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  • Stress-free strain gaging
    , and material analysis. A common way to use a strain gage is in a bridge configuration. Usually this requires an excitation signal such as a voltage source and a number of external components. But a new IC minimizes the number of components, simplifying design. The MAX1452 is an integrated signal-conditioning
  • Practical Strain Gage
    With today's emphasis on product liability and energy efficiency, designs must not only be lighter and stronger, but also more thoroughly tested than ever before. This places new importance on the subject of experimental stress analysis and the techniques for measuring strain. The main theme
  • Strain Gage Technical Data
    metallic wire, and foil resistance gages. The bonded resistance strain gage is by far the most widely used in experimental stress analysis. These gages consist of a grid of very fine wire or foil bonded to the backing or carrier matrix. The electrical resistance of the grid varies linearly with strain
  • Strain Gage Measurement Techniques (.pdf)
    With today's emphasis on product liability and energy efficiency, designs must not only be lighter and stronger, but also more thoroughly tested than ever before. This places new importance on the subject of experimental stress analysis and the techniques for measuring strain. The main theme
  • Full-Field Dynamic Displacement and Strain Measurement Using Advanced 3D Image Correlation Photogrammetry
    Full-field optical techniques are increasingly appreciated as deformation, stress and strain measuring tools. This article discusses an advanced deformation and strain analysis method based on 3D image correlation photogrammetry that is substantially more robust and has greater dynamic range than
  • Root Cause Failure Analysis - Understanding Mechanical Failures
    doesn 't exceed the "yield point", and the part deforms elastically, i.e., when the load is released the part returns to its original shape. This is shown in , a "stress-strain " diagram that shows the relationship between loads and deformation. In a good design, the part operates in the elastic range
  • Dynamic Mechanical Analysis (.doc)
    The DMA determines changes in sample properties resulting from changes in five experimental variables: temperature, time, frequency, force, and strain. The deformation can be applied sinusoidally, in a constant, or under a fixed rate. The DMA uses samples that can be in bulk solid, film, fiber, gel
  • Better Sealing Through FEA
    company developed and validated FEA methods for comparing common sealing polymers. All plastics and elastomers inherently move and deform under load, a behavior generally called . It is most commonly known as creep and stress relaxation. is the increase in deformation or strain under a constant load
  • Start here when simulating rubber and foams
    and strains. Typically, analyses of rubber involve up to 200 to 300% strain while foam handles up to 600 to 700% strain. Unlike common metals, which can be defined by relatively simple bilinear stress-strain curves with discernible yield points, hyperelastic materials are characterized by continuous change
  • One way to verify material models
    format easily read by Ansys, thereby eliminating retyping and transcription errors. For instance, initial simulations of an electrical seal revealed that material properties necessary for good analysis (compressive stress-strain data and planar tension data) were unavailable and could not be generated

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