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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
ER2002RP250G ASAP Semiconductor ELECTROLUBE Not Provided ENCAPSULANT, EPOXY, 250G; Potting Compound Type:Epoxy; Dispensin
EL116F/GY ASAP Semiconductor ROBNOR Not Provided RESIN, P/THANE, SEMIRIGID LOW VISCOSITY; Potting Compound Type:P
EL171C/1131 ASAP Semiconductor ROBNOR Not Provided RESIN, POLYURETHANE, FLAME RETARD. 1131G; Potting Compound Type:
2004682 ASAP Semiconductor DowCorning Not Provided RTV SILICONE, 9161, KIT, 0.5KG; Potting Compound Type:Silicone -
CY1301/HY1300 ASAP Semiconductor ARALDITE Not Provided ENCAPSULANT, EPOXY, 730G; Potting Compound Type:Epoxy; Colour:Pa
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Conduct Research Top

  • MICRO: Defect/Yield Analysis - Kumar (January 2001)
    cleanrooms. The outgassing of these compounds from HEPA or ULPA filter polyurethane material (also known as potting compounds) has disrupted processing at several semiconductor facilities. Potting compounds are used to seal the edges of the pleated filter media to HEPA and ULPA filter housings

More Information Top

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  • Industrial Application Of Far-Infrared Lasers
    This paper relates generally a system and techniques for detecting defects such as voids, containments and flaws inside thermoplastic composites, rubber -like materials, or any other far -infrared transparent media such as epoxy resins, potting com- pounds , semi - conductors and polymers, etc.
  • Size-controlled one-pot synthesis of fluorescent cadmium sulfide semiconductor nanoparticles in an apoferritin cavity
    We also reported a simple one- pot synthesis of homogeneous compound semiconductor NPs, CdSe and ZnSe, which fully developed in the cavity by designing a slow-chemical-reaction system and a two-step-synthesis protocol [28–33].
  • Silicone encapsulating and potting materials
    A major application is to pot semiconductors , where the compounds provide protection against moisture and solder during assembly and against physical shock, while also improving heat conduction to the container.
  • Chapter 1: Introduction to Check Point Next Generation with Application Intelligence On GlobalSpec
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds , thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
  • Chapter 5: Structure and Properties of Materials On GlobalSpec
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds , thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
  • PCB Drillability A Material Science Approach to Resin Development On GlobalSpec
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds , thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
  • Chapter 3: Data Warehouse Features On GlobalSpec
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds , thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
  • Chapter 13: DOE Response Surface Methods On GlobalSpec
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds , thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
  • Chapter 8: EMI From the Ground up Maxwell to CISPR On GlobalSpec
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds , thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
  • 2.8: Summary on Logic Synthesis On GlobalSpec
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds , thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
  • Carbon Nanotubes As A Perfectly Conducting Cylinder On GlobalSpec
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds , thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
  • 8.7: References On GlobalSpec
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds , thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
  • Chapter 8: Index of Refraction On GlobalSpec
    Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds , thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.