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  • TA-MS Connection Optimisation and Improved Data Interpretation (.pdf)
    To optimise TA-MS equipment : New equipment can be configured with optimum connections. Existing systems should be connected through customised couplings. Novel methods are available e.g. the direct solid insertion probe. Data interpretation and methods : Library search, linear combination, matrix
  • Case Study:GEN2 T-A (R) Composite Automotive
    powder metal steel components that were joined by sinter-brazing. The customer was drilling with a special solitude carbide TiN coated twist drill. The tool was run at 1600 RPM and .010 IPR and was holding true position requirements.
  • MICRO: 'Round the Circuit
    limits of Ta/TaN barrier technology, a team at Infineon's Munich Research Labs assessed the integration of metallic films required to keep copper metal lines from
  • MICRO:Building Copperopolis (Jan '99)
    Maria L. Peterson, Robert J. Small, Gordon A. Shaw III, Zhefei J. Chen, and Tuan Truong, The National Technology Roadmap for Semiconductors developed by the Semiconductor Industry Association projects that there will be seven or eight metal levels on ULSI logic devices by 2006, along with metal
  • Product Extra!
    An alternative to traditional PVD technologies, the Inova system combines a hollow cathode magnetron source and a high-productivity platform to uniformly deposit sputtered metal films. The source offers directional deposition unaffected by feature width. The system's cup-shaped target

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