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Semiconductor Potting Compound
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Supplier: Glotrax Polymers Inc.Description: A two part epoxy potting compound specially formulated with a 1:1 mix ratio for the convenience of dispensing it from a side-by-side cartridge system. Encaptrax 121 is a flowable, industrial grade potting compound with an extended work life. Once mixed, the epoxy cures at room temperature to form
- Compound Type: Electrical Insulation / Dielectric
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Master Bond, Inc.Description: Master Bond Polymer System EP30ANHT is a two component epoxy resin system for high performance general purpose bonding, sealing and potting formulated to cure at room temperature or more rapidly at elevated temperatures, with a convenient ten to one (10:1) mix ratio by weight. It readily develops
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Filler Material: Mineral
- Features: Thermally Conductive
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Supplier: Epoxy TechnologyDescription: , or a thermal potting compound. It is a low viscosity version of EPO-TEK® 921.
- Material Type: Grease / Paste
- Industry: Electronics, Semiconductors / IC Packaging
- Features: Electrical Insulation / Dielectric
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: ELANTAS PDG, Inc.Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Filler Material: Mineral
- Liquid: Yes
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Supplier: Epoxy TechnologyDescription: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased electrical insulation. It is also more viscous and thixotropic. Can be used
- Substrate / Material Compatibility: Ceramic / Glass
- Industry: Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Encapsulating / Potting
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Supplier: Master Bond, Inc.Description: Bonding and sealing; features high peel strength and shock resistance
- Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
- Material Form: Encapsulant / Potting Compound, Gap Filling Compound
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
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Supplier: Epoxies Etc...Description: 20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.
- Material Form: Composite, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors
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Supplier: Ellsworth AdhesivesDescription: Resinlab® EP1056LV is a two part urethane modified epoxy casting resin designed to give good adhesion to metals and PVC.
- Material Form: Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors
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Supplier: Aremco Products, Inc.Description: High dielectric, use in apps to 2600 °F, moisture & acid resistant
- Material Form: Composite, Gap Filling Sealant / Gasket, Potting Compound
- Features: Electronics / Semiconductors
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Supplier: ELANTAS PDG, Inc.Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Compound Type: Electrical Insulation / Dielectric Material
- Material Form: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Industry Applications: Aerospace, Military / Government (MIL-SPEC / GG), OEM / Industrial
Featured Products for Semiconductor Potting Compound Top
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. Aremco-Bond tm 2315 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, and semiconductors. Aremco-Bond tm 2315 is supplied in easy to mix pint, quart and gallon kits. (read more)Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Aremco Products, Inc. -
H2W engineers have developed a new Linear Induction Motor (LMG-03-325-SSE) that is capable of generating 1444 N at a 3% duty cycle. Operating at 400 VAC, 75 Hz, the synchronous velocity of this LIM is 675 in/sec [17 m/s]. This LIM was designed for high speed operation, however it can also be operated at stall (zero speed) in order to produce static thrust. This motor is encapsulated into a stainless steel enclosure using high temperature (400 F) potting compound which protects the components... (read more)Browse Linear Motors Datasheets for H2W Technologies
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H2W engineers have developed a new Linear Induction Motor (LMG-06-650-SSE) that is capable of generating 2900 N at a 3% duty cycle. Operating at 400 VAC, 75 Hz, the synchronous velocity of this LIM is 675 in/sec [17 m/s]. This LIM was designed for high speed operation, however it can also be operated at stall (zero speed) in order to produce static thrust. This motor is encapsulated into a stainless steel enclosure using high temperature (400 F) potting compound which protects the components... (read more)Browse Linear Motors Datasheets for H2W Technologies
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. Aremco-Bond tm 2315 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, and semiconductors. Aremco-Bond tm 2315 is supplied in easy to mix pint, quart and gallon kits. (read more)Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Aremco Products, Inc.
