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Step Height Profilometer

 

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Surface profilometers are contact or non-contact instruments used to measures surface profiles, roughness, waviness and other finish parameters.
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  • Description: Fast 3D noncontact robust factory floor profilometer, roughness OR form
    • Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt ), Hybrid Parameters, Defects / ADC, Flatness, Lay / Pattern, Step Height, Thickness, Warp / Bow, Specialty / Custom
    • Technology: Non-contact - Optical / Laser
    • Surface Metrology: 2D / Line Profile, 3D / Areal Topography
    • Common Specific Parameters: Roughness Average (Ra), Roughness- RMS (Rq), Mean Peak to ValleyHeight (Rtm, Rz), Base Roughness Depth(R3Z), Maximum PeakHeight(RP), Average Peak Profile Height (Rpm), Maximum Valley Depth (RV), TotalRoughness Height (Rt, PV), Profile Depth (Pt), Maximum Roughness Depth (Rmax, Ry), Ten Point Height (Rz JIS), Skewness (Rsk), Kurtosis (Rku), Waviness Average (Wa), Waviness Height (Wt), Peak Count (PC), Peak Spacing Average (Sm), Core Roughness Depth (Rk), Bearing Ratio (TP, Rmr), SlopeRa (Deltaa), SlopeRMS (Deltaq), Other
  • Description: The MTI-2100 features advanced fiber-optic and electronic technologies for precise measurements of displacement, position and vibration. It sets new performance standards with resolution up to 0.01 uin. (2.5 Angstroms) and frequency response from direct-coupled (dc) up to 500 kHz. The
    • Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt ), Defects / ADC, Flatness, Lay / Pattern, Step Height, Thickness, Warp / Bow
    • Technology: Non-contact - Optical / Laser
    • Common Specific Parameters: Other
    • Industrial Applications: Automotive, Coatings (Thin Films, Plating, etc.), Mechanical Parts (Bearings, Shafting), Precision Machining / Grinding, Storage Media
  • Description: Use CrossCheck for faster startups and changeovers while reducing product scrap and rework. Easily diagnose root causes of product variation to improve dimensional quality and operator variability, enabling 100% product certification.
    • Measurement Capability: Flatness, Step Height, Thickness, Warp / Bow
    • Technology: Non-contact - Optical / Laser
    • Surface Metrology: 2D / Line Profile, 3D / Areal Topography
    • Common Specific Parameters: Average Peak Profile Height (Rpm), Maximum Valley Depth (RV), Peak Count (PC)
  • Description: The Dektak® 8 Advanced Development Profiler combines high repeatability, low-force sensor technology, and advanced 3D data analysis for surface characterization of MEMS, semiconductors and other thin/thick films. The system’s impressive step height repeatability and vertical range, plus
    • Measurement Capability: 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Step Height
    • Surface Metrology: Surface Profilometry
    • Technology: Contact / Stylus Based
    • Industrial Applications: Semiconductor Manufacturing
  • Description: range option of 1 millimeter enables larger step measurements 6 Angstrom repeatability with optional 4 angstrom performance to be industry-best NLite accessory for measurement of soft materials like photoresist
    • Measurement Capability: 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Step Height
    • Surface Metrology: Surface Profilometry
    • Technology: Contact / Stylus Based
    • Industrial Applications: Semiconductor Manufacturing

Conduct Research Top

  • Inspecting Hard-to-Reach Surfaces (.pdf)
    is an unfolded image of the internal surface. of the gun barrel in Figure 5. Height is encoded in the. brightness of the pixels. Dark to bright gray levels. represent a depth span of 750 µm. Surface features. in the order of a few microns would contribute to the. signature transferred to bullets. Figure 4
  • MICRO: Advanced Process
    over an STI trench. The first is that profilometer technology is based on measuring the deflection of a stylus affixed to the tip of a cantilever beam. As the stylus is physically dragged across the surface of the wafer, as illustrated in Figure 3, it records the step height of the structures
  • MICRO:Archive:Back Issue TOC
    , wafer transport robot, XRF analyzer, height-adjustable workbench, etch manometer, power supplies, airflow measurement system, computer workstations, and more. Product Extra!. Products in Action: Control system speeds start-up and stabilizes process air in DUV litho tool clusters. SEMICON West 2000

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