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  • Medical Device Link .
    as the shape-memory alloy because its unique characteristics allow it to return to a predetermined shape after undergoing deformation. The material has excellent biocompatibility, good spring characteristics, and high corrosion resistance. This alloy is commonly used for implantable stents, although many other
  • Medical Device Link . Motor Provides Steady Power to X-Ray Viewing Device
    42-frame permanent-magnet gearmotor provided a large frame size and strong right-angle drive, supplying the load capacity required to wind and unwind the huge film spool. Another benefit was the steadiness and power of the Bodine motor. In typical systems, the drums driving the film reels have tortion
  • Medical Device Link . Industry News
    VDI/VDE Society for Measurement and Automatic Control, Postfach 10 11 39, D-40002 D usseldorf, Germany; phone: +49 211 6214215; fax: +49 211 6214161; e-mail: rosenzweig@vdi.de; Internet: http://www.vdi.de/gma/tagungen.htm. Hannover Messe Returns to Germany Hannover Messe 2000 will return
  • Humidity and Solder Paste - Avoid Issues
    /High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste and Powders. Wire
  • The Miracle of Soldering - an Historical Perspective
    Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste and Powders. Wire. Alloy Chart. Thermal Interface Materials. Heat-Spring (R). NanoFoil (R). Preforms. Ribbon and Foil. Other. Solder TIM. Thin-Film Materials. Featured Products. Sputtering Targets. Indium. Gallium. Others. Applications
  • Adding Solder to a NanoBond (R) Assembly
    . Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel
  • Solder Powder: IPC
    . Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste