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Tantalum Fillers

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Refractory metals are a class of metals that are extraordinarily resistant to heat and wear and have extremely high melting points. Reactive metals have a strong affinity for oxygen and nitrogen at elevated temperatures and are highly resistant to corrosion at low temperatures.
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  • Description: ; Suggested applications: o Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanical protection for SMDs. o Hybrids: substrate attach of ceramic circuit to package. Underfill below SMDs; staking large tantalum caps to ceramic substrates, lid sealing. o Opto-electronics: sensor
    • Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Polymer / Chemical Type: Epoxy (EP)
  • Description: Specifications AWS A5.14-89 Class ERNiCrFe-5 MIL-E-21562 TYPES MIL-RN62, MIL-EN62 MIL-R-5031 Class 8A ASME SFA5.14 Class ERNiCrFe-5 AMS 5679 E Description Washington Alloy 62 is a nickel-chromium-iron filler metal designed specifically for welding maximum 2” thick base metals
  • Description: Welds made using this filler metal offer improved corrosion resistance. Uses in industrial applications are similar to those of ERTi-2 materials. Titanium is a reactive metal that is sensitive to embrittlement by oxygen, nitrogen and hydrogen at temperatures above 500F. This can be provided
    • Alloy Type: Titanium Alloy
  • Description: ; Suggested applications: o Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanical protection for SMDs. o Hybrids: substrate attach of ceramic circuit to package. Underfill below SMDs; staking large tantalum caps to ceramic substrates, lid sealing. o Opto-electronics: sensor
    • Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Polymer / Chemical Type: Epoxy (EP)
  • Description: ; Suggested applications: o Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanical protection for SMDs. o Hybrids: substrate attach of ceramic circuit to package. Underfill below SMDs; staking large tantalum caps to ceramic substrates, lid sealing. o Opto-electronics: sensor
    • Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Polymer / Chemical Type: Epoxy (EP)
  • Description: ; Suggested applications: o Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanical protection for SMDs. o Hybrids: substrate attach of ceramic circuit to package. Underfill below SMDs; staking large tantalum caps to ceramic substrates, lid sealing. o Opto-electronics: sensor
    • Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Polymer / Chemical Type: Epoxy (EP)
  • Description: ; Suggested applications: o Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanical protection for SMDs. o Hybrids: substrate attach of ceramic circuit to package. Underfill below SMDs; staking large tantalum caps to ceramic substrates, lid sealing. o Opto-electronics: sensor
    • Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Polymer / Chemical Type: Epoxy (EP)
  • Description: ; Suggested applications: o Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanical protection for SMDs. o Hybrids: substrate attach of ceramic circuit to package. Underfill below SMDs; staking large tantalum caps to ceramic substrates, lid sealing. o Opto-electronics: sensor
    • Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Polymer / Chemical Type: Epoxy (EP)
  • Description: ; Suggested applications: o Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanical protection for SMDs. o Hybrids: substrate attach of ceramic circuit to package. Underfill below SMDs; staking large tantalum caps to ceramic substrates, lid sealing. o Opto-electronics: sensor
    • Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
    • Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Polymer / Chemical Type: Epoxy (EP)
  • Description: ; Suggested applications: o Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanical protection for SMDs. o Hybrids: substrate attach of ceramic circuit to package. Underfill below SMDs; staking large tantalum caps to ceramic substrates, lid sealing. o Opto-electronics: sensor
    • Material Type / Grade: Thermoset
    • Chemical / Polymer System Type: Epoxy
    • Resins & Compounds: Liquid
    • Compound Type: Casting Resin
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Engineering Web Search: Tantalum Fillers Top

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Abstract: The effect of incorporation of tungsten carbide (WC) and tantalum niobium carbide (Ta/NbC) powders on three-body abrasive wear behaviour in
Tantalum Nano Particle Coating, Tantalum Particle Nano...
tantalum treatments for nanoparticles can alter the functionality of of your particles or fillers to increase hydrophobicty and oleophobicity, alter
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Inorganic nanotube - Wikipedia, the free encyclopedia
high impact-resistance.[12 They are therefore promising candidates as fillers for polymer composites with enhanced thermal, mechanical, and
ETH - MET - Theses
Andreas Kägi (MSc), Carbonaceous Fillers for Composites: Characterization and Raman Spectroscopy during Tensile Tests
Manufacturing - Aerospace Engineering Online
applications, such as strength at elevated temperatures, there is a need to use other fillers, even though they may be more difficult to braze.
See SAE International Information
Poly[tantalum phosphinates
The preparation thereof is based on the reaction of a tantalum pentavalent compound (TaZ.sub.5) with a phosphinic acid (RR'P(O)OH) in a dry inert

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