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Welcome to GlobalSpec!
Find parts, products, suppliers, datasheets, and more for:
Semiconductor Packaging Material
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Supplier: Epoxy TechnologyDescription: . Passes NASA low outgassing standard ASTM E595 with proper cure - http://outgassing.nasa.gov/ JEDEC Level III and II semiconductor packaging material
- Chemical / Polymer System Type: Epoxy
- Resins & Compounds: Liquid
- Compound Type: Casting Resin
- Features: Electrically Conductive
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Supplier: Trelleborg Sealing SolutionsDescription: Hardness of 90 IRHD, black, for use in high pressure applications
- Material Type / Grade: Elastomer / Rubber
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
- Filler Material: Unfilled
- Industry: Automotive, Semiconductor / IC's
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Supplier: Master Bond, Inc.Description: Superior resistance to thermal shock, impact, heat and chemicals
- Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
- Material Form: Die Bonding Adhesive / Compound, Gap Filling Compound
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Industry Applications: Aerospace, Automotive, OEM / Industrial
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Supplier: Victrex plc.Description: High performance thermoplastic material, unreinforced PolyEtherKetone (PEK), semi crystalline, fine powder for compression moulding, easy flow, FDA food contact compliant, colour natural.
- Material Form: Molding Resin
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Industry Applications: Aerospace, Automotive, OEM / Industrial
- Filler Material: Unfilled
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Supplier: All-Spec IndustriesDescription: "The CircuitMedic 115-1322 is a high strength, high temperature epoxy kit. "
- Material Form: Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors
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Description: PTFE has rapidly become the material choice where low friction, high durability, excellent thermal resistance and chemical inertness characteristics are required. 3M™ PTFE resins are distinguished by their consistency and unique physical properties. They are available as granular polymers
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Extrusion Grade Resin, Molding Resin
- Electrical / Electronics Applications: Semiconductors / IC Packaging
- Industry Applications: Automotive, OEM / Industrial, Other
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Supplier: Quist ElectronicsDescription: May be installed prior to soldering and cleaning without worry
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
- Industry: Electronics
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening
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Supplier: Ellsworth AdhesivesDescription: Dymax Multi-Cure 9-20557-LB forms a tough clear circuit encapsulant upon exposure to long-wave UV light or visible light. Coating resists yellowing, vibration, impact and thermal shock.
- Coating Type: Electrical Insulation / Dielectric
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Single Component System
- Industry Applications: Electronics (PCB / SMT Assembly), Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: Solar Light Company, Inc.Description:
- Industry Applications: Aerospace / Aviation, Food / Beverage, Automotive, Chemical / Material Processing, Cleanroom, Health Care / Medical, Legal / Forensics, Marine, Military, Pharmaceutical / Biotech, Packaging, Semiconductors / Electronics, Structural / Construction
- Services Offered: Materials Testing Services, Sunlight Exposure / Solar Simulation
- Test / Certify To: ASTM, NIST
- Materials: Adhesives / Sealants, Ceramics / Glass, Chemicals, Coatings, Composites, Concrete / Mortar, Cosmetics (Creams, Sunblocks, etc.), Inorganics, Metals, Nanomaterials, Paper, Plastic / Rubber, Polymers / Organics, Powders, Textiles, Thin Films / Plating, Wafers / Surfaces
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Supplier: Atlas Material Testing Technology LLCDescription: Atlas is the industry leader and the only weathering organization to provide a global approach to providing natural and accelerated weathering testing solutions for materials durability issues with over 20 exposure sites and laboratories to serve your needs. As part of a commitment to provide
- Industry: Aerospace / Aviation, Automotive, Chemical / Material Processing, Food / Beverage, Health Care / Medical, Marine, Military, Packaging, Pharmaceutical / Biotech, Semiconductors / Electronics, Structural / Construction
- Laboratory Services Offered: Environmental Exposure, Environmental Testing and Analysis Services, Materials Testing Services, Standards Testing / Certification, Sunlight Exposure / Solar Simulation
- Test / Certify To: ASTM, EPA, MIL-SPEC, OEM Specific, Other
- Materials: Adhesives / Sealants, Ceramics / Glass, Chemicals, Coatings, Composites, Concrete / Mortar, Metals, Nanomaterials, Paper, Plastic / Rubber, Polymers / Organics, Powders, Soil, Textiles, Thin Films / Plating
Featured Products for Semiconductor Packaging Material Top
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Indium Corporation manufactures custom semiconductor assembly materials and semiconductor packaging materials to match your specifications. (read more) -
SCHOTT designs and develops glass and ceramic-to-metal seals (GTMS, CerTMS), special glasses and other types of electronic packaging and housing technologies for the defense and security industries. SCHOTT's decades of military business experience and superior technological know-how ensure that these technologies provide exceptional levels of functional safety and protection to sensitive electronic devices and with critical power and instrument line penetrations. SCHOTT's hermetic housing... (read more)Browse Glass Materials Datasheets for SCHOTT North America, Inc. - Defense -
