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Parts by Number for Thermal Adhesive Tape Top

Part # Distributor Manufacturer Product Category Description
AF111 Digi-Key 3M Tapes, Adhesives THERMAL BONDING FILM 1/2" X 36YD
AF42 Digi-Key 3M Tapes, Adhesives THERMAL BONDING FILM 4" X 72YD
APR35-35-12CB/A01 Digi-Key CTS Thermal Management Products Fans, Thermal Management HEATSINK FORGED W/ADHESIVE TAPE
57.5MM-57.5MM-10-8815 Digi-Key 3M (TC) Fans, Thermal Management TAPE ADHESIVE TRNSFR 57.5X57.5MM
3M 8810 CIRCLE-2"-100 Digi-Key 3M (TC) Fans, Thermal Management TAPE ADHESIVE TRANSFER 2" CIR
1-5-8805 Digi-Key 3M (TC) Fans, Thermal Management TAPE ADHESIVE TRANSFER 1" X 5YD
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Conduct Research Top

  • Reducing Contact Thermal Resistance
    Material (TIM) should be used to fill the air gaps between the two surfaces. There are a number of technologies that can be used, including thermal greases and thermally conductive compounds, elastomers, adhesive tapes, etc., each with their own characteristics (operating temperatures, ease
  • Thermal Interface Materials - A Brief Overview
    adhesive tapes, and phase change materials. These are briefly described below. Thermal Greases. Comprised of thermally conductive ceramic fillers in silicone or hydrocarbon oils, a thermal grease is a paste that is applied to one of the two mating surfaces. When the surfaces are pressed together
  • Medical Device Link . SPOTLIGHT ON ADHESIVES
    many bonding requirements. Tecknit, 129 Dermondy St., Cranford, NJ 07016. Phone: 908/272-5500. Conductive adhesives Silicone-based adhesives and heat-sink compounds are suitable for bonding microelectric components. The adhesives provide a wide range of thermal management interface media between
  • Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
    Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow
  • Medical Device Link .
    for EMI absorption; or copper, aluminium or metallic foil with a conductive or nonconductive acrylic adhesive for shielding. Conductivity. Another area of interest is adhesives that are actively thermally conductive, particularly tapes. Materials used for these kinds of adhesives can include thermal
  • Medical Device Link .
    in applications in which soldering would be ineffective or impractical. Syon products offer thermal conductivity and can be used to bond or seal electrical components or wiring in applications that require heat dissipation. The low-shrink and nonshrink epoxy and epoxide formulations mix and pour easily
  • Comparing the Performance Characteristics of DuraSurf UHMW-PE to Other Materials
    . Seconds. <.01. <.01. <.01. DISSIPATION FACTOR. At 50Hz. D150. 0.0594. 0.0213. 0.0082. At 10KHz. D150. 0.1085. 0.0690. 0.0022. At 5MHz. D150. 0.1035. 0.2340. 0.0034. THERMAL PROPERTIES. Crystalline Melting. Range. Polarizing. °C (°F). 136 (276). 134 (273). 134 (273). Crystallinity. D3417-96. %. 48. 47
  • Medical Device Link .
    Materials (The Woodlands, TX) combines high electrical and thermal conductivity and good bond strength. It features an extended work life of up to four days at room temperature and cures in one hour at 165 C. The Araldite 7047 material is a high-purity, 100%-solids system designed for void-free bonding

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