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Supplier: Xoxide
Description: % thermally Conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term
- Compound Type: Thermally Conductive
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Supplier: Xoxide
Description: % thermally Conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term
- Compound Type: Thermally Conductive
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Supplier: Xoxide
Description: The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Made with micronized aluminum oxide, boron nitride and zinc oxide. Ceramique uses a high-density layered composite of five
- Compound Type: Thermally Conductive
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Supplier: Xoxide
Description: The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Features: Tri-Linear Ceramic Content: Like the original Céramique, Céramique 2 uses only
- Compound Type: Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Allied Electronics, Inc.
Description: Silver Print, 27 °C Flash Point, 1.6 Specific Gravity The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: Silver Print, 27 °C Flash Point, 1.6 Specific Gravity The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: Silver Print, 27 °C Flash Point, 1.6 Specific Gravity The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: Master Bond EP3HTS-TC is a fast curing, silver filled, one part epoxy with unparalleled electrical and thermal conductivity.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 1.11E7 to 1.28E7 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Materion Corporation
Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 23.33 to 125 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 26.67 to 83.33 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 66.67 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Features: Electrically Conductive, EMI / RFI Shielding Material, ESD Control / Anti-static
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market requires their
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 32.22 to 154 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Techsil Limited
Description: MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: Allied Electronics, Inc.
Description: associated with silver filled greases. Thermal conductivity of 3.0 w/(m × k) Contains no silicone or other metal particles Pigmented with Boron Nitride particles Maximum operating temperature of 150°C / 302°F
- Dielectric Strength: 170 kV/in
- Material Type: Grease / Paste
- Use Temperature: -40 to 302 F
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Supplier: Mid-Mountain Materials, Inc.
Description: Mid-Mountain manufactures silicone-coated fabrics and textiles comprised of varying substrates coated with silicone rubber compounds. ARMATEX® Silicone Coated Fabrics and Textiles are engineered for use in environments that require high heat or flame resistance, chemical resistance, abrasion
- Applications: Aerospace, Fire Proofing / Thermal Protection
- Fabric Weight: 440 gsm
- Material Type: Glass / Fiberglass, E-glass
- Overall Thickness: 0.0120 inch
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. Static
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Elongation: 20 to 30 %
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Elongation: 20 to 30 %
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating temperatures as high
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE ABLESTIK SSP-2000 printable low temperature silver sintering paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3888 is a room temperature cure epoxy adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. 2.5 g Packet.
- Compound Type: Electrically Conductive, Thermally Conductive
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.5 W/m-K
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Supplier: Protavic America, Inc.
Description: A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is well suited to application by microdispenser. It exhibits an excellent thermal stability and a
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Thermal Compounds and Thermal Interface Materials - Electro-Conductive Epoxy Adhesive -- ACE-40010ABSupplier: Protavic America, Inc.
Description: Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for repair work in the field. It also has a convenient 1:1 mix ratio.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 38.89 to 139 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachsuch as RFID isotropic applications and can be dispensed, printed or pin transferred. It offers fast in-line cure at low temperature. One part
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.22 to 66.67 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach LOCTITE® ABLESTIK 2600BT adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver and resin particles suspended in
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Compound Type: Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach LOCTITE® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat
- Compound Type: Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 8038, Acrylate, Die attach LOCTITE® ABLESTIK ABP 8038 die attach adhesive is designed for high reliability leadframe packaging applications. This adhesive is formulated to eliminate silver migration concerns by replacing silver with gold and palladium
- Coeff. of Thermal Expansion (CTE): 20 µin/in-F
- Compound Type: Thermally Conductive
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Supplier: Umicore Metal Deposition Solutions
Description: For deposition of wear-resistant silver layers with high hardness ARGUNA® 3430 is an alkaline, cyanide-free electrolyte for the deposition of technically functional silver layers. The electrolyte does not contain any toxic cyanide compounds and can therefore be used in a
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2600K, Thermal Management, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver
- Coeff. of Thermal Expansion (CTE): 20 µin/in-F
- Compound Type: Thermally Conductive
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Supplier: Materion Corporation
Description: Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Electronics
Description: (Known as Abletherm 2600AT ) LOCTITE ABLESTIK 2158 adhesive is designed for thermal management applications requiring high heat extraction from the die such as high power and discrete devices. This adhesive uses a unique suspension system containing silver adhesive has an extremely
- Features: Electrically Conductive
- Industry: Electronics
- Thermal Conductivity: 20 W/m-K
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Supplier: Materion Corporation
Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor
- Compound Type: Electrically Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Electronics
Description: Eccobond C850-6 is a fast curing, general conductive, one component, low viscosity, silver filled epoxy die attach adhesive paste. It features high electrical and thermal conductivity and high strength at wire bond temperatures.
