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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
0485136   Umicore Materials Thin Film Materials Sputtering Targets for Semiconductors Applications. Semiconductors and electronics play a major role in our world. Just about everything from consumer goods, transportation, housing and manufacturing infrastructure, to large area information systems in based on such technologies. Umicore Thin Film...
Tantalum Sputtering Targets   H.C. Starck Inc. - Fabricated Products Group Thin Film Materials and careful control of all aspects of the process. USES. Tantalum targets are used in the sputtering process to make thin coatings on magnetic recording media, printer components, flat panel displays, optical and industrial glass, and thin film resistors. Tantalum is similar to glass in its extreme...
Hitachi Metals Target Materials   Hitachi Metals America, Ltd. Thin Film Materials Hitachi Metals offers unique sputtering target materials, thus responding to increasing demand for a variety of applications. Semiconductors. We offer high-purity Ti Target with a uniform and fine crystallized microstructure (Grain size: less than 10m) for LSI barrier metals. It is capable...
Molybdenum-Rhenium Sheet   Rhenium Alloys, Inc. Metal Shapes and Stock in furnace parts and tooling along with feed stocks for the electronic and semiconductor industries. Typical Applications. • Aerospace Propulsion. • Radar Systems. • Components. • Radiation Shields. • Sputtering Targets. • Heating Elements. • Shields & Liners...
Yttrium Pure Metal Consumable for Electronics   Umicore Materials Metal Shapes and Stock sells and recycles high-quality coating materials for thin film applications in the advanced packaging, compounds, micro systems, and silicon fron end segments. Due to a strong cooperation with leading system manufacturer, Umicore TFP provides sputtering targets and evaporation materials to a wide...

Conduct Research Top

  • Sputtering Targets and Sputtered Films: Technology and Markets
    fabricated in a variety of shapes, sizes, and materials, to obtain thin films with desired properties during fabrication of a broad range of advanced devices and coatings. This study covers the utilization of sputtering targets in 25 applications (e.g., semiconductors, passive components, optical
  • A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly (.pdf)
    As semiconductor processing has moved to 300mm wafers, the size of deposition targets, including tungsten, tantalum, and molybdenum has grown, and process complexity has increased as well. This added size and complexity contributes to the stress on a target assembly during the physical vapor
  • MICRO: Controlling particles in sputter deposition modules
    of particle contamination are generally found within the deposition module itself. Research and development studies performed by Trikon Technologies (Newport, UK) have identified various potential sources of contamination within its Sigma sputter deposition module. After briefly describing the sputtering
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Holding AG alleging patent infringement on hard disk sputtering technology. Analog Devices plants DSP on TI's doorstep Analog Devices Inc. is creeping up on rival Texas Instruments Inc. in unexpected ways. Weak microprocesor market dampens earnings picture Like the lazy days of summer, it has been
  • MICRO: Process Tool Support
    semiconductor manufacturing processes, some of which are also used in the manufacture of disk media and flat-panel displays. Processes that deposit thin films, such as sputtering and CVD, and processes that remove thin films, such as plasma etching and CMP, are especially prone to contamination from process
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    U.S.-based Intevac has apparently filed a patent infringement lawsuit in U.S District Court in Los Angeles against Switzerland's Unaxis Holding AG alleging patent infringement on hard disk sputtering technology. Blaze DFM says new MO release up to 5X faster Blaze DFM released version 1.1
  • MICRO: Lead
    be called an "alliance, " says its new Commodity Consumables Services initiative will offer fabs one-stop shopping for generic commodities such as O-rings, seals, and filters. The Connecticut-based unit of Praxair specializes in gases, materials, sputtering targets, slurries, and other process
  • MICRO: Product Technology News (January 2001)
    Plus aluminum sputtering target for advanced semiconductor manufacturing features fine average grain size and low particle generation for optimal film uniformity and

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