Products/Services for Thermal Compound Distributor
Thermal Compounds and Thermal Interface Materials - (180 companies)
Conductive Compounds - (179 companies)...into a polymerized compound or bond. Two component systems are mixed and then applied. Conductive Compound Specifications. Selecting conductive compounds requires an analysis of physical, mechanical, thermal, electrical, and optical properties. Thermal Properties... Search by Specification | Learn More
Encapsulants and Potting Compounds - (236 companies)
Electrical and Electronic Resins - (500 companies)
Product News for Thermal Compound Distributor
Custom Thermal Compounds and Interface Materials Indium Corporation manufactures custom thermal compounds and thermal interface materials to match your specifications. Indium Corporation manufactures a complete line of indium inorganic chemicals, each with unique physical and chemical properties. End use application range from use as a transparent conductor in flat panel computer displays to improving the operational efficiency in alkaline batteries. (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Indium Corporation
Thermal Interface Adhesive Secure ® 1500KT2 is a polyimide reinforced silicone adhesive film. The thermally conductive silicone rubber chemically bonds electronic components to heat sinks for robust attachment in the presence of heat, humidity, thermal shock, and vibration. The polyimide film reinforcement yields high dielectric strength, cut-through resistance, and dimensional stability for easy assembly. Bonding electronic components to heat sinks eliminates the need... (read more)
Best in Class Thermal Stability Arlon is the worldwide leader in silicone flexible heater substrates. Our products' performance in thermal stability is recognized by Underwriters Laboratories--Arlon UL card 54153 (please click to see details). Here are the tests UL conducted: Thermal Endurance for a Relative Thermal Index. Resistance to Ignition and Tracking properties. Hot Wire Ignition (HWI). High-Current-Arc Ignition (HAI). High-Voltage-Arc Tracking Rate (HTVR). High Voltage Low-Current-Arc Resistance. Comparative Tracking... (read more)
MINTEQ® International Inc, Pyrogenics Group
Graphite Thermal Spreaders...PYROID® Pyrolytic PYROID ® HT Pyrolytic Graphite thermal spreaders and heat sink material. Minteq Pyrogenics Group powerful new weapon in the battle against thermal heat in state of the art electronic circuits and devices. PYROID HT Pyrolytic Graphite thermal spreader and heat sink material offers design engineers lightweight (only 25% of the weight of copper) thermal management options with exceptional performance. PYROID HT matches the thermal performance of CVD diamond at 1700 W/mK and substantially... (read more)
Newest, Most Advanced Thermal Management Adhesives Epoxy Technology announces its newest epoxies for superior thermal management: EPO-TEK EK1000, ED1003 & H20E-HC. These silver-filled adhesives exhibit exceptional thermal/electrical conductivity and provide superior performance in high-reliability applications. Properties include high Tg, low outgassing, long pot life with proven thermal performance in solar concentrators, LEDs and ICs. (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Epoxy Technology
Master Bond, Inc.
Durable Thermal Adhesive Cures at 20°F Master Bond EP24AN is a fast curing two part epoxy designed to cure at room temperatures and produces high strength bonds to a wide variety of substrates. Master Bond EP24AN possesses an unusual property of curing at temperatures as low as 20°F.It features an exceptionally high thermal conductivity of over 22 BTU •in/ft² •hr •°F. Other noteworthy features include superior electrical insulation properties, enhanced dimensional stability and tensile shear strength over 1600 psi... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc.
Energy Saving Thin Profile Thermal Insulation consumption. Electricity cost savings for flexible heaters. Electricity cost savings for facility air conditioning. 3. Longer service life. Silicone foam degrades at operating temperature over 180°C. 4. Particle free. Thermal insulation material is totally sealed in robust silicone rubber. 5. Adheres well to Arlon's uncured flexible heater substrate compounds. 6. Is easily bonded to Arlon's flexible heater substrates. There are two product options: 680-R3839R and 680-R3844R. Both products are 0.084... (read more)
Bergquist Gap Pad HC1000 Thermal Conductive Fill Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks.The "gel-like" modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad HC1000 is offered with removable protective liners on both sides of the material. Features and Benefits: Thermal conductivity: 1.0 W/m-K. Highly conformable, low hardness. "Gel-Like" modulus. Fiberglass... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
Bergquist Hi-Flow 330P Thermal Conductive Material The Bergquist Company announces the latest addition to its family of thermally conductive phase change materials. • Thermal impedance: 0.18°C-in2/W (@25 psi). • Natural tack for ease of assembly. • Exceptional thermal performance in an insulated pad. Hi-Flow 330P is a thermally conductive phase change material featuring a natural tack on one side and reinforced with a polyimide film. The polyimide film provides a high dielectric strength and cut through resistance. Hi-Flow... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
BERGQUIST - Sil Pad K-10; Thermal Insulator Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. Sil-Pad K-10 is designed to replace ceramic insulators such as Beryllium Oxide, Boron Nitride and Alumina. Ceramic insulators are expensive and they break easily. Sil-Pad K-10 eliminates breakage and costs much less than ceramics. Features and Benefits. Thermal impedance: 0.41°C-in2/W (@50 psi). Tough... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
Material (TIM) should be used to fill the air gaps between the two surfaces. There are a number of technologies that can be used, including thermal greases and thermally conductive compounds, elastomers, adhesive tapes, etc., each with their own characteristics (operating temperatures, ease...
