|
|
||
Welcome to GlobalSpec!
Find parts, products, suppliers, datasheets, and more for:
Thermal Interface Property
Find Suppliers by Category
Material testing services test, analyze, and certify a wide range of materials for purity, chemical compatibility, and environmental impact.
Search by Specification |
Learn More
-
Supplier: Device Technologies, Inc.Description: becomes necessary. DTIM material properties combine high thermal conductivity, flame-retardant properties for heat resistance, and electrical insulation. These requirements are becoming very important qualifications in the electronics industry. Silicone based thermal interface materials contain
- Substrate / Material Compatibility: Metal
- Industry: Aerospace, Electronics, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Chemical / Polymer System Type: Silicone
- Filled / Reinforced: Yes
-
Supplier: Sauereisen, Inc.Description: Sauereisen Aluseal Adhesive Cement No. 2 is a ceramic cement paste offering good bond strength and thermal shock resistant properties for assembling, sealing and cementing porcelain, glass, metal and other materials. Its fine particle size and excellent flow characteristics make No. 2 a good
- Material Type: Die Bonding Adhesive / Compound, Grease / Paste
- Industry: OEM / Industrial, Other
- Features: Electrical Insulation / Dielectric, Flexible / Dampening
- Composition: Unfilled
-
Supplier: XoxideDescription: 's thermal performance and help maintain a stable homogenous suspension. This exclusive combination provides performance exceeding most metal based compounds. Polysynthetic Suspension Fluid: A new oil mixture, improved thermal filler properties and increased particle deagglomeration, dispersal
-
Supplier: Aremco Products, Inc.Description: Exceptional mechanical and thermal properties
- Coating Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry Applications: Electronics (PCB / SMT Assembly), OEM / Industrial
- Chemical / Polymer System Type: Epoxy (EP)
-
Supplier: Decagon Devices, Inc.Description: Portable, Durable, 3 Interchangeable Sensors The KD2 Pro uses 3 interchangeable sensors to measure thermal diffusivity, specific heat (heat capacity), thermal conductivity and thermal resistivity. After taking a measurement, the KD2 Pro automatically converts data into thermal properties values
- Thermal Analyzer Type: Thermal Conductivity Analyzer
- Local Interface: Digital Front Panel
- Computer Interface Options: Serial Interface
- Display Options: Digital Readout
-
Supplier: Mentor Graphics - Mechanical AnalysisDescription: components. With dedicated fixtures and software, characterization of PWB-s or MCPCB-s and other substrates or thermal interface materials and/or cooling assemblies is also possible. Applications include: Heat-flow path reconstruction Die attach qualification Testing of stacked die
-
Supplier: Aremco Products, Inc.Description: Thermal grease, offers exceptional thermal and electrical properties
- Substrate / Material Compatibility: Ceramic / Glass, Metal
- Industry: Electronics, OEM / Industrial
- Chemical / Polymer System Type: Silicone
- Filled / Reinforced: Yes
-
Supplier: Shimadzu Scientific Instruments, Inc.Description: The multifunctional TMA-60 is the best model for expansion, elongation, and penetration measurements while the TMA-60H (high-temperature model) is best suited for differential thermal expansion measurements of ceramics and other materials with minute expansion properties.
