Page: 1

Parts by Number Top

Part # Distributor Manufacturer Product Category Description
ER2002RP250G ASAP Semiconductor ELECTROLUBE Not Provided ENCAPSULANT, EPOXY, 250G; Potting Compound Type:Epoxy; Dispensin
EL116F/GY ASAP Semiconductor ROBNOR Not Provided RESIN, P/THANE, SEMIRIGID LOW VISCOSITY; Potting Compound Type:P
EL171C/1131 ASAP Semiconductor ROBNOR Not Provided RESIN, POLYURETHANE, FLAME RETARD. 1131G; Potting Compound Type:
2004682 ASAP Semiconductor DowCorning Not Provided RTV SILICONE, 9161, KIT, 0.5KG; Potting Compound Type:Silicone -
CY1301/HY1300 ASAP Semiconductor ARALDITE Not Provided ENCAPSULANT, EPOXY, 730G; Potting Compound Type:Epoxy; Colour:Pa
More >>

Conduct Research Top

  • MICRO: Defect/Yield Analysis - Kumar (January 2001)
    cleanrooms. The outgassing of these compounds from HEPA or ULPA filter polyurethane material (also known as potting compounds) has disrupted processing at several semiconductor facilities. Potting compounds are used to seal the edges of the pleated filter media to HEPA and ULPA filter housings

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire