Products & Services

See also: Categories | Technical Articles | More Information
Page: 1

Conduct Research Top

  • Laser Reflow Soldering - A Process Solution Part I
    : A Process Solution. Page 3 of 8 ©2007. Convection Oven. No. • Reflow cycle too long due to cable locating fixture requirements. Silver ink. dissolves into solder during oven reflow. Focused Hot Air. No. • Rapid, uneven heating over moderate size area. Area heated is surrounded. by unheated glass. Glass
  • Dispelling 10 Myths About Nitrogen Reflow (.pdf)
    will reduce. Myth 5: “Nitrogen reduces all solder-. Fact: Yes you will, to a certain point. the level but will produce large varia-. ing defects.”. But every reflow oven has a minimum. tions (b). Finally, given a high-enough. Fact: Nitrogen can help with some. oxygen level, due to turbulent mixing
  • Medical Device Link . Ensuring Solder Joint Integrity
    . The top sides of these boards, which were soldered first, did not exhibit anomalies, but dewetting was noted on the bottom sides. The intense heat generated by the IR oven was sufficient to reflow the HASL surface on the opposite side of the boards. IMCs grow quickly when the overlying solder
  • Discrete Receptacles with Organic Fibre Plug (R) Solder Barrier
    board in an SMT conveyor oven. 6. Install leaded component into receptacles. 7. The component leads will push out the organic fibre plugs. OFP Application.qxp Application of Discrete Receptacles. R. with Organic Fibre Plug® Solder Barrier. ASSEMBLY SEQUENCE FOR. INTRUSIVE REFLOW. SOLDERING
  • Surface Mount Technology (.pdf)
    One of the key factors of reflow oven is preheating. The preheating of a component and PCB is basically the same in leaded and leadfree soldering. Preheating is the range from room temperature to the melting point of solder. ept_H1H4.eps Surface Mount Technology (SMT). Failure Analysis
  • High Speed Data Port Connector Assembly (.pdf)
    carrier puck on a. conveyor system to send subassemblies through the solder. reflow oven. The Final Module al ows the soldered PCB to. be assembled into it's plastic housing. Labeling, ultrasonic. welding, final wire form die cutting, and functional electric. testing al fol ow with good assemblies
  • Recommendations for Soldering Terminal Leads to MOV Varistor Discs (.pdf)
    , but are not recom-. mends 1.1.1 trichloroethane for the. mended. removal of flux residues after soldering. Soldering Ovens. Box, convection, and conveyor belt ovens. RA - These fully activated fluxes are corro-. Defluxing in a solvent bath with ultrasonic. are suitable for reflow solder processes. sive
  • Medical Device Link .
    . This process involves screen printing solder paste down onto bare PCBs, picking and placing the components onto the board, and then running the boards through a solder reflow oven. Metal cans used as shields are normally stamped with a hexagonal series of round holes (or apertures). These holes

More Information on: Solder Reflow Oven Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire