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Semiconductor Substrate
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RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
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Supplier: Epoxy TechnologyDescription: Durable LED lights need reliable and strong components. With our molybdenum and MoCu wafer substrates, a service life of 100 000 operating hours of the LED chip is easily achievable. The semiconductor layers in LED chips convert electrical current into light. They consist of an area of excess
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Supplier: JST Manufacturing, Inc.Description: , the L200 series performs exceptionally precise optical inspection of wafers, photo masks, reticles and other substrates.
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Supplier: CoorsTekDescription: ; Bonding ferrites and magnets for electronic sub-assemblies o Semiconductor: die attach onto substrates; COB and direct-chip attach o Hybrid: bonding heat sinks and substrate attach to metal case o Opto-electronic: active alignment of optics and fiber optic components • Contact
- Compound Type: Thermal Compound / Thermally Conductive
- Material Form: Casting Resin
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Master Bond, Inc.Description: Hermetically Sealed, Multi-Layer Channeled Structures Developed for specialized applications in the semiconductor, electronic, and medical industries, CoorsTek hermetically sealed, multi-layer channeled structures provide a high-purity, corrosion-resistant path for fluids or air vacuum
- Material Form: Fabricated Part / Shaped Stock, Wafer / Substrate
- Features: Electronics / Semiconductors, Electrical Power / HV
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Supplier: Insaco, Inc.Description: Master Bond Polymer System EP121-1 is a two component high performance epoxy resin compound specially formulated for self crowning (glob-top) and other semiconductor encapsulant applications. It features remarkable resistance to thermal shock and moisture, high substrate adhesion and excellent
- Industry: Electronics, Electrical Power / HV
- Chemical / Polymer System Type: Specialty / Other, Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Features: Electrically Insulating / Dielectric, Encapsulating / Potting
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Supplier: Dayoptics, Inc.Description: Alumina (Al2O3) is one of the most widely specified, general-purpose technical ceramics. All aluminas are very hard and wear resistant, with high compressive strength even against extreme temperatures and corrosive environments. Aluminas are also excellent electrical insulators and are gas tight.
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Supplier: Foctek Photonics, Inc.Description: Optics; Windows for High Temperature and Pressure, Corrosion Resistance, Abrasion Resistance; Heat Sinders and Thermocouplers; Semiconductor Wafer Carriers; Electrical Insulators; Thin Film Deposition; Transparent Electronic Substrate; Silicon on Sapphire Wafers; Superconductor Substrate.
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Supplier: Saint-Gobain Surface Conditioning GroupDescription: Optics; Windows for High Temperature and Pressure, Corrosion Resistance, Abrasion Resistance; Heat Sinders and Thermocouplers; Semiconductor Wafer Carriers; Electrical Insulators; Thin Film Deposition; Transparent Electronic Substrate; Silicon on Sapphire Wafers; Superconductor Substrate.
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Supplier: Nikon Metrology, Inc.Description: AmberClean™ SWR Aqueous Silicon Wafer Cleaner AmberClean™ SWR is a biodegradable, aqueous cleaner which does not contain volatile organic compounds (VOCs). It is specifically formulated to flush and disperse ceramic, silicon and other lapping and slicing fines from substrate
- Type: Aerosol / Contact Cleaner, Cleaner / Cleaning Agent
- Aqueous / Water-based: Yes
- pH: Alkaline Cleaner (11 to 12.5 pH)
- Features: Biodegradable, VOC Compliant
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Supplier: MEI, LLCDescription: Manual Wafer Loading or Automated Transfer Precision Distance Control Between nozzles & Water Chemical mixing/Blending to .02 ml accuracy Chemical Dispense & Recycling Precision wafer speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm. Multi Substrate Size
Featured Products for Semiconductor Substrate Top
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and doors. "We are excited to debut Simriz 499, our latest Simriz material innovation for the semiconductor industry," said Vinay Nilkanth, vice president, business development, Simrit. "Simriz 499 is a testament to Simrit's commitment of continually striving to offer our customers the best, most evolved materials and technologies that meet their specific needs.". The 75 durometer clear perfluoroelastomer material has a service temperature range of -6 to 280 degrees Celsius (21 to 236 degrees... (read more)Browse O-rings Datasheets for Simrit -
Contamination problems solved with precision ceramic gearing. Problem: A semiconductor processor was having contamination problems from metal and plastic gears due to intense chemical, thermal and high vacuum conditions. They were considering technical ceramics for chemical resistance, however precision pinion gear teeth must be not only uniform, but strong enough to survive load. Solution: Based on fine features and point stresses in application of a precision ceramic gear Insaco recommended... (read more)Browse Oxide Ceramics Datasheets for Insaco, Inc.