PFC is the leader in the advancement of components and materials for the challenging conditions of semiconductor processing. Our products are installed in fabrication plants, helping semiconductor manufacturers amplify yield, minimize their full value of claim and perfect their performance worldwide. We produce ceramic components within strict requirements, from one-offs to superior quality volume production, teaming with semiconductor original equipment manufacturers (OEM's) to develop... (read more)Browse Electronic and IC Packaging Services Datasheets for Precision Ferrites and Ceramics, Inc. (PFC) -
Recognizing the cost and inefficiency of downtime, Alpha Wire has developed a new set of premium wire and cable solutions specific to the material handling industry. Proper wire and cable selection is paramount for material handling systems to maintain robust connectivity and maximum signal integrity. Alpha Wire's material handling-specific offering alleviates the concerns of EMI protection, hazardous fluid defense, and the stresses of continuous flexing. "Our material handling products ensure... (read more)Browse Multiconductor Cables Datasheets for Alpha Wire -
throughput. Other Options. • Absorber layer targets: Cu/Ga, Cu/In, and In. • Other common target materials: In/Sn, In/Sn/O, Sn, Sn/O, and In/Zn. • Custom alloys are also available. Use the links below to learn more about. OnSpec® CIG Alloy Sputtering Targets. Application Notes. In Depth Technical Papers on Solar Materials. Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic... (read more) -
Manufacturing Solutions for Product Technologies ™. Interplex Engineered Products (IEP) is a turnkey vertically integrated world-class supplier of application specific open cavity thermoplastic semiconductor and Electronic Packages across all major markets. Interplex Engineered Products (IEP) designs, develops and manufactures electronic packages, for Photovoltaic , LED , RF power, MEMS, RF ID tag and other similar semiconductor packaging applications. Expertise in Application Engineering... (read more) -
Manufacturing Solutions for Product Technologies ™. Interplex Engineered Products (IEP) is a turnkey vertically integrated world-class supplier of application specific open cavity thermoplastic semi-conductor and Electronic Packages across all major markets. Interplex Engineered Products (IEP) designs, develops and manufactures electronic packages, for Photovoltaic , LED , RF power, MEMS, RF ID tag and other similar semi-conductor packaging applications. Expertise in Application... (read more) -
To compliment DDL's Medical Device Packaging Testing, DDL's Product and Materials Testing Division can take your package design and packaging testing to a deeper level by testing the materials that make up the package itself. From plastic films to adhesives, foams to metals we can assist with your testing needs and help you better understand your options in packaging materials. The effects of aging, different sterilization treatments and different material sources can all be explored through... (read more)Browse Material Testing Services Datasheets for DDL Inc. -
When the job has been completed, the entire package is disposed of: no clean up or physical contact with the resin. Cost savings are achieved by reducing labor and material waste. Reliability is increased with accurate compound ratios, complete mixing and proper application techniques. Three types of kits are available: Barrier, Injection and Barrier/Injection types. Barrier Type. For compounds with a volumetric ratio greater than 10 parts per 100. The catalyst and base are separated... (read more)Browse Syringes and Needles Datasheets for Techcon Systems, Inc. -
Saint-Gobain Performance Plastics - High Performance Seals, Polymer Components and Springs
Thermoset Materials for Semiconductor Componentsductility and easy machinability, Meldin 7001 often replaces components made in ceramics and PBI materials. Ceramics and PBI materials are much more brittle, and more difficult to machine than Meldin 7001 material. Meldin components are less expensive than ceramic or PBI components due to the fact that complex part geometry and features can be easily incorporated into Meldin components. In addition, Meldin 7001 components last longer than ceramic and PBI components due to the higher ductility... (read more)Browse Thermosets and Thermoset Materials Datasheets for Saint-Gobain Performance Plastics - High Performance Seals, Polymer Components and Springs
Parts by Number for Semiconductor Packaging Material Top
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 7350450 | RS Components, Ltd. | OSRAM Opto Semiconductors | Visible LED | Mounting:Surface Mount; Colour:Red; Peak Wavelength:660nm; High Brightness:Yes; Viewing Angle:80; Maximum Forward Voltage per Colour:2.6V; Maximum Forward Current:1000mA; Lens Shape Type:Circular; Supplier Package:CSMD; LED Material:AlGaInP |
| 6548104 | RS Components, Ltd. | OSRAM Opto Semiconductors | Photodiode | Mounting:Through Hole; Peak Wavelength:950nm; Photodiode Material:Si; Photodiode Type:PIN; Supplier Package:DIP; Pin Count:2; Product Width:4mm; Product Height:2.2mm; Type:Chip; Product Length:4.5mm |
| 5377478 | RS Components, Ltd. | OSRAM Opto Semiconductors | Photodiode | Mounting:Surface Mount; Photo Sensitivity:0.59A/W; Peak Wavelength:950nm; Maximum Forward Voltage:1.3V; Maximum Dark Current:30nA; Photodiode Material:Si; Photodiode Type:PIN; Polarity:Reverse; Supplier Package:DIL SMT; Pin Count:2 |
| 6548132 | RS Components, Ltd. | OSRAM Opto Semiconductors | Photodiode | Mounting:Surface Mount; Peak Wavelength:850nm; Photodiode Material:Si; Photodiode Type:PIN; Supplier Package:SMD; Function:Photodiode |
| 6548902 | RS Components, Ltd. | OSRAM Opto Semiconductors | Photodiode | Mounting:Through Hole; Peak Wavelength:850nm; Photodiode Material:Si; Photodiode Type:PIN; Supplier Package:5 mm; Pin Count:2; Product Height:12mm; Product Length:5.9mm; Product Width:5.9mm; Type:Chip |
Conduct Research Top
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Packaging microscopic machines
Although MEMS technology is considered fundamentally ready for prime time, packaging hasn't kept pace. But that's changing as an estimated 900 packaging patents will be filed this year alone. SOIC package (thicker than standard because of silicon cap and gel-coat) Microelectromechanical systems...
