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Thermal Potting Compound
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Supplier: GS Polymers, Inc.Description: Two part, 1:1, thermal conductive compound, available in cartridges
- Compound Type: Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Allied Electronics, Inc.Description: Silver Print, 27 °C Flash Point, 1.6 Specific Gravity The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Chemical / Polymer System Type: Epoxy (EP)
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Description: INSULCAST 117 is an easy to use, equal ratio (by weight or volume) epoxy potting/casting compound, designed for production dispensing equipment.
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Epoxies Etc...Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end assemblies
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics
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Supplier: Dampney Company, Inc.Description: Ready-to-use metal repair putty, dent filler and patching compound. Durable metal filler for fast, permanent repairs. A unique, quality problem-solver! Lab-metal ready-to-use repair compound spreads like paste and hardens quickly into metal.
- Industry Applications: Automotive, OEM / Industrial
- Chemical / Polymer System Type: Specialty / Other
- Composition: Filled
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Supplier: BJB Enterprises, Inc.Description: TC-1606 is a very low viscosity, black epoxy-potting compound. It has a long work life, excellent bubble release properties and can be injected through a small diameter tube such as a hypodermic needle. Thermal shock resistance is another advantage of TC-1606
- Chemical / Polymer System Type: Polyurethane
- Filler Material: Unfilled
- Compound Type: Casting Resin
- Liquid: Yes
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Supplier: ACCRAbond, Inc.Description: Casting resin. When cured with any of the hardeners presented below, these systems possess low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, good electrical properties and hardnesses.
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Supplier: Wacker Chemical Corp.Description: ELASTOSIL® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. Special features two-part, 1 : 1 mixing ratio very high hardness Shore A excellent heat stability high thermal conductivity Application encapsulation of electrical components
- Compound Type: Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Silicone
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Supplier: Ellsworth AdhesivesDescription: Stycast 2850 FT is a two component, thermally conductive epoxy encapsulant that can be used with a variety of catalysts. It features a low coefficient of thermal expansion and excellent electrical insulative properties. Sold as a pack (4/pk).
- Compound Type: Thermal Compound / Thermally Conductive
- Industry Applications: OEM / Industrial
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
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Supplier: Martek PowerDescription: , 24 and 48 VDC inputs making them one of the most versatile product lines in the market with efficiencies up to 87%. Advanced surface mount construction allows these converters to achieve outstanding thermal performance eliminating the need for thermal potting compounds and thereby enhancing
- Power Supply Type: DC/DC Converter
- Style / Mounting: Enclosed, Board Mount
- Applications: Computer, Instrumentation, Other
- Display: None
Featured Products for Thermal Potting Compound Top
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Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No. 11 is formulated to be compatible with most metal alloys that it may contact. The cement is supplied in powder form and need only be mixed with water to apply. High electrical resistance. Heat conductive and thermal shock... (read more)Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Sauereisen, Inc. -
Epoxies, Etc. has introduced a new elastomeric Potting and Encapsulating Compound developed for the protection of electronic circuits, components, and devices. This product is formulated to cushion and protect sensitive electronic components. The 20-2121 will impart very little stress on components during cure or thermal cycling. 20-2121 is FDA Compliant. The raw materials used in this product are listed under different FDA CFR 21 Sections which allow these materials to be used in applications... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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Epoxies, Etc. has developed two new Polyurethane Potting Compounds. These systems provide outstanding thermal cycling properties, low temperature resistance, and low embedment stress to sensitive electronic components. 50-2185 is a filled 80 Shore A system exhibiting flexibility to -55C, high thermal conductivity, and flame resistance meeting UL 94 V-O. These unique set of properties provide low component stress upon curing and extreme thermal cycling making 50-2185 ideal for protecting... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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is the smart choice when the application design requires the combination of heat transfer, flame retardancy, and electrical insulation properties. The revolutionary 50-2369 FR protects electronic assemblies from moisture, impact, thermal shock, heat, and fire. There is no other Potting Compound that is UL 94 V-O Listed with this unique combination of properties: Thermally Conductive- 50-2369 FR is the perfect solution for today's electronics, which are getting smaller and are generating more heat... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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Design more durable, vibration resistant, moisture proof circuit boards at a savings of up to 80% with Epoxies, etc … revolutionary breakthrough potting compound. The new 20-2353 solves the problem of electronic components that require protection against moisture, thermal shock, vibration and very low temperatures. (White Paper). So what makes 20-2353 so superior to previous compounds? Three things: Wide Temperature Range - This two-part system has been engineered to maintain its... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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Epoxies, Etc... develops 50-3150 FR to meet the non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers heat transfer, low shrinkage, and outstanding insulation properties. The 50-3150 FR provides both thermal conductivity and flame retardancy in an electronic grade potting compound. TYPICAL SPECIFICATIONS: · Viscosity @ 25oC cps 60,000. · Specific Gravity, 25oC/25oC 1.6... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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. · Dielectric Strength, volts/mil 500. · Volume Resistivity, ohm-cm 3 x 1015. · Operating Temperature Range, °C -40 to + 135. · Coefficient of Thermal Expansion, per °C 2.28 x 10-4. · Fungus Resistance Excellent... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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Master Bond EP30FL has excellent adhesion to both similar and dissimilar substrates. Because of its flexibility it is particularly recommended for use in environments exposed to thermal cycling. Additionally it can withstand mechanical shock and vibration. The hardened compound has superior electrical insulation properties and resistance to water. Master Bond EP30FL is available in 1/2 pint, pint, quart, gallon and 5 gallon pail kits. (read more)Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
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DESCRIPTION: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy... (read more)Browse Electrical and Electronic Resins Datasheets for Epoxies Etc...
