• Description: A two component, thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging including glob top and underfill, hybrid microelectronics, optical, and medical. It is a smaller particle size version

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various hardeners, EP34CA produces a low viscosity 100% reactive system which is particularly

    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, ESD Control / Anti-static
    • Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
    • Industry Applications: Military / Government (MIL-SPEC / GG), OEM / Industrial

  • Supplier: Hapco, Inc.

    Description: Heat cure epoxy powder that is lightweght and passes 94 V-0 testing.

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Flame Retardant / UL 94V-0 Rated: Yes

  • Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Industry Applications: OEM / Industrial

  • Description: Sold as pack (5 kits/pack). Oxy-Cast 606 is a fast gel version of OXY-CAST 607. A versatile epoxy casting system developed for high performance production potting and encapsulating applications where low shrinkage, fast gel, rapid air evacuation, and low exotherm are required. 2 gallon kit.

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: Master Bond Polymer System EP28M is a remarkably fast curing, low viscosity, two component epoxy compound formulated for high performance casting and bonding. It is 100% reactive and does not contain any diluents, solvents or other volatiles. Master Bond Polymer System EP28M is readily prepared

    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, ESD Control / Anti-static
    • Form / Function: Die Bonding Adhesive / Compound, Conformal / Encapsulating Coating, Gap Filling Compound, Specialty / Other
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics, Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial

  • Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect and preserve the

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Flexible / Dampening: Yes

  • Description: Master Bond Polymer UV10F is a unique single component, ultra violet curing, ultra violet stable, modified epoxy resin. This product offer the good adhesion, low shrinkage, and good chemical and water resin resistance associated with epoxy systems in general. UV10F cures tack free in the presence of

    • Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
    • Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics, Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Optical Grade / Material, Other

  • Description: Dymax Ultra Fast 9-318-F mask is a very fast curing, solvent-free resin. Cures in seconds when exposed to visible and long wave UV light.

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Conformal / Encapsulating Coating
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Chemical / Polymer System Type: Acrylic / Polyacrylate

  • Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
    • Form / Function: Glob Top / Daub
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: Master Bond Polymer System EP30BN is a two component boron nitride epoxy resin system for high performance bonding, sealing, coating and potting featuring remarkably high thermal conductivity and excellent electrical insulation properties. The low weight of this thermally conductive epoxy system

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
    • Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial, Other

  • Description: SEMICOSIL® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features Rapid cure Excellent electrical properties Excellent adhesion to many substrates Available in clear or red Application SEMICOSIL® 960 CLEAR is a

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
    • Form / Function: Conformal / Encapsulating Coating
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Chemical / Polymer System Type: Silicone

  • Description: Master Bond Polymer System UV15-7TK1A is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive, does not contain any solvents or other volatiles and does not embrittle even upon exposure to low

    • Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
    • Form / Function: Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics, Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Optical Grade / Material, Other

  • Description: No Description Provided

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
    • Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
    • Industry Applications: OEM / Industrial

  • Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Flame Retardant / UL 94V-0 Rated: Yes

  • Description: A two part epoxy potting compound specially formulated with a 1:1 mix ratio for the convenience of dispensing it from a side-by-side cartridge system. Encaptrax 121 is a flowable, industrial grade potting compound with an extended work life. Once mixed, the epoxy cures at room temperature to form

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Chemical / Polymer System Type: Epoxy (EP)

  • Description: Hi-temp, prevents dusting of fibrous insulation materials

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
    • Industry Applications: Automotive, OEM / Industrial, Other

  • Description: Sauereisen Flotemp Cement No. 4 is used for potting applications where high electrical insulation and thermal conductivity are required. No. 4 is specially formulated to limit the wicking nature of a porous substrate. This will prevent permeation of water into the substrate and the associated

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
    • Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Chemical / Polymer System Type: Ceramic / Inorganic Cement

  • Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Chemical / Polymer System Type: Silicone

  • Description: Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. Tuffbond epoxies

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive, Thermal / Heat Insulating
    • Form / Function: Encapsulant / Potting Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial

  • Description: HERNON® offers a complete line of ultraviolet curing adhesives and compounds, the Ultrabond® line of products. These products are single component systems offering either ultraviolet light or ultraviolet light & primer initiated curing mechanisms. All Ultrabond® products cure upon

    • Compound Type: Electrical Insulation / Dielectric
    • Form / Function: Encapsulant / Potting Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Optical Grade / Material

  • Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at

    • Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
    • Form / Function: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
    • Industry Applications: OEM / Industrial

  • Description: Sauereisen Electric Refractory Cement No. 350 is a chemically-setting inorganic cement specified for high temperature bonding applications. The product is supplied as a two-component sodium silicate cement consisting of a Powder and Liquid which are mixed together as used. The excellent coating

    • Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
    • Form / Function: Die Bonding Adhesive / Compound, Conformal / Encapsulating Coating, Gap Filling Compound
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
    • Chemical / Polymer System Type: Ceramic / Inorganic Cement

  • Description: is excellent. The hardened compound is an excellent electrical insulator. Color of part A black, part B amber. Master Bond EP21F System is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries for casting, potting, encapsulation

    • Material Type / Grade: Thermoset
    • Chemical / Polymer System Type: Epoxy
    • Resins & Compounds: Liquid
    • Compound Type: Casting Resin

  • Description: . It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21FLVSP is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. EP21FLVSP contains no solvents

    • Material Type / Grade: Thermoset
    • Chemical / Polymer System Type: Epoxy
    • Filler Material: Metal
    • Compound Type: Casting Resin

  • Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic industries such as consumer, military, medical and optical/OEM.

    • Material Type / Grade: Thermoset
    • Chemical / Polymer System Type: Epoxy
    • Compound Type: Liquid
    • Features: Optical Grade

  • Description: CONATHANE EN-1554 is a polyether based polyurethane resin system primarily intended for use as a molding, encapsulating and potting compound for harness breakouts, watertight electrical connectors, cables, cable end seals, printed circuitry and other electrical components.

    • Applications: Electronics / Semiconductors, Other

Page: 1

Parts by Number Top

Part # Distributor Manufacturer Product Category Description
ER2002RP250G ASAP Semiconductor ELECTROLUBE Not Provided ENCAPSULANT, EPOXY, 250G; Potting Compound Type:Epoxy; Dispensin
EL116F/GY ASAP Semiconductor ROBNOR Not Provided RESIN, P/THANE, SEMIRIGID LOW VISCOSITY; Potting Compound Type:P
EL171C/1131 ASAP Semiconductor ROBNOR Not Provided RESIN, POLYURETHANE, FLAME RETARD. 1131G; Potting Compound Type:
2004682 ASAP Semiconductor DowCorning Not Provided RTV SILICONE, 9161, KIT, 0.5KG; Potting Compound Type:Silicone -
CY1301/HY1300 ASAP Semiconductor ARALDITE Not Provided ENCAPSULANT, EPOXY, 730G; Potting Compound Type:Epoxy; Colour:Pa
More >>

Conduct Research Top

  • MICRO: Defect/Yield Analysis - Kumar (January 2001)
    cleanrooms. The outgassing of these compounds from HEPA or ULPA filter polyurethane material (also known as potting compounds) has disrupted processing at several semiconductor facilities. Potting compounds are used to seal the edges of the pleated filter media to HEPA and ULPA filter housings

More Information Top

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