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Supplier: Abrisa Technologies
Description: Modulus of Elasticity (Young's) 7.2 x 1010 Pa (10.4 x 106 psi) Modulus of Rigidity (Shear) 3.0 x 1010 Pa (4.3 x 106 psi) Bulk Modulus 4.3 x 1010 Pa (6.18 x 106 psi) Poisson’s Ration 0.23 Specific Gravity 2.53 Density 2530 kg/m3 (158 lb/ft3) Coefficient of Thermal Stress 0.62 mPa/°C (50
- Glass Type: Soda Lime
- Shape / Form: Plate
Supplier: Dow Polyurethanes
Description: joints in parking garages, plaza and terrace decks, floors and sidewalk joints. Exhibits tenacious adhesion that does not dissipate with time. Adhesive strength, low modulus and high recovery make it ideal to resist the conditions common to horizontal joint installations, including moisture
- Compound Type: Caulk / Grout, Leveling / Filling Compound
- Substrate / Material Compatibility: Concrete / Masonry
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Industry: Building / Construction
Supplier: Crown Plastics Co., Inc.
Description: " / 0.508mm) and corona treated with a matte-finish bonding side, the MABS/TPU mix gives the material excellent abrasion resistance, elasticity, and shear strength. The high-gloss surface enhances and protects printed and die cut graphics and is perfect for clear coating and silkscreen printing.
- Chemical / Polymer System Type: ABS, Polyurethane (PU), Specialty / Other
- Form / Shape: Film / Sheet
- Industry: General Industrial, Other
- Chemical / Polymer System Type: Polyurethane (PU), Specialty / Other, ABS
Supplier: Saint-Gobain ADFORS
Description: turns crack stresses horizontally and dissipates stress Postpones complete reconstruction Lower maintenance costs Open aperture design promotes aggregate interlock between paving courses, greatly decreasing shear potential common with paving fabrics High stiffness, high modulus of elasticity, low
- Material Type: Elastomeric (Elastoester / Spandex)
- Coated / Sized: Yes
- Applications: Architectural / Construction, Industrial OEM
- Performance Features: Weather / UV Resistant
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Featured Products for Shear Modulus Top
Bergquist Gap Pad HC1000 Thermal Conductive Fill
reinforced for puncture, shear and tear resistance. Typical Applications Include: Computer and peripherals. Telecommunications. Heat interfaces to frames, chassis, or other heat spreading devices. RDRAM ™ memory modules / chip scale packages. CDROM / DVD cooling. Areas where irregular surfaces need to make a thermal interface to a heat sink. DDR SDRAM memory modules. FBDIMM modules. Configurations Available: Sheet form, die-cut parts, and roll form (converted or unconverted). Data Sheet... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
ERG Materials & Aerospace Corporation
Duocel® Copper Foam
volume. Physical Characteristics of Duocel ® Copper Foam* (8% Nominal Density C10100). Compression Strength. 131 psi. (0.903 MPa). Tensile Strength*. 1000 psi. (6.9 MPa). Shear Strength. 190 psi. (1.31 MPa). Modulus of Elasticity (Compression)*. 107 kpsi. (736 MPa). Modulus of Elasticity (Tension)*. 14.6 × 103 psi. (101.84 MPa). Shear Modulus. 40.9 kpsi. (282 MPa). Vickers Hardness. 35. Specific Heat. 0.092 BTU/lb- °F. (0.385 J/g-C). Bulk Thermal Conductivity. 5.84 BTU/ft-hr-F... (read more)
Browse Foams and Foam Materials Datasheets for ERG Materials & Aerospace Corporation
Brookfield Engineering Laboratories, Inc.
New Family of RST Touch Screen Rheometers
The new RST Series offers the quickest and most comprehensive capability for making rheological measurements, whether it ’s single point viscosity for QC or complete flow curve analysis for R &D. The RST Rheometers are unique because they operate in both controlled stress and controlled rate modes and can perform all of the following tests: viscoelastic modulus, yield stress, viscosity vs. shear rate profile, thixotropy calculation, creep behavior, recovery after flow, and temperature... (read more)
Browse Rheometers Datasheets for Brookfield Engineering Laboratories, Inc.
Cool PCB Design with Silicone Adhesive
THERMALLY CONDUCTIVE SILICONE ADHESIVE FOR HIGH RELIABILITY PRINTED CIRCIUT BOARD LAMINATIONS. Hot Spot Elimination - 1.5 W/mK thermal conductivity to transport heat away from hot spots. Bond Reliability - Bonds securely without primer regardless of substrate type, shape, or texture. Thermal-Mechanical Stress Decoupling - Low modulus and high shear strength prevent adhesive delamination. Anti-vibration - Elastic silicone rubber does not crack and protects the PCB from vibration. Low Temperature... (read more)
Browse Silicone Adhesives and Sealants Datasheets for Arlon LLC
Coolest PCB Design with Silicone Adhesive
Elimination - 3.0 W/mK thermal conductivity to transport heat away from hot spots. Bond Reliability - Bonds securely without primer regardless of substrate type, shape, or texture. Thermal-Mechanical Stress Decoupling - Low modulus and high shear strength prevent adhesive delamination. Anti-Vibration - Elastic silicone rubber does not crack and protects the PCB from vibration. Low Temperature Cure Cycle - Cure parameters as low as 100°C at 50 psi, so surface mount components can be mounted... (read more)
Browse Silicone Adhesives and Sealants Datasheets for Arlon LLC
Master Bond, Inc.
