Sites:

Welcome to GlobalSpec!
Find parts, products, suppliers, datasheets, and more for:

Semiconductor Wafer

Products & Services

See also: Categories | Featured Products | Parts by Number | Technical Articles | Engineering Web Results
Page: 1 2 3 4 5 6 7 8 Next

Find Suppliers by Category Top


Parts by Number for Semiconductor Wafer Top

Part # Distributor Manufacturer Product Category Description
LM101A WAFER ASAP Semiconductor NSC Not Provided Not Provided
2N3019 WAFER ASAP Semiconductor MOTO Not Provided Not Provided
NC3V3 WAFER ASAP Semiconductor ZETEX Not Provided Not Provided
TR6811FA WAFER ASAP Semiconductor CMD Not Provided Not Provided
501XCG002 WAFER ASAP Semiconductor SOLITRON Not Provided Not Provided
SMCS572 WAFER ASAP Semiconductor MOTOROLA Not Provided Not Provided
More >>

Conduct Research Top

  • Non-Contact Thickness Measurement of Semiconductor Wafers
    of electrically conductive materials. Application Notes: Non-contact Measurement Sensors, Solutions and Systems - MTI Instruments.   . Non-Contact Thickness Measurement of Semiconductor Wafers. Capacitance Probes. Thickness measurement is an integral part of semiconductor wafer manufacturing. From
  • Thickness, Shape and Flatness Measurement of Semiconductor Wafers
    measurements. TTV is expressed in microns or mils (thousandths of an inch). Application Notes: Non-contact Measurement Sensors, Solutions and Systems - MTI Instruments.   . Thickness, Shape and Flatness Measurement of Semiconductor Wafers. Thickness Measurement. THICKNESS. ASTM F657: The distance
  • Electronics Industry Case Study: Tracking Semiconductor Wafers (.pdf)
    A typical semiconductor head wafer manufacturing facility produces 500,000 units per day. With fabrication yields of ? = 50%, and 20,000 heads per wafer on a 150 mm wafer, this drives the need to start approximately 50 wafers per day. A typical processing boat will contain anywhere from 1 to 15
  • Industry Reference: Semiconductor and Wafer Production
    Etched foil element heaters to heat acid in portable wafer processing baths, High Temperature Binder Inorganic and Organic coatings and with fabrication materials such as fiberglass cloth, fiberglass mat, mica, and ceramic fiber insulating carriers, etc... Thermal Circuits -Semiconductor etched
  • TA002: Backside Mounting Procedures for Semiconductor Wafer Processing
    capability that will enable further increases in capacity. Following, we present an overview of the process steps involved in backside processing for GaAs wafers with through via holes. Figure 1 shows a cross-sectional view of the major steps as the wafer is processed
  • F-105 Wet Scrubbers Installed at Semiconductor Wafer Fab in Singapore
    In order to comply with Ministry of the Environment emission requirements, Project Engineers at Chartered Silicon Partners, Singapore (CSP) needed gas scrubbers for their FAB-6 expansion. They required six (6) new 40,000 CFM scrubbers with chemical addition and high efficiency mist eliminators to
  • Semiconductor - Cleaning: NIR Spectroscopy to Monitor Cleaning Solutions in Semiconductor Wafer Manufacturing Process
    In a competitive semiconductor industry, where high volume and maximum efficiency mean everything, an emerging technology commonly used in the chemical and refining industries may be a suitable processing aid. Process Near Infrared (NIR) spectroscopy generates rapid, real-time data that is reliable
  • Semiconductor Inspection
    There are a number of techniques that are utilised today in the post process on line optical inspection of semiconductor wafers. These include: * Spectroscopic reflectometry where multiple laser wavelengths are shone down onto the surface of the thick film covered substrate to obtain information

Engineering Web Search: Semiconductor Wafer Top