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The new 50-3150FR encapsulating compound from Epoxies, Etc. is the perfect choice for any application that requires high thermal conductivity and flame retardancy such as encapsulating power supplies, sensors, transformers, coils, insulators, etc. SEE VIDEO. Complimentary Samples for testing are available upon request. 50-3150FR was developed in response to industry demand for so many new designs that require an electronic potting solution that provides both a low viscosity material and a fast... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
Parts by Number for Thermal Potting Compound Top
| Partb # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 4480292 | RS Components, Ltd. | Acc Silicones | Potting Compounds | Primary Application Category:Thermal Conductivity, Shock Resistant, Moisture Buffer; Curing Type:1 Part; Material:Silicone; Pack Type:Cartridge; Pack Size:75ml; Colour:White |
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
. conductive potting compounds provide an efficient pathway for heat to travel uniformly away. from a heat-generating source to a metal enclosure or to air. Additional benefits from the use. of these products are: outstanding electrical insulation, better thermal shock resistance, lower. shrinkage
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UV Curing Adhesives and Potting Compounds
when the light is removed. 60-7107 Potting/Encapsulating. This can be beneficial to parts with shadowed areas, as 60-7155 - Coating. long as. 60-7156 - Coating. these areas receive some minimum light exposure. A thermal post treatment is often recommended to complete the shadow cure. While cationic
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New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
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Solving Ultraviolet Curable Potting & Encapsulating Problems With Shadow Cure Technology
potting compound is poured over the assembly. The term Encapsulation describes a molding or dipping process where there is no case or shell. The assembly is either coated or the compound is poured into a mold and the cured compound becomes the outside of the assembly. The terms Potting and Encapsulating
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MICRO: Defect/Yield Analysis - Kumar (January 2001)
trap was rapidly heated to desorb compounds into the chromatograph for analysis. This test determined that the major source of TCPP was the HEPA filter potting compound, which outgassed 531 ppmw of TCPP, the highest peak in the GC-MS chromatogram shown in Figure 5. Figure 5: Results of the dynamic
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Adhesives hold electric motors together
that bond structural metal and plastic components; Proform hot melts for bonding engineering plastics, including polyolefins and high-temperature polyamides; and Encap potting and encapsulating compounds to protect electric parts from exposure to chemicals, moisture, and thermal shock. A new acrylic
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Survey Reveals Critical Properties of Adhesives
applications. ABOUT SAUEREISEN. subject to high temperature and electricity. Sauereisen's adhesives and potting compounds are inor-. Given that another division of the Sauereisen enterprise. ganic, ceramic-based materials. These specialty cements are. is devoted to the creation
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Epoxy
-molecular-weight solids. The novolacs are another important class of epoxy resins, particularly the ECNs (epoxy cresol novolacs) and EPNs (epoxy phenol novolacs). These polyfunctional resins offer higher thermal properties and improved chemical resistance over bis-A derivatives. The cycloaliphatics
Engineering Web Search: Thermal Potting Compound Top
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Thermal Simulation Reduces Cost of Stacked Module Potting...
Home Company News Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50%
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Potting Compound withstands temperature extremes., Master...
Potting Compound withstands temperature extremes.
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Current and reliable Adhesives & Sealants news stories
Potting and Encapsulating Compound is FDA compliant.
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Thermal Compound / Heat Conductive Silicone...
Home > Datasheets > Silicone Adhesives and Sealants > Thermal Compound / Heat Conductive
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Thermal Compound / Heat Conductive Polyurethane...
Home > Datasheets > Polyurethane Adhesives and Sealants > Thermal Compound / Heat Conductive
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Vishay - Resistors, discrete - CP002M - Wirewound Resistors,...
Special inorganic potting compound and ceramic case provide high thermal conductivity in a fireproof package
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Vishay - New Wirewound / Metal Oxide Resistor Series Optimized...
range of ?65 °C to +275 °C, as well as the thermal benefits of a ceramic casing and cement potting compound.
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Non-uniform thermal properties of an alumina granule/epoxy...
Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Conference Title: 2010 12th IEEE Intersociety Conference on Thermal and
