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How to Facilitate Proper & Repeatable Integration of Thermal Sensors
pressing/lamination, photo-etch, and assembly equipment. The foundation of every heater/sensor assembly is its laminate. The better the laminate's flatness and bond strength, the more reliable the assembly's quality. To enable benchmark results, Thermal Circuits has recently improved to robotic-assisted
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More metal parts go to composites
line resulting in higher process yields. Ports for the optical sensor can be easily machined in the CP-9800 composite to exacting tolerances. Hot properties. Another Vespel grade suitable for semiconductor applications is Vespel CR-6100. This sheet-molding composite is a Teflon PFA reinforced
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
makes sensor-in-pixel display. Headlines for Thursday, December 1, 2011. Business. UBM Electronics and RapidBuyr announce partnership to offer daily deals and services. China's Vimicro to spin off handset IC business. Report: Chinese foundries to merge. U.S. chip firms beat rivals in 2011, says IHS
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MICRO:January 1998:Product Technology News
is +-0.1 C. Point-to-point profile precision is +-0.5 C. Temperature can be downloaded to the company s Thermal MAP 2 system for off-line analysis. Air Velocity Analyzer Cambridge AccuSense Shirley, MA The Quattro Flow measures airflow velocity using four sensor ports. This multichannel design
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Solenoids Clear the Lanes for Ten-Pin Bowling
Sensors. AF111 - LVDT Displacement Transducer. AF145 - LVDT Displacement Transducer. DLS - Draw Wire Linear Sensors. HLP190FS(BS) - Spring Loaded Linear Potentiometer. ICS100 - In-Cylinder Linear Displacement Sensor. ICT050 - Contactless In-Cylinder Linear Transducer. ICT080 - Contactless In-Cylinder
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Industry Reference: Semiconductor and Wafer Production
film insulators: one Kapton(R) polyimide, the other Teflon(R). The heater mounts to an anodized heat sink and a sensor is located in the center pedestal. Multi-heater/heat sink assemblies incorporate into multi-port boards designed to rapidly load/unload for "burning in" of silicone discs used
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Modular Design and Production of Microfluidic Devices
with a plastic injection molded part or to a sensor. Figure 2b: Discharging pump. (electromechanical or optical). In the latter case, the. laminate plays an integral role in the device by containing. the pumps, valves, and fluidic channels for the funcionality. of the device. The subassemblies
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Perspectives On Miniaturization (Part II)
with 16-256 count encoders. Several sensor manufacturers have recognized the need for smaller sensors capable of higher resolution. In the past, manufacturers provided sensors down to SO-8 size packages, but now provide sensors as dies or in chip-scale packages. MicroMo incorporates chip packages 2.0