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Comparing the molecular contamination contribution of clean packaging films
Materials In the past few years, antistatic polyethylene (PE) films, also known as pink poly, have been used as an all-purpose packaging material for a wide range of cleanroom-compatible packaging applications. Intended to protect such products as components used in semiconductor process equipment...
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Plastic Packaging and the Effects of Surface Mount Soldering Techniques
This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices (SMD's). The process of packaging a semiconductor in plastic brings to pass a somewhat unlikely marriage of different materials. In order to minimize potential adverse...
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Metal Based Wafer Bonding Techniques for Wafer Level Packaging (.pdf)
packaging operations. A primary differentiator is the via size and therefore the placement accuracy needed to obtain production yields. Meanwhile gold and aluminum diffusion bonding and numerous eutectic alloys are replacing traditional MEMS glass based bonding methods and allow for higher degrees...
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Semiconductor Manufacturing Handbook
the Back Cover. WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS. This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers...
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Semiconductor manufacturing: Off to a slower start
; Fundamentals of Wet and Dry Etch; Design, Materials, Process, and Reliability of Lead-Free Packaging and Assembly; Fundamentals of Thermal Processes; and Developing and Implementing Intellectual Property Strategies in the Semiconductor Industry. Registration information for Semicon West is available...
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PTFE Fluid Handling Components Support Semiconductor Advancements
they are being processed. Typical questions that are asked by purity conscious designers are summarized in the box above. Often, semiconductor applications require post process cleaning and packaging. This is typically done in an ISO Class 6 or better clean room. During this process the parts are cleaned using...
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Organic semiconductor devices for micro-optical applications
these devices basically on any. substrate render organic semiconductors attractive for integrated systems in data communication and sensing. application. Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration,. edited by H. Thienpont, M. R. Taghizadeh, P. Van Daele, J...
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Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)
as masked off saw streets and I/Os across the wafer. Thickness comparisons are made between the 2 methodologies. Thermally Conductive Epoxies SCREEN PRINTABLE POLYMERS FOR WAFER LEVEL PACKAGING: A TECHNOLOGY ASSESSMENT. James Clayton and Michael J. Hodgin. Polymer Assembly Technoloy, Epoxy...
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Materials Tracking: It's All in the Data
. Automation & Control. cGMPs Compliance. Contract Manufacturing. Drug Delivery. Facilities & Support. Facility of the Future. Fill Finish. Focus on Pharma Podcast. Funny Pharm. Green Library. Industry Developments. Operational Excellence & Lean Six Sigma. Packaging. Process Operations. Quality Assurance...
Engineering Web Search: Semiconductor Packaging Material Top
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Semiconductor device fabrication - Wikipedia, the free... Semiconductor device fabrication From Wikipedia, the free encyclopedia (Redirected from Semiconductor fabrication) |
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Transistor - Wikipedia, the free encyclopedia 6.1 Semiconductor material 6.2 Packaging |
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Standardized Bags on Fuji Impulse America It is best packaging material for semi-conductor device and sensitive electronic component packaging. See Fuji Impulse America Corp. Profile & Catalog |
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Current and reliable Packaging Products & Equipment news... Material Handling and Storage Materials and Material Processing Packaging Products & Equipment Paints and Coatings |
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International Rectifier - HEXFET Power MOSFET Product... To produce a useful device, semiconductor material is processed into MOSFET, IGBT, SCR, or diode devices, etc. See International Rectifier Information |
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Atmel Home Green Packaging Package Material Environmental Information See Atmel Corporation Profile & Catalog |
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Cognex See Cognex Corp. Profile & Catalog |
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SEMI® Semiconductor Material Market Data Report | SEMI.ORG SEMI® Semiconductor Material Market Data Report Quarterly Worldwide Semiconductor Material Market Data and Trends See Semiconductor Equipment and Materials International (SEMI) Information |
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... Packaging Information Moisture Sensitivity Search |
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Quality - Eco-Info & Lead-free (Pb-free): Content & Schedule... Packaging Information Moisture Sensitivity Search |
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