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  • The Proliferation of Lead-Free Alloys
    eutectic tin-silver-copper alloy SAC387 (Sn95.5Ag3.8Cu0.7) as an initial favorite to fill this need in the early 2000s. Read more: http://www.indium.com/technical-documents/whitepaper/the-proliferation-of-leadfree-alloys
  • Soldering Processes
    characteristics. Tin-silver alloys have the same characteristics as tin-antimony solders and are used for delicate instrument work and high-strength applications. Tin-zinc alloys are used mainly for soldering aluminum -- primarily where a low soldering temperature is
  • Precious Metals
    Precious metals may seem unlikely as engineering materials, but the same expensive metals used for coinage and jewelry also satisfy applications requiring the ultimate in corrosion resistance or electrical conductivity. Three subgroups make up the entire family of precious metals: silver and silver
  • Copper
    Copper conducts electricity at a rate 97% that of silver, and is the standard for electrical conductivity. Copper provides a diverse range of properties: good thermal and electrical conductivity, corrosion resistance, ease of forming, ease of joining, and color. In addition, however, copper and its
  • Unique Qualities of Stainless Steel PH15-7MO
    to compare this PH alloy surface to the other grades of stainless steel. 300 and 400 series stainless steel exhibit a bright, shiny, silver color surface. These alloys contain only constituent elements whose oxides are easily reduced using mechanical or chemical means.
  • Copper-jacketed germ buster
    (UNS S30400, a variation of the 18% chromium 8% nickel austenitic alloy, the most familiar and most frequently used alloy in the stainless-steel family), and a antimicrobial silver-ion (Ag+)-coated 304 stainless steel. E. coli, a food-born pathogen, that in the elderly and children can lead
  • Switch Tips: Lead-free solders and electromechanical switches
    -silver-copper (SnAgCu) and tin-copper (SnCu). However, both these alloys have melt temperatures considerably higher than tin-lead (SnPb). The reflow temperature profile for SnPb can reach 210 to 225 C. The reflow profile for SnAgCu will reach 260 C, and rework temperatures are even higher
  • Metals and Ceramics
    , and mullite. Adding titanium, zirconium, or hafnium to standard silver-based braze alloys forms an activated alloy. By firing such an alloy onto ceramic surfaces at 800 to 1,000 C in vacuum or argon, the braze will wet directly onto the ceramic through migration of the active metal toward

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