion Control
MotionCode solutions, each of which details the procedure for implementing a Galil controller into a particular type of machine. The six solutions include: 1. DNA microarrayer machine with xyz pick and place motion function. Can also be applied in biotech, semiconductor, packaging and food processing applications. 2. Automated sewing machine with xy vector motion with geared z functionality. Can also be applied in textile, machine tool and semiconductor applications. 3. Waterjet cutter with xy cartesian... (read more)
Browse Motion Control Software Datasheets for Galil Motion Control
Nexen Group, Inc.
Stainless Steel Line of Roller Pinion System
strength, fatigue resistance, high stiffness and corrosion resistance are required. Compared to 303 stainless steel or 6061-T6 aluminum, Nexen ’s stainless steel can offer twice the load and life capacity while maintaining similar corrosion-resistant properties. Nexen ’s stainless steel RPS has already proved its robustness in a variety of applications where traditional steel rack and pinion failed. Current applications in food packaging, semiconductors and clean room industries have... (read more)
Browse Rack and Pinion Drives Datasheets for Nexen Group, Inc.
Qingdao Eversun Precision Manufacture Co., Ltd.
MIM -Tool Steels & Hard Metals
packaging. Wear resistant tool steel powders in use include M2 (DIN 1.3342), which can be heat treated to extra high hardness ( ≥64HRC). Nb-modified tool steel 440Nb (DIN 1.4105) provides both good corrosion resistance and high heat-treated hardness ( ≥61HRC). (read more)
Browse Datasheets for Qingdao Eversun Precision Manufacture Co., Ltd.
Parts by Number for Semiconductor Packaging Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|ESR470M0J1516||ASAP Semiconductor||PACKAGING||Not Provided||SMD|
|ESR470M0J1516||ASAP Semiconductor||PACKAGING||Not Provided||Not Provided|
|CUSTOM PACKAGING||ASAP Semiconductor||WISCONSIN MISC||Not Provided||Not Provided|
|P6KE91 (PACKAGING CO)||ASAP Semiconductor||GI||Not Provided||Not Provided|
|444-9736600||ASAP Semiconductor||DUNAPACK AG||Not Provided||PACKAGING; V5|
|PK000024_GILAT/SPC||ASAP Semiconductor||TRIPLEX CONTAINERS LTD||Not Provided||PACKAGING SKYMAGIC|
Conduct Research Top
Plastic Packaging and the Effects of Surface Mount Soldering Techniques
This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices (SMD's). The process of packaging a semiconductor in plastic brings to pass a somewhat unlikely marriage of different materials. In order to minimize potential adverse
Spin-Coating Waferbumping Fluxes for Semiconductor Assembly: Ensuring Pristine Microbumps in Dimensional Devices
cycling. semiconductor packaging materials. ultralow k (ULK) dielectric. 2.5D is. and manufacturing. • Eliminate or significantly reduce. also an essential element in high speed. Dr. Mackie is an electronics industry. electromigration issues caused by. heterogeneous “system-in-package”. expert
Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
. In the COB assembly process, a bare (unpackaged) semiconductor is attached directly onto a PCB, wire bonded, and then encapsulated with a polymer. For many applications requiring miniaturization, COB assembly can be the most cost-effective packaging option. This inexpensive and mature technology readily
Comparing the molecular contamination contribution of clean packaging films
Steve Lin and Sarah Graves, In the past few years, antistatic polyethylene (PE) films, also known as pink poly, have been used as an all-purpose packaging material for a wide range of cleanroom-compatible packaging applications. Intended to protect such products as components used in semiconductor
Semiconductor Manufacturing Processes and Laser Displacement Sensors (.pdf)
the way to wire bonding and final packaging. Some common applications of laser displacement sensor, specifically when producing semiconductor wafers are non-. contact thickness, flatness, perpendicularity, and warpage. 1 | P a g e. Speed can be explained as a measure of how often a sensor takes
PTFE Fluid Handling Components Support Semiconductor Advancements
they are being processed. Typical questions that are asked by purity conscious designers are summarized in the box above. Often, semiconductor applications require post process cleaning and packaging. This is typically done in an ISO Class 6 or better clean room. During this process the parts are cleaned
Organic semiconductor devices for micro-optical applications
these devices basically on any. substrate render organic semiconductors attractive for integrated systems in data communication and sensing. application. Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration,. edited by H. Thienpont, M. R. Taghizadeh, P. Van Daele, J
Reverse Engineered Membrane Switch Assembly
A fast growing company has been making high-end conformal coating systems, fluid dispensing solutions and custom automation products for 20 years. Their products are used in industries including solar, semiconductor packaging, printed circuit board assembly, medical device manufacturing
Engineering Web Search: Semiconductor Packaging Top
Advanced Packaging, Semiconductor Packaging & Circuit...
DuPont Home«Electronics«Semiconductor Packaging & Circuit Materials« Semiconductor Packaging & Circuit Materials Home
Semiconductor Packaging Materials
Semiconductor Fabrication Materials Semiconductor Packaging Materials
China Semiconductor Packaging Market Outlook 2012/2013 |...
China Semiconductor Packaging Market Outlook 2012/2013
Global Semiconductor Packaging Materials Outlook 2011/2012 -...
Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and
Welcome to Freescale - Freescale Semiconductor
Packaging Technology Careers University
Analog, linear, and mixed-signal devices from Maxim
Packaging and Reliability Packaging Information Packaging Outline Drawings Land Pattern Drawings QA and Reliability Information
- IEEE Xplore - Components and Packaging Technologies, IEEE...
Technology Venture Forum Sponsors
The 9th international conference, 3-D Architectures for Semiconductor Integration and Packaging, brings together technology and business leaders from