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Semiconductor Thermoplastic

 

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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Parts by Number for Semiconductor Thermoplastic Top

Partb # Distributor Manufacturer Product Category Description
SPK-A0157 ASAP Semiconductor SPECK PRODUCTS Not Provided Thermoplastic Elastomer (TPE), Polycarbonate
SPK-A0131 ASAP Semiconductor SPECK PRODUCTS Not Provided Textured - Matte - Thermoplastic Polyurethane
0859.0075 ASAP Semiconductor SCHURTER Not Provided SCHURTER - 0859.0075 - INSULATING COVER, THERMOPLASTIC
0859.0077 ASAP Semiconductor SCHURTER Not Provided SCHURTER - 0859.0077 - INSULATING COVER, THERMOPLASTIC
0859.0048 ASAP Semiconductor SCHURTER Not Provided SCHURTER - 0859.0048 - INSULATING COVER, THERMOPLASTIC

Conduct Research Top

  • 3 Approaches to Using High Power Diode Laser to Join Thermoplastics (.pdf)
    , fasteners, ultrasonic or vibration welding may. bias mode (+ on the p-side), electrons are infused across. no longer suffice. the P-N junction and into the semiconductor to create. photons. These photons are then emitted in all directions. Conventional lasers, such as the CO. from the plane on the P-N
  • Melt Processable, Fiberglass Reinforced, High Heat Thermoplastic Polyimides (.pdf)
    temperature (Tg) of. 267°C. These resins have been successfully applied in the. Experimental. automotive, semiconductor, and electrical insulation. industry. With excellent Flame, Smoke and Toxicity. Injection molding of standard ASTM parts (Tensile,. (FST) values, OSU Burn Ratings, and good solvent
  • TA002: Backside Mounting Procedures for Semiconductor Wafer Processing
    from wax, which was. tamination between sputter targets is. diluted in trichloroethylene. being evaluated for batch systems because. (TCE), to a thermoplastic adhe-. both frontside and backside sputter pro-. sive. The thermoplastic adhesive. cesses are expected to be done in the same. has a much higher
  • Flouroplastics
    covers, chemical-resistant linings for process-equipment components, and in semiconductor processing equipment. Materials do not adhere readily to the slippery surface of FEP, PFA, and PTFE parts. Surfaces can be chemically etched, however, to permit bonding with adhesives. Thus, low-friction surfaces
  • Tough Enough
    High-performance plastics handle caustic chemicals, high temperatures, and destructive processes seen on semiconductor fabrication lines. Advanced engineering plastics such as PEEK and PPS stand up to environments that would quickly destroy metals. Effect of temperature on the stiffness of advanced
  • More metal parts go to composites
    Stiff and stable composites are competing for duty in semiconductor applications traditionally handled by metals and ceramics. It's no secret that suppliers of engineered materials must work closely with designers to develop products that meet specific needs. This is particularly true
  • Plastic pads give silicon wafers TLC
    Piper Plastics Inc., Chandler, Ariz., wanted to injection mold end-effector pads for use in semiconductor manufacturing. Though exposed to organic chemicals and high temperatures, end-effector pads molded from Victrex T-Series polymers retain their properties. The proprietary PEEK/PBI blend
  • Semicon West --Business is back
    The official theme of this year's premier semiconductor manufacturing exposition is "Where People Define Tomorrow. " But a more appropriate moniker might be something like, "Oh what a relief!" After three crummy years, the semiconductor manufacturing business has gone from a few signs of life

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