. MCM. Ultrafine pitch ( < 11.8 mil). Flip chip. Axial leaded. Radial leaded. Odd form. Press fit. Assembly equipment. IC Insertion. Component Capability: .300" & .600" span ICs, dips,
resistor nets, diode
arrays. Insertion Work Area: 18" x 18". Insertion Orientation: 0, 90, 180, 270 degrees. Placement insertion rate: 2,000 placements/hour. Axial Component Insertion. Insertion Capability: resistors, fuses, diodes, capacitors, and inductors. Placement Insertion Rate: 16,000 placements/hour...
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