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Parts by Number for Solderless Top

Part # Distributor Manufacturer Product Category Description
SOLDERLESS TERMINAL ASAP Semiconductor HOLLINGSWORTH Not Provided Not Provided
BSN18-3K Heilind Electronics, Inc. PANDUIT Terminals-Solderless Butt Splice, nylon insulated, 22 - 16 AW
BSN10-D Heilind Electronics, Inc. PANDUIT Terminals-Solderless Butt Splice, nylon insulated, 12 - 10 AW
RV18-10L Heilind Electronics, Inc. 3M Terminals-Solderless 1 BAG = 50 RINGS, 10 BAG MINIMUM
LFV14-6L Heilind Electronics, Inc. 3M Terminals-Solderless 80610588123 1 PKG= 50 PCS PER PKG/BAG
MNU18-250DFIK Heilind Electronics, Inc. 3M Terminals-Solderless 80610057673 INSLT FM DSCN NYLN WR 18-22
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Conduct Research Top

  • Specifying Plated Thru-hole diameters for Solderless Press-fit Connectors
    of components becomes very difficult (it's like soldering to a sheet of copper). Wave soldering requires tremendous pre-heat, and reflow soldering needs many additional zones for pre-heat. Thus, solderless press-fit into plated through holes becomes a more practical method of attaching connectors. Connectors
  • Using Press-Fit and IDC for Solderless Magnetic Wire Terminations in Electric Motors and Power Products
    Compliant/Press-Fit interconnects are widely used in industrial, transportation, power module designs and many other applications to provide a solderfree, production-friendly and highly reliable alternative that overcomes the hassles and production problems with traditional solder-joints.
  • Bi-Spring Press-fit Contacts (.pdf)
    R eliable, solderless connections from connectors to backplanes started with solid press-fit technology. Although these are still used today, concerns about board damage led to the use of compliant press-fit technology. This technology allows the connection to be made through compliance
  • Medical Device Link .
    conductors to form connectors featuring solderless assembly, a gasket-like seal, and multiple contacts. By using modular manufacturing techniques, the company wraps or embeds 50- um-diam wires in rubber substrates according to customer requirements. The resulting parts can. MPMN January/February 2005
  • Design Considerations for Power Modules
    As discussed in previous Tech Bulletins, the explosive growth of automotive electrical systems and. other industries using inverter and converter based power modules is driving the need for press-fit. technologies to provide reliable, solderless interconnect solutions that can support high current
  • Spring Pin Socket User Manual
    SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware
  • SMT Card-Edge Solutions: Part 2: Specifications & Design Considerations
    the daughter-board(s) that is completely solderless and eliminates labor-intensive. secondary operations or special handling. As outlined in this Tech Bulletin series, the fundamental key to success for integrating these two. technologies is to leverage best-practice disciplines on the SMT
  • Press-Fit Current Carrying Capacity - Part 1
    Driven by the explosive growth of automotive electrical systems and many other industries using inverter and converter based power modules, press-fit technologies have become the preferred alternative for delivering highly reliable, solderless interconnect solutions.