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  • MICRO:Rosenberg (March 2001)
    by Thermal Coating, a start-up firm that has become a subsidiary of Pentagon Technologies (Fremont, CA). This article discusses the application of the TWAS method to semiconductor process operations and presents the results of experiments that were conducted in order to advance the use of the coating

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  • ZCP2012ITSCESA
    Thermal Spray Coatings - Semiconductor Equipment Design and Process Chamber Requirements 40 Nanometer and Beyond J. Sommers Applied Materials, Inc., Santa Clara, CA *E-mail: joe_sommers@amat.com .
  • ZAMP16805P39
    fter reviewing the history of technical development and applications of thermal spray coatings for semiconductor integrated circuit (IC) equipment, I believe that semiconductor IC equipment cannot survive without the wide use of thermal spray coatings.
  • ZCP2012ITSCESA390
    Thermal Spray Coatings - Semiconductor Equipment Design and Process Chamber Requirements 40 Nanometer and Beyond J. Sommers Applied Materials, Inc., Santa Clara, CA *E-mail: joe_sommers@amat.com .
  • International Thermal Spray & Surface Engineering
    Organizations participating · Hybrid Deposition Systems and High Performance in this event include universities, semiconductor equipment Coating Development manufacturers, semiconductor and electronic component man· Nanostructured Coatings and Material Systems ufacturers, thermal spray companies, semiconductor coating · Materials and Coatings for Suspension/Solution...
  • International Thermal Spray and Surface Engineering
    Organizations participating in this event include universities, semiconductor equipment manufacturers, semiconductor and electronic component manufacturers, thermal spray companies, semiconductor coating and cleaning companies, thermal spray powder and equipment manufacturers, and research iTSSe and development organizations.
  • ZCP1996ITSC793
    THERMAL SPRAYING is attracting considerable interest as a method for depositing economical high performance dielectric coatings for semiconductor applications.
  • ZCP2013ITSCL
    J. Kitamura, H. Ibe, F. Yuasa, Z. Tang, A. Burgess, Structural, Mechanical and Erosion Properties of Plasma Sprayed Yttrium Oxide Coatings by Axial Injection of Fine Powder Slurries for Semiconductor and Flat-PanelDisplay Applications, Thermal Spray 2009: Expanding Thermal Spray Performance...
  • ZCP2013ITSCESA307
    J. Kitamura, H. Ibe, F. Yuasa, Z. Tang, A. Burgess, Structural, Mechanical and Erosion Properties of Plasma Sprayed Yttrium Oxide Coatings by Axial Injection of Fine Powder Slurries for Semiconductor and Flat-PanelDisplay Applications, Thermal Spray 2009: Expanding Thermal Spray Performance...
  • ZCP2013ITSCESA
    J. Kitamura, H. Ibe, F. Yuasa, Z. Tang, A. Burgess, Structural, Mechanical and Erosion Properties of Plasma Sprayed Yttrium Oxide Coatings by Axial Injection of Fine Powder Slurries for Semiconductor and Flat-PanelDisplay Applications, Thermal Spray 2009: Expanding Thermal Spray Performance...
  • ZCP2008ITSC0250
    Solution precursor plasma spraying (SPPS) has been used to deposit thermal barrire coatings , solid oxide fuel cell electrodes, and semiconductor oxside gas sensors [1-3].
  • International Thermal Spray & Surface Engineering
    ...symposia include Applications and Case Studies; Equipment, Processes, and Modeling; General (Safety, Pre and Post Treatments, Young Professionals, Commercial/Industry, Education and Training); Materials in Thermal Spray ; Advances in Turbine Coatings ; Biomedical; Electronic and Semiconductor Applications; and Technology Advancements in Thermal Spray.
  • ZCP2006ITSC0557
    Ceramic Coatings Prepared by Plasma Spraying for Semiconductor Production Equipment, as published in Proceedings of the 2006 International Thermal Spray Conference B.R. Marple, M.M. Hyland, Y.-C. Lau, R.S. Lima, J. Voyer, editors, May 2006, p 557-562...
  • ASM News (April 2009)
    ...Semiconductor Equipment, Flat Panel Display and Electronics Industries Plasma Sprayed Ceramics in Semiconductor Equipment and Electronics Applications Advances in Coatings, Processing and Diagnostics for Semiconductor Equipment and Electronics Applications Thermal Spray Metallic Coatings for Use in Semiconductor Defect Reduction Advances in...
  • ZCP2010ITSC207
    [6] Kitamura, J., Ibe, H., Yuasa, F. and Mizuno, H.: Plasma Sprayed Coatings of High Purity Ceramics for Semiconductor and Flat-Panel-Display Production Equipment, J. Thermal Spray Technol., 17, (2008), Issue 5-6, pp. 495/501.
  • ZJTST1701P005
    In the semiconductor and LCD fields, future challenges involving thermal spray technologies include the following examples: the inventions of coatings applicable to the microfabrication of electronic devices involving new stacking morphologies for sprayed coatings, corrosion-resistant coatings for fluoride environments, coatings...