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Conduct Research Top

  • Modulus of Elasticity
    deals with "shear or torsion" where the Modulus (E) for torsion springs addresses "bending".
  • Thermal-Mechanical Decoupling by a Thermal Interface Material
    Thermal-mechanical decoupling by a silicone thermal interface material (TIM) is one of the most important properties in electronic applications involving a printed circuit board (PCB). Thermal-mechanical decoupling requires that the thermal interface material have low shear modulus and high
  • Silicone Rubber Thermal Interface Materials: Applications and Performance Considerations
    stable from 8 to 200 psi of pressure offer excellent performance in pad applications such as transistor to heatsink mounting. The addition of high shear strength and low shear modulus offer excellent performance in adhesive applications such as photovoltaic to heatsink mounting where performance
  • The Use of the MDR 2000 to Resolve a Problem in Injection Molding
    Converting a high-volume compression-molded bonded seal to an injection-molded process requires dramatically different rheological and curing properties of the elastomer formulation. Shear rates are orders of magnitude higher thus excluding typical rheometer and viscometer data. Compound
  • MICRO: Golden (February 2001)
    interconnect layers to significant shear forces. In addition to the modulus, heat dissipation is another important issue with low-k candidates,

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