Products/Services for SSOP Shrink Small Outline Package
IC Package Converters and Adapters - (43 companies)
Electronic and IC Packaging Services - (116 companies)
DRAM and SDRAM Memory Chips - (218 companies)...low-profile quad flat package (LQFP) and thin quad flat package (TQFP). DIPs are available in either ceramic (CDIP) or plastic (PDIP). Other IC package types include small outline package (SOP), thin small outline package (TSOP), and shrink small outline... Learn More
Shrink Tubing - (467 companies)
Small-Signal Bipolar Transistors (BJT) - (88 companies)
Shrink Wrap Machines - (261 companies)
Battery Charger ICs - (65 companies)
IC Voltage Regulators - (317 companies)
Smart Card Chips - (27 companies)
IC Switching Voltage Regulators - (130 companies)...of the TO-220 package. Other IC packages for IC switching voltage regulators include shrink small outline package (SSOP), small outline integrated circuit (SOIC), small outline package (SOP), small outline J-lead (SOJ), discrete package (DPAK), and power package... Search by Specification | Learn More
Product News for SSOP Shrink Small Outline Package
Myostat Motion Control, Inc.
Big Power in a Small Package Sold and supported in North America by Myostat Motion Control, The TBL-i mini servos are compact and lightweight. Capable of power ranging from 3W to 40W, these super compact closed loop AC servo motors start from a mere 14.5mm square output face, and peak speeds of up to 8,000 RPM are attainable. . Click here for more product information (read more)Browse AC Motors Datasheets for Myostat Motion Control, Inc.
Diener Precision Pumps LP
Accurate flow in a very small package. The Mini series is designed for applications requiring accurate flow in a very small package size. The wetted materials and gear construction are the same as those of its larger cousins, but by removing one of the shaft bearings the overall length is much shorter. In addition, the magnetic coupling has been miniaturized to further reduce the overall length without sacrificing highpressure performance. The inlet and outlet port locations can be located on the side, top, or end of the pump... (read more)Browse Gear Pumps Datasheets for Diener Precision Pumps LP
Cost-Effective, Small Package 8-bit MCUs Silicon Labs' new family of C8051F85x/6x 8-bit MCUs provides a low-cost, small form factor solution without compromising on features or performance in a wide range of consumer and industrial applications such as motor control, toys and motorized models, sensors, set-top boxes and optical transceiver modules. The F85x/6x family is AEC-Q100 qualified and outperforms other solutions in size, speed, features and analog performance. » Integrated analog peripherals – reduces overall... (read more)Browse Microcontrollers (MCU) Datasheets for Silicon Labs
Pelonis Technologies, Inc.
Big performance in a small package from PTI The new 5331 comp[act blower from Pelonis Technologies is made for high end equipment designs that require application-specific customization. Because it includes "Intelligent Motion Controls", the blower increases end-system performance and ensures long-term reliability. The K5331-37 Titan Series blower can be "ruggedized" with IP67 Ingress Protection (IP) parylene coating to protect it from dust and moisture. Specifications: 53x52x31mm (2.09x2.09x1.22in) 5V, 12V, 24V Dual Ball Bearings... (read more)Browse Electronic Cooling Fans Datasheets for Pelonis Technologies, Inc.
Precision Air Pressure Regulator in small package of set pressure. · Precision control - highly accurate air pressure regulation in a small package. · Pressure ranges up to 120 psig (8 BAR). · Compact and lightweight. · Two gauge ports and reversible bracket - allow front or back mounting. · Superior flow characteristics - aspirator design provides excellent resistance to droop. · Low air consumption - means less cost over time to the operator. · Available in 1/8 NPT, BSP porting and manifold... (read more)Browse Air Pressure Regulators Datasheets for ControlAir Inc.
HAWE North America Inc.
BV Series Valves: Small Package, Huge Reliability BVG, BVE, and BVP versions are 2/2- and 3/2-way and are available in three sizes: Size 1 has a flow up to a maximum of 5 gpm (20 lpm) at operating pressures up to a maximum of 7,200 psi (500 bar). Size 3 has a flow up to a maximum of 13 gpm (50 lpm) at operating pressures of up to a maximum of 5,800 psi (400 bar). Size 5 is a 2/2-way valve for a volume flow up to a maximum of 80 gpm (300 lpm) at operating pressures up to a maximum of 5,800 psi (400 bar). The NBVP version is only available as... (read more)Browse Hydraulic Valves Datasheets for HAWE North America Inc.
Servo Drives Feature High Power in a Small Package Due to popular demand Advanced Motion Controls, of Camarillo, CA, have expanded the capabilities of their popular M/V ™ series Electric Mobility Servo Drives. Key improvements include 125A continuous with 200A peak for 10 seconds at 80VDC, and 100A fixed continuous at 175VDC (previously 80A continuous). The M/V ™ series is designed for electric mobility applications such as traction, steering and lifting for UAV's, AGV's, Material Handling and more. With just over a year... (read more)Browse Servo Drives Datasheets for Electromate
Brentwood Plastics, Inc.
Vented Shrink Film For shrink film applications ( most often packages formed with centerfold and L bar sealer ) which require venting to evacuate air, we provide film with 1/16" vents / perforations. Our standard pattern is a 3" grid. A wide array of custom patterns and hole sizes are available. (read more)
Teflon Heat Shrink and giving sufficient time for recovery. • Even heating and cooling of all sides will provide the best result. • See special note below. FEP Heat Shrink Guidelines. • Requires 420 °F +/- 50 ° (215 °C +/- 10 °) to recover. • Only requires a small degree of recovery. • See special note below. Special Note: All of our products conform to both military and commercial standards, and in most cases, exceed the intent of these standards. The heat shrink temperatures... (read more)
Parker Hannifin / Fluid Connectors / Parflex Division
Parker Speeds Up Delivery On Medical Heat Shrink is typically produced as a custom run, with sizes as small as .020 ” expanded and wall thicknesses as small as .003 ”, the supermarket allows customers to quickly obtain small quantities without the lead times associated with R & D runs. For more than 10 years, Parker Hannifin has extruded USP Class VI compliant, medical grade heat shrink from ETFE, PTFE, and FEP under the TexMed brand at the Parker Texloc facility in Fort Worth, Texas. Visit us at Parker Booth #3101 June 18-20 at MDM East... (read more)
LAYOUT. The PCB layout is shown in Figure 2. The PIC16F690. package is a 20-lead plastic shrink small outline. (SSOP). The load capacitors and dumping resistors. are 0603 size surface mount packages. The PCB is 0.062 " double sided FR4 material. Not. shown in the diagram is a solid ground plane...
Engineering Web Search: SSOP Shrink Small Outline Package
ADM3202/ADM3222/ADM1385 (Rev. E)
and ADM1385) 10V C2??? INVERTER + 0.1??F 10V PDIP, SOIC_N, SOIC_W, SSOP, and TSSOP options T1IN T1 T1OUT Upgrade for MAX3222/MAX3232 and LTC1385 CMOS
See Digi-Key Corporation Profile & Catalog
Surface-mount technology - Wikipedia, the free encyclopedia
The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors.
Package (elettronica) - Wikipedia
SSOP-EIAJ: SSOP: Shrink Small-Outline Package TSSOP: Thin Shrink Small Outline Package
SSOP definition - Small Business Computing Online Dictionary...
Intel Small Outline Package Guide (PDF) The Plastic Small Outline Package (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package