- Thermal Analyzer Type: Thermal Mechanical Analyzer (TMA)
- Cooling Available: Yes
- Programmable Heating Rate: Yes
- Temperature Control: Yes
-
Supplier: Linseis Inc.Description: This product was specifically developed to meet all TMA measurements under highest temperatures (RT up to +1600°C). There are many applications where it is necessary to determine the mechanical properties of a material for quality control purposes. The TMA - PT1600 can be equipped
- Thermal Analyzer Type: Thermal Mechanical Analyzer (TMA)
- Programmable Heating Rate: Yes
- Atmosphere Control: Yes
- Temperature Control: Yes
-
Supplier: Epoxy TechnologyDescription: . Also available in higher viscosity for better non-flow properties. Contact techserv@epotek.com for your best match. Excellent solvent and chemical resistance - ideal for harsh environments found in aircraft, under-hood automotive, medical, and petrochemical refineries such as down-hole
- Substrate / Material Compatibility: Metal, Plastic
- Industry: Electronics
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric, Filled, Thermal / Heat Conductive
Featured Products for Thermal Interface Property Top
-
Indium Corporation manufactures custom thermal compounds and thermal interface materials to match your specifications. Indium Corporation manufactures a complete line of indium inorganic chemicals, each with unique physical and chemical properties. End use application range from use as a transparent conductor in flat panel computer displays to improving the operational efficiency in alkaline batteries. (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Indium Corporation -
Arlon is the worldwide leader in silicone flexible heater substrates. Our products' performance in thermal stability is recognized by Underwriters Laboratories--Arlon UL card 54153 (please click to see details). Here are the tests UL conducted: Thermal Endurance for a Relative Thermal Index. Resistance to Ignition and Tracking properties. Hot Wire Ignition (HWI). High-Current-Arc Ignition (HAI). High-Voltage-Arc Tracking Rate (HTVR). High Voltage Low-Current-Arc Resistance. Comparative Tracking... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Arlon LLC - Silicone Technologies Division
-
Minteq Pyrogenics Group PYROID® Pyrolytic Graphite (PG) product portfolio is "five-nine" pure made via chemical vapor deposition (CVD). The unique carbon structure originates from graphene and offers unique thermal, electrical and chemical properties. The material is very light weight, solid crystal composition, with no granular components and capable of withstanding temperature extremes. Our material is anisotropic, meaning it conducts heat and electricity in the x-y plane like copper but acts... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for MINTEQ® International Inc, Pyrogenics Group
-
Silicone rubber is a unique elastomer that delivers high performance electrical insulation in both low temperature and high temperature environments. Silicone rubber is particularly useful as a Thermal Interface Material (TIM). TIMs typically take the form of thermally conductive compositions which utilize silicone rubber as the continuous phase, and which are used to facilitate heat transfer between two opposing surfaces. For example, in the fabrication of semiconductor devices, TIMs... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Arlon LLC - Silicone Technologies Division
-
Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. Sil-Pad K-10 is designed to replace ceramic insulators such as Beryllium Oxide, Boron Nitride and Alumina. Ceramic insulators are expensive and they break easily. Sil-Pad K-10 eliminates breakage and costs much less than ceramics. Features and Benefits. Thermal impedance: 0.41°C-in2/W (@50 psi). Tough... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
-
flows under pressure like a grease.After cure, it does not pump from the interface as a result of thermal cycling. Unlike thermal grease, the cured product is dry to the touch. Unlike cured gap filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and eliminates the need for specific pad thickness and die-cut shapes for individual applications. Gap Filler 1000 is intended for use in thermal interface applications when a strong structural bond... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
-
The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation.These applications also typically have low mounting pressures for component clamping. Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity.These features optimize the thermal resistance properties at low pressures... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
-
Epoxy Technology announces its newest epoxies for superior thermal management: EPO-TEK EK1000, ED1003 & H20E-HC. These silver-filled adhesives exhibit exceptional thermal/electrical conductivity and provide superior performance in high-reliability applications. Properties include high Tg, low outgassing, long pot life with proven thermal performance in solar concentrators, LEDs and ICs. (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Epoxy Technology
-
No-cure, 1-part thermal paste (grease) DP series: *Easy to apply: 1-part, no-cure. *Running and vaporization problems to nearly disappear due to cross-linked particle structure. *High thermal conductivity up to 6.5 W/mK. *REP-100 to retain electromagnetic noise absorption property. Lambda GEL DP series are very soft thermal paste (grease) gel with up to 6.5W/mK thermal conductivity. The cross-linked particle structure of the Lambda GEL nearly eliminates running and vaporization problems often... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for TAICA Corporation (formerly Geltec Co., Ltd.)
