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  • Sputtering Targets and Sputtered Films: Technology and Markets
    fabricated in a variety of shapes, sizes, and materials, to obtain thin films with desired properties during fabrication of a broad range of advanced devices and coatings. This study covers the utilization of sputtering targets in 25 applications (e.g., semiconductors, passive components, optical
  • Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)
    organizations and. metallic sputtering targets, as well as how to verify the performance of these. technical seminars, and has authored. targets during operation. technical papers on thermal man-. agement, as well as semiconductor. packaging assembly. introduction. of the attention in the PVD process. email
  • A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly (.pdf)
    . A Room Temperature Low Stress Bonding Process for Sputtering Target Assembly Indium Corporation Tech Paper. A Room Temperature, Low-Stress Bonding. Process to Reduce the Impact of Use Stress. on a Sputtering Target Assembly. Authored by: Amanda Hartnett, Jacques Matteau, Ronnie Spraker
  • MICRO: Controlling particles in sputter deposition modules
    of particle contamination are generally found within the deposition module itself. Research and development studies performed by Trikon Technologies (Newport, UK) have identified various potential sources of contamination within its Sigma sputter deposition module. After briefly describing the sputtering
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Holding AG alleging patent infringement on hard disk sputtering technology. Analog Devices plants DSP on TI's doorstep Analog Devices Inc. is creeping up on rival Texas Instruments Inc. in unexpected ways. Weak microprocesor market dampens earnings picture Like the lazy days of summer, it has been
  • A SIMS Primer
    is bombarded by a beam of ions, the primary ions, which sputter erode the surface. As a result of the energetic sputtering process, some of the ejected material (either atoms or molecules) is ionised, the secondary ions, and can thus be directed towards the mass spectrometer where detection is made
  • MICRO: Process Tool Support
    semiconductor manufacturing processes, some of which are also used in the manufacture of disk media and flat-panel displays. Processes that deposit thin films, such as sputtering and CVD, and processes that remove thin films, such as plasma etching and CMP, are especially prone to contamination from process
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    U.S.-based Intevac has apparently filed a patent infringement lawsuit in U.S District Court in Los Angeles against Switzerland's Unaxis Holding AG alleging patent infringement on hard disk sputtering technology. Blaze DFM says new MO release up to 5X faster Blaze DFM released version 1.1