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  • Microstructural Effects on the Mechanical Properties of Hexoloy SA Silicon Carbide (.pdf)
    The flexural strength, fracture toughness and sonic Young's modulus were determined for sintered alpha silicon carbide consisting of various amounts of background porosity and different grain sizes. For the developmental material with average flexural strengths of 380MPa, the flexural strength
  • Sintered alpha Silicon Carbide Some Aspects of the Microstructure - Strength Relationship (.pdf)
    Alpha silicon carbide billets, 98% of theoretical density, were formed by cold pressing and sintering. One half of this fine grain sintered material was further heat treated to induce exaggerated grain growth thus producing a coarse grain micro-structure.
  • Features and Benefits of Abtex Abrasive Brushing Tools (.pdf)
    the most. widely applied. Silicon carbide and aluminum oxide grains are both available. Silicon. carbide filaments appear gray in color while aluminum oxide has a brownish orange. appearance. Silicon carbide is, by far, most commonly applied with a loading of 30% by. weight. Filament Dia. .060” .045
  • Assessment of Eutectic Solder Phase Growth in Under-The-Hood Power Control Modules (.pdf)
    to the. grains/phases in polycrystalline materials to grow. application of mechanical energy occurs when the stress. Grains coarsen because grain boundaries are areas of. levels result in plastic deformation. Plastic deformation. high potential energy. During grain coarsening, as grains. results
  • Fixed Abrasives Take Lapping Into Another Dimension
    Traditionally, the grinding. process known as. lapping has been. employed in stock removal of. metal and ceramic workpieces. to achieve a desired concentricity. or "fl atness." Flat. lapping typically involves. a slurry of loose aluminum. oxide, silicon carbide or other. abrasive grains fl owed
  • Grinding out Bottlenecks
    a slurry of loose aluminum. oxide, silicon carbide or other. abrasive grains flowed across a rotating. lapping plate in a water- or oilbased. solution. By creating an abrasive. "film" between the plates and the. workpiece, stock removal from a single. side, or both sides simultaneously,. can
  • Application of WG-300
    with extremely strong, stiff, silicon-carbide crystals, commonly called whiskers. These whiskers are grown under carefully controlled conditions and, due to their high purity and lack of grain boundaries, approach the theoretical maximum strength obtainable. This strength is calculated to be in the order of 1
  • AN0016 Micro-sectioning of Multilayer Ceramic Capacitors
    will almost certainly generate damage around the chip edges during grinding. Consequently use of a high quality, low stress potting compound is recommended. Waterproof Silicon Carbide grinding paper is available in many grit sizes. Paper should be selected as appropriate to the sample being prepared

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