-
Master Bond EP24AN is a fast curing two part epoxy designed to cure at room temperatures and produces high strength bonds to a wide variety of substrates. Master Bond EP24AN possesses an unusual property of curing at temperatures as low as 20°F.It features an exceptionally high thermal conductivity of over 22 BTU •in/ft² •hr •°F. Other noteworthy features include superior electrical insulation properties, enhanced dimensional stability and tensile shear strength over 1600 psi... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc.
Conduct Research Top
-
Thermal Interface Materials (.pdf)
Thermal Interface Materials (TIMs) are used to efficiently transmit heat from an area of high thermal energy to an area of lower thermal energy. These materials are often used to conduct heat away from a temperature sensitive device, or to transmit thermal energy to a device that is being thermally
-
Indium Thermal Interface Materials (.pdf)
Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered
-
Thermal Interface Materials - A Brief Overview
properties), their general appearance, and their mode of application. Among the most commonly used classes of thermal interface materials are: thermal greases, cure-in-place thermally conductive compounds, gap filling thermally conductive elastomeric pads, thermally conductive adhesive tapes, and phase
-
Thermal Millboard - D-8080
D-8080 is a thermal barrier material suitable for dry heat applications, electrical fixtures, and light-duty appliances. It can be used as a radiant heat shield where insulating properties are needed. Sealinfo: D-8080 - Gasket sealing solutions and engineered composite materials. Gasket Materials
-
Thermal Millboard - 412-Millboard
412-Millboard is a ceramic fiber board with inorganic fillers. It is an exceptional thermal insulator and is used for high temperature roll coverings and in fire protection areas where high strength properties are required. It is intended for applications with maximum continuous operating
-
Thermal Millboard - HT-5050
material that is suitable for combining on perforated metal core for heat shields and thermal barriers. It is formulated from mineral fiber and has low organic content. Property: Specification: Method: Density, g/cc(lb/cu.ft). 0.96 (60) (min.). ASTM F 1315. Tensile Strength, MD, MPa(psi). 2.50 (360
-
Thermal Management of UltraVolt HVPSs
the container is a good thermal conductor and has a low thermal-resistance interface between the HVPS and the container. Therefore,
-
Multi-Zone Temperature Monitoring with the TCN75 Thermal Sensor
Temperature Monitoring Technical Brief M. TB052. Multi-Zone Temperature Monitoring with. the TCN75 Thermal Sensor. nodes are connected to the host processor through an. Author: Ken Dietz. I2CTM interface. Only three TCN75 sensors are shown,. Microchip Technology Inc. to demonstrate the binary
Engineering Web Search: Thermal Interface Property Top
-
T3Ster - Dynamic Thermal Characterization - Mentor Graphics
and software, characterization of PWB-s or MCPCB-s and other substrates or thermal interface materials and/or cooling assemblies is also possible.
-
Thermal Interface Wet Dispensed Page - Dow Corning
Home > Technical Library > Electronics > Thermal Interface - Wet Dispensed Thermal Interface - Pads and Films Thermal Interface - Wet Dispensed
-
LM117/LM317A/LM317 3-Terminal Adjustable Regulator
Included on the chip are current limit, thermal overload protection and safe area protection.
-
Fujitsu Adds Smaller, Lower-Cost Thermal Printer Interface...
Fujitsu Adds Smaller, Lower-Cost Thermal Printer Interface Board Fujitsu Adds Smaller, Lower-Cost Thermal Printer Interface Board
-
Fujitsu Releases Interface Board for High-End Printer Features...
board series supports thermal print speeds up to 80mm/sec. Although developed for Fujitsu?s latest line of 4-inch thermal printer mechanisms, the
-
Documentation: HardCopy IV Devices
Intellectual Property Development Kits/Cables Intellectual Property Development Kits/Cables
-
Documentation: HardCopy II Devices
Intellectual Property Development Kits/Cables Intellectual Property Development Kits/Cables
-
Arctic Silver Incorporated - ArctiClean
cleaning process that removes existing thermal grease or pads and prepares the thermal surface for a fresh application of thermal interface material.
