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Semiconductor Powder
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Abrasive compounds and abrasive slurries are used to improve surface finish or flatness. They often consist of fine abrasives in slurry, bar, powder or paste forms.
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Supplier: Balluff, Inc.Description: within wide limits for foaming, filming, and dirt adherence to the inside or outside tank wall. SmartLevel sensors are suitable for a wide range of demanding applications in semiconductor, medical and pharmaceutical, and process industries. Different housing materials and size emphasize
- Device Classification: Sensor-Only
- Level Measurement Type: Point Level / Multi-Point Levels
- Meter Technology: Capacitive / RF Admittance
- Mounting Options: Side mount
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Supplier: Terra Universal, Inc.Description: Automates low-humidity processing to prevent degradation of moisture-sensitive parts Gas control system auto-adjusts nitrogen purge to maintain humidity set point Ideal for work with semiconductor components, medical devices and pharmaceutical powders Fully integrated turnkey system takes
- Isolator Type: Glovebox
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Superabrasives and Diamond Tools - Premium Line of Nickel-Iron Catalyst Metal Bond Crystal -- MDP(N)Supplier: Advanced Abrasives Corp.Description: The above characteristics make this line the perfect product for High Pressure/High Temperature, semiconductor and microelectronics applications. MDP(N) is also used in wheel fabrication and high precision lapping and polishing applications.
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Supplier: Arkalon Chemical Technologies, LLCDescription: For medium to large scale projects, ACT works closely with two US manufacturing affiliates who maintain modern, state-of-the-art chemical manufacturing . Our affiliates’ plants are designed for flexible manufacturing, both in terms of scale and compositions of matter handled. Included on
- Services Offered: Chemical Processing, Material Processing, Powder Processing, Process Development Services, Process Optimization, Research and Development, Toll Processing Services, Specialty / Other
- Run / Batch Size: Laboratory / Bench, Pilot Scale, Production Lots
- Form: Gas / Liquid Gas, Liquids, Powders, Nanomaterials, Bulk Solids / Granules
- Chemicals / Chemical Products: Acetylenes, Alcohols, Biochemicals / APIs, Catalysts / Initiators, Chemical Agents / Additives, Cleaners / Surface Active Agents, Inorganic Chemicals, Monomers & Intermediates, Organic Chemicals, Pharmaceuticals / Drugs, Pigments / Dyes, Polymers, Reagents, Solvents
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Supplier: Fuji Impulse America Corp.Description: V-301 is effective for maintaining perishable and other food products fresh, and for preventing the oxidation of items such as parts, apparel, chemicals and precision machinery. It is ideal in cases where complete-vacuum packaging is not necessary but de-airing is desirable to maximize the
- Automation: Manual, Semi-Automatic
- Packaging: Bag / Pouch
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Supplier: PAC Machinery GroupDescription: Open, fill, and seal any pre-made bag-on-a-roll with the 1055 Rollbag™ . The 1055 makes a seal without having to remove the filled bag by use of an electric footswitch. The 1055 greatly reduces the amount of time required over a manual opening, filling, and sealing system, creating a short
- Automation: Semi-Automatic
- Packaging: Bag / Pouch
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Supplier: Hitachi Metals America, Ltd.Description: With skyrocketing fossil fuel energy prices, solar power energy is booming as an alternative source of renewable energy. Supplying several markets, Hitachi Metals is a leading manufacturer of sputtering targets, including flat panel display, hard disk drive and semiconductor industries. Our
- Type: Sputtering Target
- Materials Processed: Copper, Molybdenum, Specialty / Other
- Applications: Photovoltaic / Solar
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Description: The Pyrogenics Group is the technological leader in the production of very specialized, high-purity carbon products with unique thermal, electrical, physical and chemical properties that have application advantages where extreme temperatures and stress exist. We are a part of Minerals Technologies
- Services Offered: Process Development
- Form: Bulk Solids / Granules, Nanomaterials / Nanoparticles, Powders
- Chemicals / Chemical Products: Lubricants / Greases
- Materials / Material Products: Abrasives, Carbon / Graphite, Ceramics, Wafers / Semiconductor Materials
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Supplier: Correct Products, Inc.Description: Powder Free Cleanroom Nitrile Gloves are 100% Nitrile which is manufactured to provide the lowest levels of particulates and extractables possible. These ambidextrous nitrile gloves resist a wide range of chemicals including Acetic Acid, Ethylene Glycol, MEK, and Sodium Hydroxide. Nitrile
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Supplier: Stephen Gould CorporationDescription: Each product is unique, and by its nature, packaging each product for market can be a complicated project. But at Stephen Gould, we thrive on the complexities of package design, product insertion, storage and distribution. We carefully, yet seamlessly shepherd these projects from inception to
- Packaging: Bagging, Bar Coding, Blister / Clamshell Packing, Cartoning / Boxing, Custom Hand Assembly, Labeling / Relabeling, Pouching, Repackaging, RFID Tagging, Shrink / Skin Wrapping, Stretch / Over Wrapping, Other
- Specialty Packaging: Club Assortment Sets, Gift Sets / Kits, Liquid Goods, Machinery / Equipment, Paste Goods, Promotional / Display Assembly, Powder / Granular Goods, Sampler Sets, Other