Fast Cure High Temperature Resistant Epoxy
in both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries. EP65HT-1 normally sets up in 3 to 5 minutes with 40% maximum strength developed. After 2 to 3 hours, 70% maximum strength is developed. Other product properties include a Tg of over 125ºC, bond shear strength exceeding 2500 psi, tensile strength greater than 7500 psi, and a Shore D Hardness of over 75. The volume resistivity is 1014 ohm-cm and the service temperature... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc.
Conduct Research Top
Modulus of Elasticity
deals with "shear or torsion" where the Modulus (E) for torsion springs addresses "bending". Modulus of Elasticity in Spring Material. Spring Rigidity and Elasticity based on Young's Modulous. Springulator | Newcomb Medical | Newcomb Firearms | En Espa nol. Home. About Us. History. Markets
Shear Strength and Torsion Tests
Shear strength is defined as the maximum stress that a material can withstand before failure in shear. In a planar shear test, opposing forces are applied parallel to the cross-sectional area under test. Torsion tests also provide an indication of shear properties. Torsion test evaluate materials
Thermal-Mechanical Decoupling by a Thermal Interface Material
Thermal-mechanical decoupling by a silicone thermal interface material (TIM) is one of the most important properties in electronic applications involving a printed circuit board (PCB). Thermal-mechanical decoupling requires that the thermal interface material have low shear modulus and high
Silicone Rubber Thermal Interface Materials: Applications and Performance Considerations
stable from 8 to 200 psi of pressure offer excellent performance in pad applications such as transistor to heatsink mounting. The addition of high shear strength and low shear modulus offer excellent performance in adhesive applications such as photovoltaic to heatsink mounting where performance
Poisson´s Ratios of Bayer MaterialScience Thermoplastics (.pdf)
). Application. Where no measured values are available, the shear. modulus of an isotropic and homogeneous material. can be estimated on an approximate basis with the. Abb. 1: Geometric relationships. aid of the Poisson´s ratio and the Young´s modulus: Theory. According to the theory (Gienke, Meder
Porosity and permeability analysis on nanoscale FIB-SEM 3D imaging of shale rock
Bound. HS Lower Bound. be calculated as shown in Table 1. 0. 5. 10. 15. 20. 25. 30. 35. Pore Solid Bulk Modulus (GPa). COMSOL Conference Boston 2011 – User Talk Multiphysics I. Figure 6. Isosurface of stress at 9x107 for. Figure 5. Pore Mineral Shear Modulus : 2 GPa,. eight different KA
Poromechanics Investigation at Pore-scale Using Digital Rock Physics Laboratory
, important rock properties can. HS Upper Bound. HS Lower Bound. be calculated as shown in Table 1. 0. 5. 10. 15. 20. 25. 30. 35. Pore Solid Bulk Modulus (GPa). COMSOL Conference Boston 2011 – User Talk Multiphysics I. Figure 6. Isosurface of stress at 9x107 for. Figure 5. Pore Mineral Shear Modulus
An attempt is made to analyze strain and stress of different types of pins in more detail than the conventional consideration of the shear strength offers. The analysis reveals that there are cases in which the shear strength is not the criterion for the proper selection of size and type of pin
Engineering Web Search: Shear Modulus Top
Elastic modulus - Wikipedia, the free encyclopedia
The shear modulus or modulus of rigidity ( G or ) describes an object's tendency to shear (the deformation of shape at constant volume) when acted
S-wave - Wikipedia, the free encyclopedia
where is the stress, and are the Lamé parameters (with as the shear modulus), is the Kronecker delta, and the strain tensor is defined
CR4 - Thread: Shear Modulus and Max Shear Stress
I've seen examples in texts where the shear strain is calculated using the Shear Modulus and actual shear stress.
ASTM E143 - 02(2008) Standard Test Method for Shear Modulus at...
ASTM E143 - 02(2008) Standard Test Method for Shear Modulus at Room Temperature
ASTM E1875 - 08 Standard Test Method for Dynamic Young's...
ASTM E1875 - 08 Standard Test Method for Dynamic Young's Modulus, Shear Modulus, and Poisson's Ratio by Sonic Resonance
Berryman: Poroelastic shear modulus
Poroelastic shear modulus dependence on pore-fluid properties arising in a model of thin isotropic layers
Berryman: Geomechanical constants of heterogeneous reservoirs:...
Geomechanical constants of heterogeneous reservoirs: pore fluid effects on shear modulus
Chemistry - Shear modulus
Shear modulus In materials science, shear S = shear stress/shear strain = F/A/Ø. Another commonly accepted symbol is G. Shear modulus