Electronic Design Automation (EDA) and Electronic Computer-aided Design Software (ECAD) - FloTHERM® PCB Thermal Design ProgramSupplier: Mentor Graphics Corporation
Description: . There are options available for: Card Slots Natural Convection Forced Convection Conduction Cooled Solder Reflow Ovens For more advanced scenarios, pre-solved FloTHERM analyses can be imported to form a complex, 3D description of the surrounding air flow and temperature fields. Solving
Supplier: OMEGA Engineering, Inc.
Description: machinery, HVAC and R, kilns, packaging equipment, sorting equipment, wave solder and reflow systems, lighting systems, pump controls, incubators, motor-switching, and UPS systems.
- Solid State Relay Type: Optically Isolated Relay
- Application Type: General Application Relay
- Mounting: DIN Rail, Panel
- Input Voltage Type: AC, DC
Supplier: KLA-Tencor Corporation
Description: SensArray Process Probe 1630 instrumented wafers enable precise in-situ characterization of wafer temperature profiles in both front-end atmospheric and belt CVD systems, and in back-end wafer solder bumping reflow ovens. Utilizing the patented ThermaBond technique, the embedded thermocouple bond
- Form Factor: Wafer Probing System
- Applications: Semiconductor Wafers, CVD / PVD Films, Etching - Plasma / Wet
- Measurement Capability: Other
- Technology: Other
Supplier: Neutronics, Inc.
Description: The Ntron Pure N2 Oxygen Analyzer offers a cost effective solution to rapid and precise oxygen measurement. Ideally suited for spot checking of solder re-flow ovens, nitrogen sources and high purity welding, an oxygen analyzer, like the Pure N2, is the only way to accurately measure low
- Instrument Type: Analyzer
- Mounting Type: Portable
- Application: Confined Space Monitoring, Process Gas
- Measurement Type: %LEL, Trace
Description: Here at DEK, our extensive experience in the field of Process Improvement Products means that we continue to develop, manufacture and supply a wide range of speciality cleaning products. Choose from: DEK Reflow Oven Cleaner High performance mix of water, alkaloids and long-chain alcohols removes
Supplier: Yokogawa Corporation of America
Description: . ・ Oxygen concentration control in semiconductor-related diffusion and drying furnaces and in LCD manufacturing processes ・ Oxygen concentration control in solder pot flow and re-flow ovens, and glove boxes used in electronics manufacturing, and in gas production processes ・ Oxygen
- Number of Gases Sensed: Single Gas
- Measurement Type: %Volume, Trace, Leakage
- Specific Gas Types: Oxygen (O2)
- Electrical Outputs: Analog Voltage, Analog Current, Switch
Supplier: Caladena Group
Description: packages & ultra fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow oven, Electrovert Wave Solder machines; X-ray inspection unit & AOI unit. Through hole assembly capabilities include axial insertion, radial
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services
- Testing Services: Functional Testing, In-circuit Testing, X-Ray Testing, Other
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly, Other
- Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling
Supplier: Caladena Group
Description: assembly & electro-mechanical assembly. SMT capabilities include placing packages as small as 0402; BGA, SOIC, PLCC, QFP packages & ultra fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow oven, Electrovert Wave
- Services: Just-in-Time Delivery, Kitting, Low Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking
- Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
- Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Marine, Telecommunications, Other
- Location: North America, United States Only, Canada Only
Supplier: Captor Corporation
Description: to market. We will work with you during the early stage of design to ensure a smooth transition throughout the entire manufacturing process. Equipment List • Quad C Pick & Place • Quad QRC 532C Reflow Oven • Quad 100iS Screen Printer • PVA1000 CNC Programmable Conformal
- Supplier Capability: PCB Design / Layout
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Location: North America, United States Only, Midwest US Only
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Laser Reflow Soldering - A Process Solution Part I
: A Process Solution. Page 3 of 8 ©2007. Convection Oven. No. • Reflow cycle too long due to cable locating fixture requirements. Silver ink. dissolves into solder during oven reflow. Focused Hot Air. No. • Rapid, uneven heating over moderate size area. Area heated is surrounded. by unheated glass. Glass