- Industry Served: General Industrial, General Consumer, Automotive, Electronics / Semiconductor, Food / Food Service, Garment / Clothing, Health and Beauty, Household Product, Medical / Surgical, Military / Aerospace, Music / Video / Software, Pharmaceutical, Other
- Services: Assembly Services, Fulfillment Services, Package Testing, Package Design Services, Other
Featured Products for Semiconductor Powder Top
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MDP(N). Premium line of nickel-iron catalyst metal bond crystal. Tight particle size distribution. Blocky and etched surface. Stringent oversize control. Surfaces cleaned to extremely low levels of elemental impurities and ionic content. Specific feed crystal source and monitoring. Majority of sizes are from or proprietary Mesh-to-Micron process. The above characteristics make this line the perfect product for High Pressure/High Temperature, semiconductor and microelectronics applications. MDP... (read more)Browse Diamond Powders and Superabrasive Grains Datasheets for Advanced Abrasives Corp. -
the electro-conductivity that makes electro-discharge machining possible. SUPER-SIALON (HSN-65). Hitachi Metals developed SUPER-SIALON that surpasses even SIALON in strength and thermal shock resistance. This new ceramic material is expected to be used, not only as tools that contact molten aluminum with more severe conditions, but as tools in steelmaking related devices such as continuous galvanizing line and ERW pipe rolling. Its high thermal conductivity is also noted in semiconductor and other fields. (read more)Browse Ceramic Powders and Precursors Datasheets for Hitachi Metals America, Ltd.
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Typical properties of MB-MC diamond: High energy carbon atoms on the surface of the diamond. Surface atoms do not experience the same*hybridization as bulk items (*atomic orbitals of differing type but similar energies combining to yield a set of equivalent hybrid orbitals). Surface atoms will adsorb anything in their path to lower the surface energy. MB-MC micro cleaned diamond is available in a wide size range from 0-0.1 um to 40-60 um for the most demanding high purity manufacturing processes... (read more)Browse Superabrasives and Diamond Tools Datasheets for Saint-Gobain Surface Conditioning Group
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are either chemical resistance epoxy powder coated or anodized for longevity. Nitrogen purged electronics compartments. Load cells utilized for drum level detection provide for a simple robust design. Supported. MEI provides award winning service, installation and support. Installation included. Operations manual and complete design documentation provided... (read more)Browse Semiconductor Wet Process Equipment Datasheets for MEI, LLC
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Automates low-humidity processing to prevent degradation of moisture-sensitive parts. Gas control system auto-adjusts nitrogen purge to maintain humidity set point. Ideal for work with semiconductor components, medical devices and pharmaceutical powders. Fully integrated turnkey system takes seconds to install and program. Terra's Smart Glovebox ™ automatically maintains a low-humidity environment to protect moisture-sensitive parts. Its quick-response feedback system continuously... (read more)Browse Gloveboxes and Isolators Datasheets for Terra Universal, Inc.
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an intuitive "icon-driven" touch screen interface for easy operation and a built-in printer for convenience. The shuttered 50kV X-ray tube and Peltier cooled semiconductor detector deliver exceptional short-term repeatability and long-term reproducibility with excellent element peak resolution. This high voltage capability (50 kV), along with multiple automated X-ray tube filters, provides a wide range of applications versatility and low limits-of-detection (LOD). Options include fundamental... (read more)Browse X-Ray Fluorescence Spectrometers Datasheets for Rigaku Corporation
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provide additional tensile strength and fracture toughness to the parts. Since tungsten-base alloys are normally hard to machine or cast, they are best shaped via MIM process, which can easily achieve highly compex net-shapes and high final densities. Interestingly, tungsten-copper alloy has nothing to do with wear applications. Due to the high thermal conductivity of copper and the low thermal expansion of tungsten, W-Cu powders are best suited for thermal management components and semiconductor... (read more)Browse Datasheets for Qingdao Eversun Precision Manufacture Co., Ltd.
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Elmet has been providing Molybdenum and Tungsten sputtering targets to numerous industries for many applications for decades. Our high quality targets are used in many of the most challenging industries including Flat Panel Display (FPD), semiconductor (memory and logic), and Thin-Film Photovoltaic (TFPV). Our vertically integrated process is designed to ensure the highest quality materials are delivered to our customers. Innovating. As requirements for each industry has changed, Elmet has... (read more)Browse Thin Film Materials Datasheets for Elmet Technologies, Inc.
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mercury and zinc. Other typical end uses for molybdenum products are high temperature furnace tooling, fixtures and heat shields. Also, moly-firing boats of folded, welded and riveted construction are used in processing alumina ceramics as well as uranium oxide nuclear fuel pellets. In the semiconductor, electronics and lighting industries, moly has such varied application as: silicon rectifier mounts (diode heat sinks), glass-to-metal sealed parts, grids, wire and rod support components for power... (read more)Browse Molybdenum and Molybdenum Alloys Datasheets for Elmet Technologies, Inc.