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for wafers that require metal lift-off processing. Rogue Valley Microdevices has the ability to provide the complete device fabrication for our customers. All films are processed in a class 100 cleanroom and we use only high grade ultra-clean semiconductor grade metals. Rogue Valley Microdevices can provide the starting wafer substrates, Dielectric Films, Nitride Films, Photolithography, Metal Films, Resist, Exposure, Metal Lift-Off, and Etch. Here is a current list of Sputtered Films and Evaporated... (read more)Browse Semiconductor Foundry Services Datasheets for Rogue Valley Microdevices, Inc.
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This module is designed to drop into an existing workstatin or let JST design one for you! (read more)Browse Semiconductor Wet Process Equipment Datasheets for JST Manufacturing, Inc.
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Valley Microdevices can also customize and develop a process to meet customer requirements. In many cases the temperature, ramp rates and gas flows can be modified to achieve the result you are looking for. Our Medford, Oregon facility has the ability to do complete device fabrication so Rogue Valley Microdevices can also provide the starting wafer substrates, Oxides, Nitrides, Photolithography, Metals, Resist, Exposure, Lift-Off, and Etch. Rogue Valley Microdevices offers the following Thermal... (read more)Browse Semiconductor Foundry Services Datasheets for Rogue Valley Microdevices, Inc.
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enables sequential laminations to be performed at lower temperatures than those normally used for FEP and PFA in military constructions. fastRise ™27 offers high performance in mm-Wave antenna, military, semiconductor test and other applications that require low loss at high frequencies. This fiberglass free, laser ablatable prepreg has a stable Dk over temperature and is a low temperature alternative to thermoplastic films in military designs. This materials also eliminates the need... (read more)Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Taconic
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that is tailored for your specific process needs. MEI Evolution systems are suitable for a wide variety of cleaning, etching and stripping applications, including all substrate types used in solar cell, IC, Medical and MEMS device manufacturing as well as parts cleaning applications. Configurability, up-time, yield, maintainability and throughput are the hallmarks of an MEI wet processing system. Dry to Dry High Throughput, Process Multiple Lots and Recipes Simultaneously. For production lines with many... (read more)Browse Semiconductor Wet Process Equipment Datasheets for MEI, LLC
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efficiently to its intended target. "Datec is enabling the next generation of products for the consumer, medical, semiconductor, aerospace, and automotive heating markets," added Mr. Talalla. For more information, please visit the Victrex website at www.victrex.com. (read more)Browse Industrial Coatings Datasheets for Victrex plc.
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consumption. · Electricity cost savings for flexible heaters. · Electricity cost savings for facility air conditioning. 3. Longer service life. · Silicone foam degrades at operating temperature over 180°C. 4. Particle free. · Thermal insulation material is totally sealed in robust silicone rubber. 5. Adheres well to Arlon's uncured flexible heater substrate compounds. 6. Is easily bonded to Arlon's flexible heater substrates. There are two product options: 680-R3839R and 680-R3844R. Both products... (read more)Browse Thermal Insulation and Fireproofing Materials Datasheets for Arlon LLC - Silicone Technologies Division
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Fabricated in a dielectrically isolated, complementary bipolar process, each transistor is electrically insulated from the others by a layer of insulating oxide (and not the reverse-biased PN junctions used in conventional arrays) and exhibit inter-device crosstalk and DC isolation similar to TT Semiconductor expected from discrete transistors. The resulting low collector-to-substrate capacitance produces a typical NPN fT of 350MHz (325 MHz for the PNPs). Substrate biasing is not required... (read more)Browse Datasheets for TT Semiconductor, Inc.
