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  • TA-MS Connection Optimisation and Improved Data Interpretation (.pdf)
    To optimise TA-MS equipment : New equipment can be configured with optimum connections. Existing systems should be connected through customised couplings. Novel methods are available e.g. the direct solid insertion probe. Data interpretation and methods : Library search, linear combination, matrix
  • Case Study:GEN2 T-A (R) Composite Automotive
    powder metal steel components that were joined by sinter-brazing. The customer was drilling with a special solitude carbide TiN coated twist drill. The tool was run at 1600 RPM and .010 IPR and was holding true position requirements.
  • MICRO: 'Round the Circuit
    limits of Ta/TaN barrier technology, a team at Infineon's Munich Research Labs assessed the integration of metallic films required to keep copper metal lines from
  • MICRO:Building Copperopolis (Jan '99)
    deposition as well as electroless and electrolytic plating each with different grain sizes and fill characteristics. There are still many important issues to be resolved, however, before dual-damascene copper technology can be successfully implemented. Tantalum (Ta)- and tungsten (W)-based diffusion
  • Product Extra!
    bottom coverage of high-aspect-ratio structures. Degree of ionization is >90%, and sputter pressure is <1 15 millitorr. The system suits production of sub-0.18- um devices using films such as Ti, TiN, Ta, TaN, AlCu, and Cu seed layers. Applications include deposition of Ti/TiN liner/barrier layers

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