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technologies utilize the company's extensive knowledge of special glasses and glass powder manufacturing techniques, sinter technology, special metal processing, joining techniques, interfacial reactions, plating operations and co-fired ceramic technologies (HTCC, LTCC). SCHOTT's hermetic, vacuum-tight packages can be used for a variety of military applications: Transistor Outlines (TOs) for semiconductor and hybrid packages for laser detection devices. Infrared and standard opto-electronic sensor... (read more)Browse Hermetic Sealing Services Datasheets for SCHOTT North America, Inc. - Defense
Parts by Number for Semiconductor Powder Top
| Partb # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 4.330030346E+011 | ASAP Semiconductor | PHIL | Not Provided | SUPPRESSOR 50UH IRON POWDER CHOKE |
| T50-G | ASAP Semiconductor | MICRO METAL | Not Provided | MIL SPEC POWDER CORE |
| AC12169 | ASAP Semiconductor | NORAZZA, INC | Not Provided | 3.38 x 4.5 x 1.5 - Leather - Powder Blue |
| R56003/L- | ASAP Semiconductor | PAL INTERNATIONAL | Not Provided | PAL LATEX GLOVE POWDER FREE 4AQL LG-100; Safety Category:EN402; |
Conduct Research Top
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Lubricants For Semiconductor Manufacturing Equipment
Aerospace manufacturers long ago solved the problem of lubricant outgassing, contamination, and starvation. Their work is now reaping benefits in the semiconductor industry. Ultrafiltration removes microscopic contaminants from oils and greases and homogenizes agglomerated thickener in grease
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Lubricants for Semiconductor Manufacturing Equipment (.pdf)
While speed, uniformity, and cleanliness have made automated assembly equipment the norm in semiconductor manufacturing, they also have posed a conundrum regarding lubricants. ./811260f0-cd75-4ae8-a4a0-a090fd5c62bf W hile speed, uniformity, and cleanliness. have made automated assembly equip
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Designing Safe, Low-cost Vacuum and Exhaust Gas Management Systems for Semiconductor Processes (.pdf)
Vacuum and exhaust gas management are critical components of semiconductor manufacturing. While these systems are usually hidden away out of sight-and out of mind-in the process tool or the sub fab, they are vital to efficient and safe manufacturing. Vacuum systems remove potentially hazardous
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Solder Powder: IPC
solder paste users) group to help Brian Toleno, chair of the IPC 5-24b (Solder Paste Task Group) put the finishing touches to the final version of the J-STD-005A. Semiconductor / Power Semiconductor Assembly | INDIUM. Indium Corporation. Semiconductor / Power Semiconductor Assembly. Visit Our Website
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Flouroplastics
covers, chemical-resistant linings for process-equipment components, and in semiconductor processing equipment. Materials do not adhere readily to the slippery surface of FEP, PFA, and PTFE parts. Surfaces can be chemically etched, however, to permit bonding with adhesives. Thus, low-friction surfaces
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Medical Device Link .
The earliest recorded use of CIM technology was in the 1930s when, for only a short time, an early version of the technique was used to make spark plugs. However, most experts agree that modern CIM processing began in the late 1960s when it was found to be valuable for manufacturing semiconductor
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Wafer & Substrate Bumping with Solder Paste
diameter"? There are some "rules of thumb" on this in the electronics assembly industry, and I'll go into them later. In my next posting, I'll show why they may not be relevant or appropriate for the standard waferbumping process. Wafer and Substrate Bumping with Solder Paste (I) - Semiconductor
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Semicon West Puts Photovoltaics, Thin-Film Batteries in the Limelight
quot;It's been another tough year for the semiconductor equipment market." So says Dan Tracy, Senior Director of Industry Research and Statistics at Semiconductor Equipment and Materials International, the association for the semiconductor industry. No question the economic environment has
Engineering Web Search: Semiconductor Powder Top
- Silicon - Wikipedia, the free encyclopedia
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Electroluminescence - Wikipedia, the free encyclopedia
Electroluminescence is the result of radiative recombination of electrons and holes in a material, usually a semiconductor.
- contact us - SAMSUNG
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Equipment, Industrial Equipment, Analytical Instruments,...
Microelectronics and Semiconductor Nanotechnology Classical Dry Powder Media Classical Liquid Media
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Homepage | EDN
Semiconductor Manufacturing Hot Topics New power semiconductor technologies challenge assembly and system setups 04/16/12
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EDN Hot 100 products - 2010-12-15 19:00:00 | EDN
Semiconductor Manufacturing Hot Topics
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semiconductor - offers from semiconductor manufacturers,...
semiconductor manufacturers, exporters, suppliers, factories and distributors related to semiconductor
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Themosetting Composition for Optical Semiconductor, Die Bond...
for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for