...and heat pipes. On the down side, TECs require a dc power source and are more expensive than passive components. THERMAL COMPOUNDS When mounting a cooling device to a component or assembling a cooling system, designers must select a thermal bonding material that will allow heat to flow out...
Thermal-mechanical decoupling by a silicone thermal interface material (TIM) is one of the most important properties in electronic applications involving a printed circuit board (PCB). Thermal-mechanical decoupling requires that the thermal interface material have low shear modulus and high...
All elastomers have a coefficient of thermal expansion. Simply put, this value describes how the material changes in length, area, or volume with changes in temperature. In the case of rubber door and window seals, linear expansion is important because it helps to predict how a change...
...insulator. Another disadvantage is that it can be inconvenient to dispense and apply and it requires cleanup to prevent contamination problems. . Cure-in-Place Thermally Conductive Compounds. A thermally conductive compound again incorporates thermally conductive ceramic fillers. However, unlike thermal...
142. 287. 142. HDT @ 264psi. °F/°C. 261. 127. 261. 127. 280. 138. 280. 138. 254. 123. CTE (flow). -. 10 5 1/°F and. 4.06. 7.31. 3.82. 6.88. 4.15. 7.47. 1.15. 2.07. -. 10 5 1/°C. CTE (transverse). -. 10 5 1/°F and. 3.85. 6.93. 3.92. 7.06. 3.88. 6.98. 1.52. 2.74. -. 10 5 1/°C. Thermal conductivity. W...
...assemblies compound the. profilers would often overheat, leading to. micro BGAs, high ball-count. issues. Higher temperature requirements. inaccurate readings, lengthy cool-downs. BGAs, LGAs, etc. These. for lead-free reflow make it harder to. and even device failure. As components,. easy to use thermal...
...as. from. Thermalloy,. Inc.,. Dallas,. TX. recommended in ASTM D-5334-00, for. (www.thermalloy.com), and Arctic Silver. reducing these errors. Premium Silver Polysynthetic Compound, a. silver-filled thermal grease with a thermal. Characteristics of the materials for test are given. conductivity of 8 W...
...material must be optimized. An excessively rapid thermal treatment can cause the polymerization of the surface and prevent adequate moisture or solvent evaporation from the bulk of the SOD. Outgassing can cause trapping of hot and volatile compounds under the fully polymerized SOD surface layer...
...or below. This accelerated change, along with the type of sensor diaphragm material affects the pressure transducer performance and ultimately the control system. Other Pressure Sensing Technologies: O-ring sealed pressure sensors cannot withstand rapid thermal changes and over time the internal...
Engineering Web Search: Thermal Compound Distributor
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Arctic Silver Incorporated - ArctiClean
Instructions: How to apply thermal compound Find an Authorized Reseller: USA | International Find an Authorized Distributor: USA | International
Intel? Hance Rapids I/O Controller Hub Thermal and Mechanical...
Intel? 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide February 2004 Order Number: 300682-001 Contents INFORMATION IN THIS DOCUMENT IS
Ferrotec - manufacturing advanced material, component, and...
Ferrotec is a world leading manufacturer, marketer, and distributor of advanced material, component, and assembly solutions used in a broad array of
See Ferrotec (USA) Corporation Information
Discount Cooling Products from your one-stop computer store :...
Cooler Master IceFusion 200G Thermal Compound Cooler Master RG-ICFN-200G-B1 IceFusion 200G Thermal Compound....[more
Modified Face-Down Bonding of Ridge-Waveguide Lasers Using...
The delta phase shifted to the interfaces after reflow was postulated by its lower surface tension than zeta' phase Au/Sn compound.
Digi-Key Supplier Index
Thermal Compound 1104 Abracon Corporation