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Parts by Number for Solderless Top

Part # Distributor Manufacturer Product Category Description
SOLDERLESS TERMINAL ASAP Semiconductor HOLLINGSWORTH Not Provided Not Provided
TERM LUG, SOLDERLESS BURN Quist Electronics GRAYBAR ELECTRIC CO Not Provided DY KL
BSN18-3K Heilind Electronics, Inc. PANDUIT Terminals-Solderless Butt Splice, nylon insulated, 22 - 16 AW
BSN18-M Heilind Electronics, Inc. PANDUIT Terminals-Solderless Butt Splice, nylon insulated, 22 - 18 AW
RV18-10L Heilind Electronics, Inc. 3M Terminals-Solderless 1 BAG = 50 RINGS, 10 BAG MINIMUM
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Conduct Research Top

  • Using Press-Fit and IDC for Solderless Magnetic Wire Terminations in Electric Motors and Power Products
    Compliant/Press-Fit interconnects are widely used in industrial, transportation, power module designs and many other applications to provide a solderfree, production-friendly and highly reliable alternative that overcomes the hassles and production problems with traditional solder-joints.
  • Bi-Spring Press-fit Contacts (.pdf)
    R eliable, solderless connections from connectors to backplanes started with solid press-fit technology. Although these are still used today, concerns about board damage led to the use of compliant press-fit technology. This technology allows the connection to be made through compliance
  • Medical Device Link .
    conductors to form connectors featuring solderless assembly, a gasket-like seal, and multiple contacts. By using modular manufacturing techniques, the company wraps or embeds 50- um-diam wires in rubber substrates according to customer requirements. The resulting parts can. MPMN January/February 2005
  • Spring Pin Socket User Manual
    SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware
  • SMT Card-Edge Solutions: Part 2: Specifications & Design Considerations
    the daughter-board(s) that is completely solderless and eliminates labor-intensive. secondary operations or special handling. As outlined in this Tech Bulletin series, the fundamental key to success for integrating these two. technologies is to leverage best-practice disciplines on the SMT
  • Press-Fit Current Carrying Capacity - Part 1
    Driven by the explosive growth of automotive electrical systems and many other industries using inverter and converter based power modules, press-fit technologies have become the preferred alternative for delivering highly reliable, solderless interconnect solutions.
  • Press-Fit Interconnect Technology (.pdf)
    Press-fit technology allows for the insertion of a specially stamped terminal into a plated-through hole (PTH) in a printed circuit board (PCB) in such a way that an electro-mechanical connection is established without using solder. This solderless connection functions like the blade and socket
  • PCB Hole Construction and Material Requirements for use with Press-Fit Technologies
    Press-fit technology allows for the ¡nsertion of a specially stamped terminal into a plated-. through hole (PTH) in a printed circuit board (PCB) in such a way that a highly reliable. electro-mechanical connection is established without using solder. This solderless connection functions like
  • Press-Fit Current Carrying Capacity - Part 2
    , these capabilities enable solderless press-fit technologies to play a key role in the ongoing electrification of automotive applications as well as the evolution of new inverter and converter power module designs. The next Tech Bulletin in this series will address some of the specific design considerations

More Information on: Solderless Top

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