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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
D25IT Global Industrial K & G Power Systems Not Provided Ingersoll Rand High-Temperature Non-Cycling Air Dryer D25it, 115v, 15 Cfm, 215 Psig
D140IT Global Industrial K & G Power Systems Not Provided Ingersoll Rand High-Temperature Non-Cycling Air Dryer D140it, 115v, 82 Cfm, 219 Psig
D60IT Global Industrial K & G Power Systems Not Provided Ingersoll Rand High-Temperature Non-Cycling Air Dryer D60it, 115v, 35 Cfm, 217 Psig
K36L5017 Radwell Ranco Controls & Indicators, Temperature & Process Control TEMPERATURE CONTROL AC CYCLING
C12501007G Radwell Ranco Controls & Indicators, Temperature & Process Control TEMPERATURE CONTROL A/C CYCLING

Conduct Research Top

  • Temperature Coefficient and Ageing of BAW Composite Materials
    are reported on hermetic packaging, temperature cycle testing, temperature coefficient measurements, and preliminary ageing. This paper will report on progress made in ageing studies and temperature cycling of 644 MHz temperature compensated resonators. Thin film resonators may be composed of materials
  • What is a Humidity Test?
    A humidity test simulates the moisture-laden air found in tropical regions. There are typically two types of humidity tests, condensing and non-condensing. Condensing humidity tests consist of temperature cycling in high relative humidity air.
  • AN0019 Tin Whiskers
    ) into understanding causes for Tin whisker formation. It is believed that stresses within the Tin such as from intermetallic formations, oxidisation/ corrosion, thermal stress (temperature cycling) and/ or mechanical stress may contribute to Tin whisker formation.
  • Copper vs Copper Tungsten Flanges
    becomes more critical. This becomes even more important if the part is subject to power or temperature cycling. The all brazed CuW part solves this problem and provides the highest reliability part for all applications. Unfortunately, as with any engineering solution there is always a compromise
  • Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
    to demonstrate that these materials not only have low bulk thermal resistance, but also very low interfacial, or contact resistance. These adhesives have a low modulus and high adhesion, which enables them to flex and remain bonded as the laminate package undergoes stress during temperature cycling.
  • Brushless washer maker finds reliability in screwless connections
    . The Wago blocks use spring pressure alone to make electrical connections. Spring-pressure terminals automatically adjust to the size of the wire inserted. This eliminates concerns about loosening because of temperature cycling or vibration. And the constant dynamic pressure on the wire, plus the use
  • Medical Device Link .
    applied, so that precise temperature control is possible by regulating the input power. Thermoelectrics can be used to cool to 100 C or heat to above 200 C, making them the most versatile technology available for temperature-cycling regimens in medical products. In addition, their compact design
  • Measuring Tube Construction Affects the Long-Term Stability of Magmeters (.pdf)
    significant temperature and pressure excursions during cleaning.

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