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  • Laser Reflow Soldering - A Process Solution Part I
    : A Process Solution. Page 3 of 8 ©2007. Convection Oven. No. • Reflow cycle too long due to cable locating fixture requirements. Silver ink. dissolves into solder during oven reflow. Focused Hot Air. No. • Rapid, uneven heating over moderate size area. Area heated is surrounded. by unheated glass. Glass
  • Medical Device Link . Ensuring Solder Joint Integrity
    . The top sides of these boards, which were soldered first, did not exhibit anomalies, but dewetting was noted on the bottom sides. The intense heat generated by the IR oven was sufficient to reflow the HASL surface on the opposite side of the boards. IMCs grow quickly when the overlying solder
  • Surface Mount Technology (.pdf)
    One of the key factors of reflow oven is preheating. The preheating of a component and PCB is basically the same in leaded and leadfree soldering. Preheating is the range from room temperature to the melting point of solder. ept_H1H4.eps Surface Mount Technology (SMT). Failure Analysis
  • High Speed Data Port Connector Assembly (.pdf)
    carrier puck on a. conveyor system to send subassemblies through the solder. reflow oven. The Final Module al ows the soldered PCB to. be assembled into it's plastic housing. Labeling, ultrasonic. welding, final wire form die cutting, and functional electric. testing al fol ow with good assemblies
  • Recommendations for Soldering Terminal Leads to MOV Varistor Discs (.pdf)
    , but are not recom-. mends 1.1.1 trichloroethane for the. mended. removal of flux residues after soldering. Soldering Ovens. Box, convection, and conveyor belt ovens. RA - These fully activated fluxes are corro-. Defluxing in a solvent bath with ultrasonic. are suitable for reflow solder processes. sive
  • Medical Device Link .
    . This process involves screen printing solder paste down onto bare PCBs, picking and placing the components onto the board, and then running the boards through a solder reflow oven. Metal cans used as shields are normally stamped with a hexagonal series of round holes (or apertures). These holes
  • Moisture Control Specifications
    All SMD packed in Tape and Reel is Dry Packed. This method helps to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation from a combination of rapid moisture expansion and material mismatch. PCA Electronics, Inc. Dry
  • Thermal Profiling Optimizes Printed Circuit Board Assembly
    slopes and temperatures found. tilt the profile toward high-mass, large. in the oven and on the PCB. Engineers. BGAs, causing ‘voiding’ issues with. attached thermocouples to the bare PCB. smaller BGA packages during reflow. and beneath components to determine. If the solder goes to liquidus before all

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