• Description: A single component, UV curable epoxy designed for adhesive, coating and encapsulating applications within the semiconductor, fiber optic and medical industries. It can be used with fiber packaging, LCD, displays, lenses, micro-lenses, CCD and CMOS image sensors. It is non-yellowing after cure.

    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Optoelectronics / Photonics, Semiconductors / IC Packaging
    • Industry Applications: Optical Grade / Material
    • Chemical / Polymer System Type: Epoxy (EP)

  • Supplier: Hapco, Inc.

    Description: Heat cure epoxy powder that is lightweght and passes 94 V-0 testing.

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various hardeners, EP34CA produces a low viscosity 100% reactive system which is particularly

    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, ESD Control / Anti-static
    • Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
    • Industry Applications: Military / Government (MIL-SPEC / GG), OEM / Industrial

  • Description: Resinlab® EP1056LV is a two part urethane modified epoxy casting resin designed to give good adhesion to metals and PVC.

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Industry Applications: OEM / Industrial

  • Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
    • Form / Function: Glob Top / Daub
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Industry Applications: Automotive, OEM / Industrial

  • Description: Master Bond EP28-1 is a clear, low viscosity two-component high impactepoxy adhesive system that contains no solvent and cures quickly at room temperature to form exceptionally strong bonds to most metals and nonmetallics including ceramics, glass and many plastics. It features excellent flowability

    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, ESD Control / Anti-static
    • Form / Function: Die Bonding Adhesive / Compound, Conformal / Encapsulating Coating, Gap Filling Compound, Specialty / Other
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, OEM / Industrial

  • Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a five (5) to one (1) mix ratio by weight. This adhesive is 100% reactive

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial, Optical Grade / Material, Other

  • Description: DYMAX Ultra Light-Weld 9-20479-B cures upon exposure to light and is designed for rapid masking of electronic components and assemblies. The mask is easily removable, eliminating the concern of ionic contamination or silicone left behind by other masking methods. Sold in a pack (10/pk)

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Conformal / Encapsulating Coating
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Chemical / Polymer System Type: Acrylic / Polyacrylate

  • Description: Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure to UV lamps or EB radiation. The cure can be effected in air or under an inert atmosphere such

    • Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
    • Form / Function: Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics, Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Optical Grade / Material, Other

  • Description: and opto-electronic potting and encapsulation applications. This performance characteristic is due to its uniquely effective catalyst system. Another noteworthy property of the UV10SP-2A is its high flexibility which imparts excellent vibration and shock resistance as well as superior ability to withstand

    • Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
    • Form / Function: Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics, Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Optical Grade / Material, Other

  • Description: SEMICOSIL® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features Rapid UV acceleration Shadow cure solvent free Application SEMICOSIL® 936 UV is intended as a protective coating for

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Conformal / Encapsulating Coating
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Industry Applications: Automotive

  • Description: No Description Provided

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
    • Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
    • Industry Applications: OEM / Industrial

  • Description: High temperature, thermally conductive, low viscosity

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Industry Applications: OEM / Industrial

  • Description: 20-3066 is a 100% solids epoxy system which exhibits outstanding high temperature resistance. In addition to its' high temperature resistance, 20-3066 also has excellent chemical, solvent, and moisture resistance.

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: Envirogel™ 5 is an excellent sealant for use in many industrial, mechanical and electronic applications. Its shock dampening characteristics, as well as its dielectric and self healing properties make it perfect for use in hostile surroundings. It forms an environmental shield around anything

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Industry Applications: OEM / Industrial

  • Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated as an economical, zircon-based cement

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
    • Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Chemical / Polymer System Type: Ceramic / Inorganic Cement

  • Description: Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. Tuffbond epoxies

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other

  • Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at

    • Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
    • Form / Function: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
    • Industry Applications: OEM / Industrial

  • Description: RTV-2 for protective potting, coating and encapsulation Properties Viscosity 150000 Hardness Sha 60 Description RTV Elastomer - Two components addition cure for encapsulation/protection of electronical systems and production of moulding parts Good heat stability in confined environments

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Conformal / Encapsulating Coating
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Chemical / Polymer System Type: Silicone

  • Description: is excellent. The hardened compound is an excellent electrical insulator. Color of part A black, part B amber. Master Bond EP21F System is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries for casting, potting, encapsulation

    • Material Type / Grade: Thermoset
    • Chemical / Polymer System Type: Epoxy
    • Resins & Compounds: Liquid
    • Compound Type: Casting Resin

  • Description: . It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21FLVSP is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. EP21FLVSP contains no solvents

    • Material Type / Grade: Thermoset
    • Chemical / Polymer System Type: Epoxy
    • Filler Material: Metal
    • Compound Type: Casting Resin

  • Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic industries such as consumer, military, medical and optical/OEM.

    • Material Type / Grade: Thermoset
    • Chemical / Polymer System Type: Epoxy
    • Compound Type: Liquid
    • Features: Optical Grade

  • Description: CONATHANE EN-1554 is a polyether based polyurethane resin system primarily intended for use as a molding, encapsulating and potting compound for harness breakouts, watertight electrical connectors, cables, cable end seals, printed circuitry and other electrical components.

    • Applications: Electronics / Semiconductors, Other

  • Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which

    • Material Type / Grade: Elastomer / Rubber
    • Chemical / Polymer System Type: Silicone
    • Compound Type: Liquid
    • Features: Flame Retardant (e.g. UL 94 Rated), Thermally Conductive

Page: 1

Parts by Number Top

Part # Distributor Manufacturer Product Category Description
ER2002RP250G ASAP Semiconductor ELECTROLUBE Not Provided ENCAPSULANT, EPOXY, 250G; Potting Compound Type:Epoxy; Dispensin
EL116F/GY ASAP Semiconductor ROBNOR Not Provided RESIN, P/THANE, SEMIRIGID LOW VISCOSITY; Potting Compound Type:P
EL171C/1131 ASAP Semiconductor ROBNOR Not Provided RESIN, POLYURETHANE, FLAME RETARD. 1131G; Potting Compound Type:
2004682 ASAP Semiconductor DowCorning Not Provided RTV SILICONE, 9161, KIT, 0.5KG; Potting Compound Type:Silicone -
CY1301/HY1300 ASAP Semiconductor ARALDITE Not Provided ENCAPSULANT, EPOXY, 730G; Potting Compound Type:Epoxy; Colour:Pa
More >>

Conduct Research Top

  • MICRO: Defect/Yield Analysis - Kumar (January 2001)
    cleanrooms. The outgassing of these compounds from HEPA or ULPA filter polyurethane material (also known as potting compounds) has disrupted processing at several semiconductor facilities. Potting compounds are used to seal the edges of the pleated filter media to HEPA and ULPA filter housings

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