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Supplier: RS Components, Ltd.
Description: soldered joint, therefore preventing embrittlement even under extreme atmospheric conditions. Solidus at 296 °C, liquidus at 301 °C Wire Diameter = 1mm Percent Lead = 93% Product Form = Wire Melting Point = +296 - +301 Percent Silver = 2% Percent Tin = 5% Flux Type = Halide Activated
- Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 565 to 574 F
Standards and Technical Documents - Standard Specification for Electrodeposited Copper for Engineering Uses -- ASTM B734-97(2013)
Description: reducing the risk of hydrogen embrittlement, and peening. Coatings shall be sampled, tested, and shall conform to specified requirements as to appearance, thickness, porosity, solderability, adhesion, embrittlement relief, and packaging.Show More
Standards and Technical Documents - Standard Specification for Electrodeposited Coatings of Silver for Engineering Use -- ASTM B700-08(2014)
Description: preplating operations such as stress relief treatment, strike, and underplating, as well as post-plating embrittlement relief. Coatings shall be sampled, tested, and conform accordingly to specified requirements as to nature, purity, appearance, defects, adhesion, solderability,Show More
Standards and Technical Documents - Standard Specification for Electrodeposited Coatings of Tin -- ASTM B545-97(2004)e1
Description: , local and mean thickness, integrity (including gross defects, mechanical damage, and porosity), adhesion, solderability, and hydrogen embrittlement relief.Show More
Supplier: Plansee SE
Description: dope pure molybdenum with small quantities of La2O3. The stabilized microstructure and modified recrystallization behavior prevent the premature embrittlement and fracture of our furnace components. What makes ML better than pure molybdenum? Higher
- Application: Annealing, Brazing / Soldering, Firing / Sintering, Heat Treating, Industrial
- Process Temperature: 1000 to 2800 C
Standards and Technical Documents - Standard Specification for Coatings of Cadmium Mechanically Deposited -- ASTM B696-00
Description: 1.1 General -This specification covers the requirements for a coating of cadmium mechanically deposited on metal products. The coating is provided in various thicknesses up to and including 12 [mu]m. 1.2 Mechanical deposition greatly reduces the risk of hydrogen embrittlement and isShow More
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The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
This type of brittle fracture occurs in the solder joint unlike the typical brittle failures occurring in the intermetallic layers that are present between solder joint and bond pad; therefore, it is often referred to as ‘bulk solder embrittlement ’.
Application of New Solid Polymeric Dispersant, Easy-Sperse® P-20 (Spray-Dried Polymer Composites) in Suspension Concentrates and Water Dispersible Granule Form...
This novel mechanism of solder embrittlement and the factors affecting it have recently been addressed in the literature for solder joints subjected to impact ͓20͔.
A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints
’’ (d) SE image of an SAC 305 joint tested at À10°C: the flatness of the fractured solder next to the IMC particle (cross) suggests local solder embrittlement .
Embrittlement of surface mount solder joints by hot solder-dipped, gold-plated leads
Semi-quantitative analysis provided on the dot maps revealed gold concentrations well in excess of the 4 wt% limit shown to introduce solder embrittlement .
Assessment of NiPd finished components for surface mount assembly applications
A considerable amount of data has been accumulated for the Au-63Sn-37Pb system in which a nominal 4 wt% Au content has been considered as the minimum level at which solder embrittlement occurs.
Gold coatings for fluxless soldering
Higher levels of gold incorporated into the solder can lead to the formation of the AuSn2 intermetallic com- pound, but the available evidence indicates that this does not ameliorate the solder embrittlement .
Development of Sn-Ag-Cu-X Solders for Electronic Assembly
by Micro-Alloying with Al
The primary goal of this work is to address sev- eral problems, such as thermal aging from IMC growth and voiding, and as- soldered embrittlement from Ag3Sn blade growth.