Parts by Number for Semiconductor Substrate Top
| Partb # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 8699421 | ASAP Semiconductor | C-MAC | Not Provided | 50SR SUBSTRATE |
| 8699111 | ASAP Semiconductor | C-MAC | Not Provided | SRS SUBSTRATE |
| 10L CERPAK SUBSTRATES | AmericanMicroSemi | AMS | Other | DIODE ARRAY |
Conduct Research Top
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Semiconductor Inspection
There are a number of techniques that are utilised today in the post process on line optical inspection of semiconductor wafers. These include: * Spectroscopic reflectometry where multiple laser wavelengths are shone down onto the surface of the thick film covered substrate to obtain information
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Semiconductor Manufacturing Handbook
PROCESSES: SEMICONDUCTOR FUNDAMENTALS. How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask. WAFER PROCESSING TECHNOLOGIES. Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning. FINAL
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Organic semiconductor devices for micro-optical applications
of an organic semiconductor material into a single-mode polymethylmethacrylate (PMMA). waveguide. Invited Paper. Organic semiconductor devices for micro-optical applications. Martin Punke, Steffen Mozer, Marc Stroisch,. Martina Gerken, Georg Bastian and Uli Lemmer. Universität Karlsruhe (TH), Light
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Optical Ceramics and Semiconductor Ceramics
are examples of ceramic materials with optical applications. Ceramics and other non-metallic compounds or elemental semiconductors are used as substrates and wafers in semiconductor manufacturing. Optical ceramics and semiconductor ceramics also used for wafer chucks, wafer furnace boats and thin film
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Wafer & Substrate Bumping with Solder Paste
diameter"? There are some "rules of thumb" on this in the electronics assembly industry, and I'll go into them later. In my next posting, I'll show why they may not be relevant or appropriate for the standard waferbumping process. Wafer and Substrate Bumping with Solder Paste (I) - Semiconductor
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Two Solutions to Static Problems in Semiconductor Die Bonder Operation (.pdf)
One phase of the semiconductor manufacturing process involves a die bonding machine. Several manufactures produce this type of equipment, with similar designs for the actual bonding operation. A fine gold wire (approximately 2 mil. In diameter) is attached from the semiconductor component
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Semiconductor Micromachining Using Diode-Pumped Solid-State Lasers
Laser micromachining of semiconductor materials such as silicon and sapphire has attracted more and more attention in recent years. High precision laser cutting and drilling processes have been successfully used in semiconductor, photonics, optoelectronics, and microelectromechanical system (MEMS
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Large Thin Organic PTFE Substrates for Multichip Applications
Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices. The electrical advantages offered by the use of a thin PTFE composite substrate were coupled with intrinsic
Engineering Web Search: Semiconductor Substrate Top
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CMOS - Wikipedia, the free encyclopedia
Complementary metal?oxide?semiconductor (CMOS) ( /?si?m?s/) is a technology for constructing integrated circuits.
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MOSFET - Wikipedia, the free encyclopedia
in type to the substrate, so nMOS is made with a p-type substrate, and pMOS with an n-type substrate (see article on semiconductor devices). In the
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Method for manufacturing semiconductor substrate and...
Method for manufacturing semiconductor substrate and semiconductor substrate -> Monitor Keywords
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Group iii nitride semiconductor crystal growing method, group...
Group iii nitride semiconductor crystal growing method, group iii nitride semiconductor crystal substrate fabrication method, and group iii nitride
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SEMICONDUCTOR CHIP MOUNTING SUBSTRATE, SEMICONDUCTOR CHIP...
There is provided a semiconductor chip mounting substrate including a substrate on which a mounting region for mounting a semiconductor chip and a
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COATING OF SUBSTRATE CONTAINING SEMICONDUCTOR REGION OR OF...
COATING OF SUBSTRATE CONTAINING SEMICONDUCTOR REGION OR OF SEMICONDUCTOR SUBSTRATE
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American Semiconductor, Inc.
American Semiconductor, Inc. is your complete silicon fabrication source from concept to fabrication.
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Semiconductor Today
Semiconductor Today : the first choice for professionals who demand timely, focused, top-quality coverage of the compound semiconductor industry.