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Viscosity: 100000 cP
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Supplier: RS Components, Ltd.
Description: The MG Chemicals 8331 is an economical, moderate cure silver conductive epoxy adhesive designed to give good electrical and thermal conductivities. The conductive adhesive provides excellent EMI/RFI shielding. Product Type = Epoxy Conductive Element = Silver Package Type =
- Compound Type: Electrically Conductive
- Material Form: Specialty / Other
- Use Temperature: -67 to 302 F
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Supplier: RS Components, Ltd.
Description: The two-part MG Chemicals 8331S is an economical, slow cure silver conductive epoxy adhesive designed to give good electrical and thermal conductivities. The conductive adhesive provides excellent EMI/RFI shielding. Package Type = Syringe Package Size = 15 g Cure Time = 50 min
- Compound Type: Electrically Conductive
- Material Form: Specialty / Other
- Use Temperature: -40 to 302 F
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Supplier: Metalor Technologies USA Corporation
Description: Electrically and thermally conductive adhesives for microelectronic applications Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Featured Products Top
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With rapid advancements in automotive electronics technology, the pursuit of solutions that enhance performance, reliability, and efficiency is constant. Silver sintering has emerged as a pioneering technology, revolutionizing the manufacturing processes within the (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for MacDermid Alpha Electronics Solutions -
Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has a thermal conductivity of 12-15 BTU•in/(ft²•hr•°F) [1.73-2.16 W/(m·K)]. EP3HTS is dimensionally stable and bonds well to metals (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc.
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
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Tin Vs. Bare
into long term contact with certain metals. Over time the oxygen will combine with the metal at an atomic level, forming a new compound called an oxide. When the metal forms an oxide it will weaken the bonds of the metal itself. If the base metal is iron, you get iron oxide, if it's copper, you get
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Simultaneous study of thermal and optical characteristics of light-emitting diode
The determined junction-to-ambient thermal resistance and junction temperature were enhanced about 1.35% and 0.78%, respectively by replacing alumina to silver thermal compound .
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It's official: Macbooks have bad thermal paste applied - MacRumors Forums
And the only reason they give for not applying too much goo in those situations is: "Even though Arctic Silver thermal compound is specifically engineered for high electrical resistance, you should keep the compound away from processor, memory, and motherboard traces and…
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Applying different heat flux intensities to simultaneously estimate the thermal properties of metallic materials
Since the contact between the resistive heater and the sample was imperfect, the silver thermal compound Arctic Silver 5, which presents a thermal conductivity of around .
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Question about dynamic drive - Techist - All Things Tech
ThermalTake Volcano 11+ Heatsink/Fan (w/ Antec high- silver thermal compound ) .
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New set of Case/CPU fans
Im thinking of also investing in some Artic Silver Thermal Compound .
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PC will not boot, PS Failure ?
Suggestion= you reintall a known functioning XP processor - install using artec silver thermal compound .
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New Computer - Techist - All Things Tech
OCZ Ultra 5+ Silver Thermal Compound $5.99 .
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OSA | Thermal lens shaping in Brewster gain media: A high-power, diode-pumped Nd:GdVO4 laser
Artic Silver 5, High-density Polysynthetic Silver Thermal Compound (Artic Silver, 2004), http://www.articsilver.com/as5.htm.
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Hybrid modelling of 7449-T7 aluminium alloy friction stir welded joints
They were inserted into 1?6¡0?1 mm deep, ø1 mm holes, and a polysynthetic silver thermal com- pound (including aluminium and zinc oxides particles) was applied to aid heat transfer between the thermo- couple and the workpiece material.
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High force density linear permanent magnet motors : "electromagnetic muscle actuators"
The channels were filled with Arctic Silver thermal compound prior to magnet assembly, to avoid introducing significant interface resistance.