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Step Height Instrument

 

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Surface profilometers are contact or non-contact instruments used to measures surface profiles, roughness, waviness and other finish parameters.
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Parts by Number for Step Height Instrument Top

Partb # Distributor Manufacturer Product Category Description
6624093 RS Components, Ltd. Texas Instruments Charge Pump Function:Inverting/Step Up/Step Down; Output Voltage:-1.6 - -5.25; Output Current:60; Supplier Package:SOT-23; Pin Count:5; Product Height:1.15mm; Product Length:2.9mm; Product Width:1.6mm; Mounting:Surface Mount; Maximum Operating Temperature:125C
6624090 RS Components, Ltd. Texas Instruments Charge Pump Function:Inverting/Step Up/Step Down; Output Voltage:-1.6 - -5.25; Output Current:60; Supplier Package:SOT-23; Pin Count:5; Product Height:1.15mm; Product Length:2.9mm; Mounting:Surface Mount; Minimum Operating Temperature:-40C; Maximum Operating Temperature:125C
6624097 RS Components, Ltd. Texas Instruments Charge Pump Function:Inverting/Step Up/Step Down; Output Voltage:-1.6 - -5.25; Output Current:60; Supplier Package:SOT-23; Pin Count:5; Product Height:1.15mm; Maximum Operating Temperature:125C; Product Width:1.6mm; Mounting:Surface Mount; Minimum Operating Temperature:-40C
7098871 RS Components, Ltd. Texas Instruments DC to DC Converter and Switching Regulator Chip Type:Non-Inverting,Inverting,Step Up,Step Down; Number of Outputs:1; Minimum Input Voltage:0V; Maximum Input Voltage:24V; Output Voltage:5V; Maximum Output Current:1A; Switching Regulator:Yes; Supplier Package:HTSSOP EP; Pin Count:20; Product Height:1.15mm
5171191 RS Components, Ltd. Texas Instruments Charge Pump Function:Inverting/Step Up/Step Down; Output Voltage:-1.6 - -5.25; Output Current:60; Supplier Package:SOT-23; Pin Count:5; Minimum Operating Temperature:-40C; Mounting:Surface Mount; Product Width:1.6mm; Product Length:2.9mm; Product Height:1.15mm

Conduct Research Top

  • Application Note for the Layout Packages for Texas Instrument's CC2420 & CC2430 Extended to CC2500 (.pdf)
    superior part. to part consistency through proven fabrication technology based on multilayer organic substrates. The same technology provides a balun with a sub 1mm height profile for height constrained. applications. Anaren baluns, because of the achievable gain flatness, support wide bandwidths
  • MICRO: Defect Analysis and Metrology - Ge (Feb 2000)
    of this technique. Two high-resolution defect review techniques, scanning electron microscopy (SEM) and atomic force microscopy (AFM), can be used to characterize deep submicron defects. While SEM provides information on lateral defect size and shape, it does not provide quantitative height information
  • MICRO: APC/AEC
    , and speed, trench depth variation results in post-CMP step height variation, the erosion of active areas (moats), gate length reduction, incomplete isolation trench oxide fill and voids, IDDQ failures, and reduced wafer yields. To control STI CD and trench depth, effective and robust process control
  • MICRO:Product Technology News (March '99)
    Equipped with a front-opening unified pod, the V 300-SL surface profiler enables users to monitor process wafers in a fully automated environment. Stylus-based measurement technology provides step height repeatability for monitoring the uniformity of etch and deposition processes. The profiler's
  • Product Technology News
    accurate measurements and a one-step zooming capability. Nondestructive imaging is performed with low-amplitude cantilever oscillation to protect fragile surfaces from probe damage. The instrument can be configured to accommodate scanning modes such as contact, near-contact, and noncontact AFM
  • Measurement of Certified Cement with Dry Jet Dispersion Technology (.pdf)
    The cement industry improves the performance of its products every day. This continuous adaptation of production plants to technical, ecological and so on requirements makes it necessary for regular monitoring during cement manufacturing. Some samples are taken in every step of the process
  • GapmanGen3 Electronic Gap Measurement System for Aircraft Applications
    manufacturers have been. using traditional contact methods (plastic shims, feeler gauges, step gauges etc.). to measure gaps during the production and final assembly of commercial and. military aircraft. Hundreds of gaps between metal/metal, metal/Carbon Fiber. Reinforced Polymer (CFRP) and CFRP/CFRP
  • MICRO: Advanced Process
    over an STI trench. The first is that profilometer technology is based on measuring the deflection of a stylus affixed to the tip of a cantilever beam. As the stylus is physically dragged across the surface of the wafer, as illustrated in Figure 3, it records the step height of the structures

Engineering Web Search: Step Height Instrument Top