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Parts by Number for Silver Solder Wire Top

Part # Distributor Manufacturer Product Category Description
54330-1 Allied Electronics, Inc. AMP/TYCO ELECTRONICS Not Provided Power Connector Contact; Copper; Silver; 6 AWG (Max.); Solder (Wire); 0.048 in.
54329-1 Allied Electronics, Inc. AMP/TYCO ELECTRONICS Not Provided Power Connector Contact; Copper; Silver; 12 AWG (Max.); Solder (Wire)
311SX5-T RS Electronics Honeywell S&C Not Provided Basic Limit Switch; Subminiature precision basic switch, silver contacts, easy solder lead wire attachment terminals, UL code is 5A res., 3A ind., 0.459 inch simulated roller actuator, 1.1 ounces operating force, 0.022 inches minimum overtravel.
311SX2-T RS Electronics Honeywell S&C Not Provided Basic Limit Switch; Subminiature precision basic switch, silver contacts, easy solder lead wire attachment terminals, UL code is 5A res., 3A ind., 0.505 inch straight lever actuator, 1.1 ounces operating force, 0.025 inches minimum overtravel.
311SX1-T RS Electronics Honeywell S&C Not Provided Basic Limit Switch; Subminiature precision basic switch, silver contacts, easy solder lead wire attachment terminals, UL code is 5A res., 3A ind., 0.135 inch straight lever actuator, 1.76 ounces operating force, 0.014 inches minimum overtravel.
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Conduct Research Top

  • Solder Powder: IPC
    to 27% silver. The 27% level is well beyond the solubility limit of silver in these types of solder, and in fact in most solders, at the expected soldering temperatures. The mechanism of non-wetting is clear: solder can no longer wet onto silver, once it has become filled with insoluble intermetallic
  • Adding Solder to a NanoBond (R) Assembly
    . Halogen Free. Hand Soldering. Head In Pillow. Heat Spring. Hermetic Sealing. Indalloy. Indium. Indium Alloy. INDIUM CORPORATION. Indium Tin Oxide. Indium Wire. Intermetallic. Lead Free Assembly. Lead Free Paste. Lead Free Profile. Lead Free Silver Solder. Lead Free Solder Flux. Lead Free Solder
  • Humidity and Solder Paste - Avoid Issues
    . Heat Spring. Hermetic Sealing. Indalloy. Indium. Indium Alloy. INDIUM CORPORATION. Indium Tin Oxide. Indium Wire. Intermetallic. Lead Free Assembly. Lead Free Paste. Lead Free Profile. Lead Free Silver Solder. Lead Free Solder Flux. Lead Free Solder Paste. Lead Free Solder Temperature. Lead Free
  • Reliability Study Conducted: Leadless Chip Thermistor with High Temperature Solder Leach Resistant Gold Contacts, Die Mounted with Eutectic Au/Sn Solder by Customer (.pdf)
    . 0.8%. 2.0%. 4.5%. Legend for Graphs on following pages: Supplier_Type Supplier Name. Die Mount Method. VendB_E Vendor. B. Epoxy. VendB_AuSn. Vendor B. Gold/Tin Eutectic. VendB_AgSn. Vendor B. Tin/Silver Eutectic. CS_E Cornerstone. Sensors. Epoxy. CS_AuSn Cornerstone. Sensors. Gold/Tin. Eutectic. CS
  • Laser Reflow Soldering - A Process Solution Part I
    to solder paste which conducts heat to wire and. silver thick film, protecting glass from overheating and excessively long. reflow cycle time. Viable Options: Soldering Iron, Hot bar/Thermode and Diode Laser. Best Fit Choice: Diode. Laser. Example 2: Four gold plated brass connector pins molded
  • BAN-PLT-1.1 NEW Electroless Nickel Gold Plating (c)
    at 150ºC. to the gold system. Utilizing the silver. system for LTCC construction with. **. tested with 1-mil Au wire , 3-8% elongation,. subsequent electroless Nickel/gold. T.S. 6grams min. plating. *** tested using 0603 SMD with Sn62 solder. This construction allows attachment. of die and components
  • Cartridge Brush Design for DC Motors and Gearmotors
    The traditional method for mounting copper or silver graphite brushes in brush-commutated DC motor and. gearmotor assemblies has been to solder the brushes onto standard cantilever springs to enable the required. constant contact with the commutator. This conventional spring design, however
  • Medical Device Link .
    applied to the copper: organic solderability preservative (OSP), nickel gold (NiAu), chemically plated silicon (Si), and silver (Ag). After assembly, electrical measurements showed differences in yield among the four surface finishes. Although the differences identified among the surface finishes

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