Dispelling 10 Myths About Nitrogen Reflow (.pdf)
will reduce. Myth 5: “Nitrogen reduces all solder-. Fact: Yes you will, to a certain point. the level but will produce large varia-. ing defects.”. But every reflow oven has a minimum. tions (b). Finally, given a high-enough. Fact: Nitrogen can help with some. oxygen level, due to turbulent mixing
Medical Device Link . Ensuring Solder Joint Integrity
. The top sides of these boards, which were soldered first, did not exhibit anomalies, but dewetting was noted on the bottom sides. The intense heat generated by the IR oven was sufficient to reflow the HASL surface on the opposite side of the boards. IMCs grow quickly when the overlying solder
Discrete Receptacles with Organic Fibre Plug (R) Solder Barrier
board in an SMT conveyor oven. 6. Install leaded component into receptacles. 7. The component leads will push out the organic fibre plugs. OFP Application.qxp Application of Discrete Receptacles. R. with Organic Fibre Plug® Solder Barrier. ASSEMBLY SEQUENCE FOR. INTRUSIVE REFLOW. SOLDERING
Surface Mount Technology (.pdf)
One of the key factors of reflow oven is preheating. The preheating of a component and PCB is basically the same in leaded and leadfree soldering. Preheating is the range from room temperature to the melting point of solder. ept_H1H4.eps Surface Mount Technology (SMT). Failure Analysis
High Speed Data Port Connector Assembly (.pdf)
carrier puck on a. conveyor system to send subassemblies through the solder. reflow oven. The Final Module al ows the soldered PCB to. be assembled into it's plastic housing. Labeling, ultrasonic. welding, final wire form die cutting, and functional electric. testing al fol ow with good assemblies
Recommendations for Soldering Terminal Leads to MOV Varistor Discs (.pdf)
, but are not recom-. mends 1.1.1 trichloroethane for the. mended. removal of flux residues after soldering. Soldering Ovens. Box, convection, and conveyor belt ovens. RA - These fully activated fluxes are corro-. Defluxing in a solvent bath with ultrasonic. are suitable for reflow solder processes. sive
Medical Device Link .
. This process involves screen printing solder paste down onto bare PCBs, picking and placing the components onto the board, and then running the boards through a solder reflow oven. Metal cans used as shields are normally stamped with a hexagonal series of round holes (or apertures). These holes
More Information on: Solder Reflow Oven Top
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
In 1985, Fukuzawa et al.  reported that many plastic packages which were preconditioned with moisture cracked with a “pop�? sound when they were passed through a solder reflow oven .
Aluminum decal for transferring solder spheres during electronic package assembly
The distance the aluminum decal might move could be as short as from the vacuum chuck to the solder reflow oven or as long as from the aluminum decal assembly site to an overseas electronic package assembly plant.
A new electronic manufacturing course for the electrical engineering curriculum
c) Program a pick and place component handler. d) Select temperature-time profiles for a solder reflow oven . e) Perform advanced design studies using the PAD’S software. f) Design and perform the functionality and reliability tests needed to evaluate the finished boards.
Studies on double-layered metal bumps for fine pitch flip chip applications
Flip chip bonding Generally, flip chip bonding using solder bumps can be easily achieved using flip chip bonder and solder reflow oven .
High Strength, high temperature, semiconductive composite board designed for use as circuit board and flex circuit carrying pallets for solder reflow ovens .
Reflow soldering was performed in a reducing atmosphere of nitrogen in a solder reflow oven (at Rockwell Science Center) for the first batch of specimens and in a belt furnace (at Olin-Aegis Corporation) for the second batch of specimens.
Evolution of the tension/compression and shear cyclic stress-strain behavior of lead-free solder subjected to isothermal aging
...behavior and microstructure, we are exploring a large spectrum of cooling rates including water quenching of the tubes (fast cooling rate), air cooling with natural and forced convection (slow cooling rates), and controlled cooling using a surface mount technology solder reflow oven .
The poor man's solder reflow oven [Hands On]
The poor man's solder reflow oven [Hands On] .