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Semiconductor Underfill
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Supplier: Epoxy TechnologyDescription: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive and sealing applications in electronics, optical, and medical devices.
- Compound Type: Optical Grade / Material
- Electrical / Electronics Applications: Optoelectronics / Photonics, Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Epoxy TechnologyDescription: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive and sealing applications in electronics, optical, and medical devices.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Resins & Compounds: Liquid
- Compound Type: Casting Resin
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Supplier: Epoxy TechnologyDescription: A single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. It can be used as an underfill for flip chip mounted ICs, BGAs, and sensor device packaging. Also available in a frozen syringe.
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Epoxy TechnologyDescription: A two component, thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging including glob top and underfill, hybrid microelectronics, optical, and medical. It is a smaller particle size version
- Compound Type: Thermal Compound / Thermally Conductive
- Material Form: Casting Resin
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Epoxy TechnologyDescription: A two component, thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging including glob top and underfill, hybrid microelectronics, optical, and medical. It is a smaller particle size version
- Compound Type: Thermal Compound / Thermally Conductive
- Material Form: Casting Resin
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Epoxy TechnologyDescription: A two component, thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging including glob top and underfill, hybrid microelectronics, optical, and medical. It is a smaller particle size version
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Epoxy TechnologyDescription: A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip underfill, sealing sensor devices packaged in TO-cans or fiber optic feed-through
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Epoxy TechnologyDescription: the “piston effect” . o Semiconductor �� As underfill of flip chip devices and SMDs like BGAs, capacitors and resistors. o Medical �� As an alternative to EPO-TEK® 353ND for moisture resistance. • Capable of short cure cycles at low temperature
- Compound Type: Optical Grade / Material
- Material Form: Casting Resin
- Electrical / Electronics Applications: Optoelectronics / Photonics, Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Master Bond, Inc.Description: Master Bond Polymer System EP3RRLV is a one component, low viscosity tough epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 220-250°F. This unique formulation offers high physical strength properties, good thermal
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Grease / Gel, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors
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Supplier: Master Bond, Inc.Description: flexible cure schedules so as to best meet specific application requirements. This product is proving particularly effective for underfill applications. It is 100% reactive and does not contain solvents or diluents. All ingredients are TOSCA listed. Master Bond Polymer System EP3HTFL is available
- Substrate / Material Compatibility: Composites, Metal, Plastic, Porous Surfaces
- Industry: Automotive, Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System, Specialty / Other
Featured Products for Semiconductor Underfill Top
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New High Quality, Low Cost Underfill Encapsulant Developed for Semiconductor Packaging and Assembly Industries. LORD ME-555 underfill encapsulant is a high purity, semiconductor grade epoxy underfill material for the encapsulation of flip chip devices. Developed to meet technical requirements of customers, LORD has been able to present this material with a significant cost reduction compared to competitive underfill materials. LORD Corporation has announced a new, low cost underfill encapsulant... (read more)Browse Epoxy Adhesives Datasheets for LORD Corporation -
Semiconductor: capillary flow underfill for Flip Chip mounted die. Fiber Optic: polarizing maintaining fibers ( PMF ) found in gyroscope coils; fiber termination into ferrule. Medical: impregnation into fiber optic light guides and endoscopes; resist autoclave, ETO, or gamma sterilization. Electronics: impregnating copper coil windings found in motors or SMD inductor coils; adhesion to ferrite cores Featured inside Technical Paper #11 titled ―Significance of Glass Transition Temperature on Epoxy... (read more)Browse Epoxy Adhesives Datasheets for Epoxy Technology
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EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties. EPO-TEK® 301 Advantages & Suggested Application Notes: Semiconductor: optical glob top or underfill; adhesion to common wafer passivation, solder mask and flex circuits; compatible with LED die, Si, GaAs. PCB: general potting and protection over FR4, flex, or ceramic PCBs. Medical: It is NONTOXIC —complying with USP Class VI Biocompatibility... (read more)Browse Epoxy Adhesives Datasheets for Epoxy Technology
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New High Quality, Low Cost Underfill Encapsulant Developed for Semiconductor Packaging and Assembly Industries. LORD ME-555 underfill encapsulant is a high purity, semiconductor grade epoxy underfill material for the encapsulation of flip chip devices. Developed to meet technical requirements of customers, LORD has been able to present this material with a significant cost reduction compared to competitive underfill materials. LORD Corporation has announced a new, low cost underfill encapsulant... (read more)Browse Epoxy Adhesives Datasheets for LORD Corporation
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Trusted Motion Experts. Custom gearbox components to complete solutions. CGI Motion enables design excellence across a wide range of semiconductor applications. We thrive on customer driven innovation in delivering solutions ranging from wafer handling robots to silicon crystal growing. We are your outsourced partner helping to differentiate your product, machine or innovation. Our team of problem solving engineers and product managers can bring your application to market on-time and under... (read more)Browse Gearboxes and Gearheads Datasheets for CGI, Inc.
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RMI Laser marking systems are ideal for laser marking highly sensitive components. The High Power Density and Extremely Fast Pulse Rate allow Precision Marking without heating the surrounding area. Coupled with precision power control and a spot size as low as 20 microns, RMI Laser Markers can permanently mark directly onto Printed Circuit Boards, Integrated Circuits, Wafers, and a variety of other Semiconductor materials. With units in both 532nm and 1064nm wavelengths, and wattages ranging... (read more)Browse Laser Engraving and Laser Marking Machines Datasheets for RMI Laser, LLC
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PEI's photochemically-etched surface-mount and insert-mount lead frames for integrated circuit manufacturing are used in a wide variety of applications including semiconductors, glass-to-metal seals, and relays, and are also used in medical applications such as implantables and hearing aids. Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEI can plate lead frames in their entirety or selectively. Lead-free plating materials include silver, nickel, gold... (read more)Browse Electrochemical, Photochemical, and Chemical Milling Services Datasheets for Photofabrication Engineering, Inc. (PEI)
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Contact TT Semiconductor for solutions for rugged, reliable, extended temperature semiconductor. products today. (read more)Browse EEPROM Datasheets for TT Semiconductor, Inc.
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The semiconductor and electronic industry is depending on high quality standards. Therefore they profit from the high precision of the CHRocodiles with a lateral resolution of microns and height resolution of submicrons. Typical applications: measurement of structures on semiconducturs, manufacturing of masks. quality assurance on bondings (length of leads etc.). measurement of transparent coatings. determination of varnish thickness (e.g. photo lacquer or damping layer on ICs). And the best... (read more)Browse Dimensional Gages and Instruments Datasheets for Precitec, Inc.
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Panasonic Semiconductors Through Hole LEDs offer diffused lenses, available in square or round lens shape types. The square lens LEDs come in a variety of sizes ranging from 3 x 2mm to 3 x 7mm. The round lens LEDs are available in diameters of 2.0 and 2.6mm. Panasonic Semiconductors Through Hole LEDs are offered in three colors: red, yellow green, and orange. Specifications. Lens style: Diffused. Operating current: 25-30mA. Operating voltage: 2.1-2.2V. Pulse forward current: 150mA. Reverse... (read more)Browse Light Emitting Diodes (LED) Datasheets for Mouser Electronics, Inc.
Engineering Web Search: Semiconductor Underfill Top
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SEMICONDUCTOR CHIP PACKAGE AND METHOD OF FABRICATING THE SAME...
a substrate;forming a first underfill on a first portion of the substrate;forming a second underfill on a second portion of the substrate, the second
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Themosetting Composition for Optical Semiconductor, Die Bond...
for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for
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National Semiconductor To Lead Government/Industry Research To...
Santa Clara, CA, October 8, 1998 -- National Semiconductor Corporation Ò has been chosen by the US government's National Institute of Standards and
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National Semiconductor Press Room - Wafers, Circuits and Chip Shots
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Speedline Technologies - ACCEL, CAMALOT, MPM, and...
Underfill-Dispensing Wave Soldering Support/Training
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Sheet-like Underfill Material And Semiconductor Device...
Sheet-like underfill material and semiconductor device manufacturing method -> Monitor Keywords
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Flip-chip Semiconductor Package And Chip Carrier Thereof...
No. 6,734,567 suggests a flip-chip semiconductor package comprising a flip chip 20 and a substrate 21, wherein the substrate 21 has a metal ring 24
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dispensing underfill resin in a continuous manner at all peripheral edges of said semiconductor die; Method of underfill air vent for flipchip BGA
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Semiconductor Plastic Packaging Materials Market to Reach...
The report, titled â??Global Semiconductor Packaging Materials Outlook- 2005 Edition,â?? covers laminate substrates, flex circuit/tape substrates,
- PACKAGING MATERIALS: MARKET CHALLENGES AND OPPORTUNITIES |...
