Semiconductor Potting Compound

Description: , or a thermal potting compound.

• Material Form: Composite, Grease / Gel, Polymer (Plastic / Elastomer), Potting Compound
• Compound Type: Thermally Conductive
• Material Form: Grease / Paste
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No. 11 is formulated

• Material Form: Adhesive, Potting Compound, Powder / Grain
• Features: Electronics / Semiconductors, Electrical Power / HV
• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
• Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound

Description: Device Technologies, Inc. has been designing and manufacturing high performance wire protection, cable management, and other specialty fasteners for over two decades. It’s standard products include Spring-Fast ® Wire Protection Grommet Edging, Trim-Fast™ Edge Trim, Seal-Fast ™

• Use: Conformal Coating
• Form: Powder, Specialty / Other
• Chemical / Polymer System Type: Epoxy (EP), Polyamide, Polyester (PET), Specialty / Other
• Cure Type / Technology: UV / Radiation Cured (also EB, Light), Specialty / Other

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Composite, Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Compound Type: Electrical Insulation / Dielectric
• Form / Function: Encapsulant / Potting Compound

Description: Heat cure epoxy powder that is lightweght and passes 94 V-0 testing.

• Material Form: Potting Compound
• Features: Electronics / Semiconductors
• Use: Encapsulant / Potting Compound
• Form: Liquid

Description: Bonded laminate, copper shield between layers or Sil-Pad

• Material Form: Polymer (Plastic / Elastomer), Specialty / Other
• Features: Electronics / Semiconductors
• Type / Form: Adhesive, Thermal Compound / Interface
• Electrical Insulating / Dielectric: Yes

Description: INSULCAST 985 FR is a semi-flexible flame retardant epoxy compound displaying the best thermal shock resistance currently available in an epoxy compound, as well as excellent electrical properties over a wide range of temperatures. INSULCAST 985 FR makes use of the latest polymer and filler

• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Grease / Gel, Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors, Electrical Power / HV, UL Approved
• Coating Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: Envirogel™ Thixotropic is an excellent sealant for use in many industrial, mechanical and electronic applications. Its shock dampening characteristics, as well as its dielectric and self healing properties make it perfect for use in hostile surroundings. It forms an environmental shield around

• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Compound Type: Encapsulating / Potting
• Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic

Description: RTV-2 for protective potting, coating and encapsulation Properties Viscosity 150000 Hardness Sha 60 Description RTV Elastomer - Two components addition cure for encapsulation/protection of electronical systems and production of moulding parts Good heat stability in confined

• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.)
• Features: Electronics / Semiconductors, Electrical Power / HV
• Use: Conformal Coating
• Form: Liquid

Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous

• Material Type / Grade: Elastomer / Rubber
• Chemical / Polymer System Type: Silicone
• Filler Material: Unfilled
• Compound Type: Liquid

Description: Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various hardeners, EP34CA produces a low viscosity 100% reactive system which is particularly

• Material Form: Adhesive, Grease / Gel, Polymer (Plastic / Elastomer), Potting Compound
• Industry: Electronics, Energy / Utilities, Government, OEM / Industrial, Semiconductor
• Features: Electronics / Semiconductors, Electrical Power / HV
• Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Porous Surfaces, Textiles / Fabrics, Other

Description: crystal clear vulcanisate very high transmission long-term stability against weathering, moisture and UV radiation electrically insulating Application multi-purpose potting agent for the solar energy industry encapsulation of solar cells bonding of optical devices

• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Grease / Gel, Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Use: Conformal Coating, Encapsulant / Potting Compound
• Form: Grease / Paste

Description: Resinlab® EP1056LV is a two part urethane modified epoxy casting resin designed to give good adhesion to metals and PVC.

• Material Form: Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Use: Encapsulant / Potting Compound
• Form: Liquid

Description: Non-corrosive, single component silicone coating & encapsulating compound

• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors, Electrical Power / HV
• Use: Conformal Coating, Encapsulant / Potting Compound
• Form: Liquid

Description: INSULCAST 42 is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation. INSULCAST 42 bonds well to most metals and plastics.

• Material Form: Grease / Gel, Potting Compound
• Compound Type: Electrical Insulation / Dielectric
• Form / Function: Encapsulant / Potting Compound
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA.

• Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
• Use: Conformal Coating, Encapsulant / Potting Compound
• Form: Liquid
• Chemical / Polymer System Type: Epoxy (EP)

Description: Meets JEDEC level testing requirements, compatible with lead free testing

• Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Use: Conformal Coating, Encapsulant / Potting Compound
• Form: Liquid

Description: RTVS 27 LV is a low viscosity, general purpose, reversion resistant RTV Silicone Compound. RTVS 27 LV finds use in commercial potting/casting application. RTVS 27 LV's one-to-one ratio by weight or volume makes it ideal for dispensing equipment or unskilled labor. With the ability to cure rapidly

• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound, Varnish / Impregnating Resin
• Coating Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Industry Applications: Electronics (PCB / SMT Assembly)

Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic industries such as consumer, military, medical and optical/OEM.

• Chemical / Polymer System Type: Epoxy
• Resins & Compounds: Liquid
• Compound Type: Casting Resin
• Features: Optical Grade

Description: Master Bond Polymer System EP30M3LVR is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio

• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy
• Resins & Compounds: Liquid
• Compound Type: Casting Resin

Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.

• Material Form: Potting Compound
• Compound Type: Electrical Insulation / Dielectric
• Form / Function: Encapsulant / Potting Compound
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has

• Material Form: Adhesive, Composite, Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
• Substrate / Material Compatibility: Ceramic / Glass, Metal
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy

Description: CONATHANE EN-1554 is a polyether based polyurethane resin system primarily intended for use as a molding, encapsulating and potting compound for harness breakouts, watertight electrical connectors, cables, cable end seals, printed circuitry and other electrical components.

• Applications: Electronics / Semiconductors, Other

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Polymer (Plastic / Elastomer), Potting Compound
• Compound Type: Electrical Insulation / Dielectric
• Form / Function: Encapsulant / Potting Compound
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)