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20-3063. POTTING COMPOUND. DESCRIPTION: 20-3063 is an electronic grade potting and encapsulating compound. This is a low cost epoxy system designed for applications requiring a low viscosity. 20-3063 has an easy one to one mix ratio by weight or volume. The resin is pigmented black and the catalyst white for a visual indication that the products have been properly mixed together. For less filler settling and a slightly higher viscosity use Catalyst 20-3063C HV. FEATURES: * Low Viscosity. * Low... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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Epoxies, Etc's new electronic grade 20-2620 is a two component Polyurethane compound designed for applications requiring "water like" clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time. 20-2620 is semi-flexible and will not place excess stress on electronic components. It also has a low viscosity, which facilitates easy flow and penetration into difficult areas. This product has a convenient one to one mix ratio... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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Epoxies, Etc. has developed two new Polyurethane Potting Compounds. These systems provide outstanding thermal cycling properties, low temperature resistance, and low embedment stress to sensitive electronic components. 50-2185 is a filled 80 Shore A system exhibiting flexibility to -55C, high thermal conductivity, and flame resistance meeting UL 94 V-O. These unique set of properties provide low component stress upon curing and extreme thermal cycling making 50-2185 ideal for protecting... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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Although Epoxies, Etc... offers a complete standard product line, we also custom formulate Potting and Encapsulating Compounds for specific customer requirements. Our technical team can develop a special viscosity, color, hardness, or other unique property for your application. The Epoxies, Etc... research and production facility is perhaps the newest and most advanced in the industry fulfilling small requests as well as large volume demands. Some of the types of custom formulated potting... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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Epoxies, Etc... recognizes the importance of developing green chemistries. The new Elastomeric Polyurethane Potting Compounds are formulated with natural oil based polyols that are obtained from a plant source. In addition to being derived from a renewable resource, they are also free of any Volatile Organic Compounds (VOC's). These low durometer products range in hardness from a gel to a Shore A 80. They have excellent dielectric properties and are ideal choices for the potting, casting... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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Epoxies, Etc... developed an easy to use Epoxy Potting Compound. Many commercially available potting compounds have wide mix ratios that make measuring difficult. These same materials contain fillers that settle and cause the material to have a high viscosity. The 20-3001NC solves many of the common processing problems that electronic manufacturers experience with potting compounds. Typical Potting Compound. Thick and does not flow easily. Wide mix ratio, i.e 100:5 by weight. Fillers settle... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
Parts by Number for Semiconductor Potting Compound Top
| Partb # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| MIL-M-24041-B-I BLK | ASAP Semiconductor | PRC-DESOTO | Not Provided | Potting Compound |
| CY1301/HY1300 | ASAP Semiconductor | ARALDITE | Not Provided | ENCAPSULANT, EPOXY, 730G; Potting Compound Type:Epoxy; Colour:Pa |
| PX314ZG/250 | ASAP Semiconductor | ROBNOR | Not Provided | ENCAPSULANT, EPOXY, 250G; Potting Compound Type:Epoxy; Colour:Bl |
| PX314ZG/100 | ASAP Semiconductor | ROBNOR | Not Provided | ENCAPSULANT, EPOXY, 100G; Potting Compound Type:Epoxy; Colour:Bl |
| PX314ZG/1000 | ASAP Semiconductor | ROBNOR | Not Provided | ENCAPSULANT, EPOXY, 1000G; Potting Compound Type:Epoxy; Colour:B |
Conduct Research Top
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MICRO: Defect/Yield Analysis - Kumar (January 2001)
cleanrooms. The outgassing of these compounds from HEPA or ULPA filter polyurethane material (also known as potting compounds) has disrupted processing at several semiconductor facilities. Potting compounds are used to seal the edges of the pleated filter media to HEPA and ULPA filter housings
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Controlling wafer transport in a vacuum environment
. Potting: Devices are completely covered with a compound such as a vacuum-compatible epoxy to minimize outgassing and alleviate mechanical stresses. This method can greatly reduce the effects of vacuum on electronic devices. Care must be taken to minimize the area of the exposed potting compound
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Laser Marking Of Integrated Circuits
in. orientation. colour, depending of the potting compound and. the beam characteristics, and is highly visible. offering good levels of contrast. Mark showing spot separation at 80kHz made at 6m/s. Traditionally ink based marking has been the. The process of marking these parts does not. most prevalent
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Epoxy
. Printed-circuit boards, consisting of a glass-fabric-reinforced flame-retardant epoxy resin are another major use. Filled and unfilled liquid systems are used for potting and encapsulating electrical/electronic components ranging from semiconductor devices and miniature coils and switches to large
Engineering Web Search: Semiconductor Potting Compound Top
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Encapsulants and Potting Compounds Suppliers in Alabama:...
Encapsulant / Potting Compound Glob Top / Daub
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Military / Government (MIL-SPEC) Elastomers and Rubber...
properties, the RTVS 11 is used extensively as a high voltage potting compound, as well as an encapsulating compound for delicate... [See More
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MasterBond.com | Adhesives, Sealants & Coatings
UV Potting Compounds Dual Curing Form-in-Place Gaskets Potting & Encapsulation Impregnation Industries Served
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Current and reliable Chemicals & Chemical Processing news...
Polyurethane Potting Compound allows user to
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Current and reliable Materials & Material Processing news...
Polyurethane Potting Compound allows user to adjust hardness."> Polyurethane Potting Compound allows user to adjust hardness.
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NOPB, IC TXRX ETHERNET PHYTER 48-LQFP - DP83848CVV
POTTING COMPOUND BLACK 400ML - DP270-BLACK-400ML Beschreibung: Bestellen Sie POTTING COMPOUND BLACK 400ML-DP270-BLACK-400ML online bei Digi-Key.
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Galco Industrial Electronics
Beam Clamps Brushes Chain Chemicals Hand Tools Knobs Labels Potting Compound Printers S Hooks Soldering Staples Swabs
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Aavid Thermalloy - 100200F00000G - Chemicals - Chemicals &...
Products > Chemicals & Adhesives > Chemicals > Potting Compounds > 100200F00000G
