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Surface Metrology System

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  • Non-Contact 3D Surface Metrology of Large Grain High Purity Niobium by SLCM and FESEM
    Abstract - Non-Contact 3D Surface Metrology of Large Grain High Purity Niobium by. SLCM and FESEM. Z.H. Sung, P.J. Lee and D.C, Larbalestier. Applied Superconductivity Center, National High Magnetic Field Laboratory,. Florida State University, FL, 32310.
  • MICRO: Defect/Yield Analysis & Metrology
    are especially valuable for CMP process development and control. The optoacoustic technique generates and detects ultrasonic waves using laser light, and, in contrast to profilometry, which measures surface topography, it measures metal thickness directly. For CMP applications, commercially available
  • Measuring Surface Slope Error on Precision Aspheres (.pdf)
    design tolerance analysis. With this awareness, more optical engineers are putting requirements for peak surface slope on optical element drawings. This puts pressure on optical fabricators to understand slope specifications and react to these requirements, and use the appropriate metrology
  • Surfaces and their Measurements
    Surfaces and their Measurements. This book is primarily intended to help designers and inspectors to understand the fundamentals of surface metrology and, where appropriate, point to relevant procedures for specification.
  • Watch and Clock Part Surface Quality Depends on White-light Interferometry (.pdf)
    Optical metrology is gaining in importance for quality assurance of precision micro-parts. Fast, high resolution measurements using a non-contact, non-reactive (zero mass loading) optical technique are particularly appealing for micro-parts. By reviewing an application from the watch
  • Measuring the Right Things at the Right Time Will Add Value to Products and Processes
    ' needs. Their customers need to reduce costs, and inspection is a cost. Ergo, the prices of high-end form and surface metrology systems - and the development of ever more sophisticated ones - is not justified.
  • MICRO:February 1998:Anaysis & Metrology Post-CMP; by Cheri Dennison, (p 31)
    used primarily for polishing intermetal dielectric (IMD) layers and then for treating tungsten plugs, CMP is being used in additional process segments, in particular in shallow trench isolation (STI). Because CMP inevitably creates substantial amounts of surface contaminants and can introduce many
  • Medical Device Link .
    Surface Metrology for Stent and Implant Manufacturing White-light interferometry combines speed, resolution, flexibility, and ease of use to enable process optimization and quality control measurements of surface contours and quantitative roughness. Implanted devices and prostheses have

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