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  • IR Characterization of Bi-Propellant Reaction Control Engines During Auxiliary Propulsion Systems Tests at NASA's White Sands Test Facility In Las Cruces, New Mexico
    (NASA) White Sands Test Facility (WSTF) near Las Cruces, New Mexico. Typically, NASA has relied mostly on the use of ThermoCouples (TC) for this type of thermal monitoring due to the variability of constraints required to accurately map rapidly changing temperatures from ambient to glowing hot chamber
  • Key Thermal Design Ingredients for Industrial-grade Computers (.pdf)
    design, an industrial computer will dissipate heat more efficiently and demonstrate a wider operating temperature in rigorous chamber tests. This white paper explores the major ingredients that contribute to an intelligent, efficient thermal design in industrial-grade computers.
  • Remote Control
    Automotive and electrical components that need be thermal-cycled come in many shapes and sizes, as do test chambers. But one size definitely does not fit all. Just try to force your half-buck fixture into your 8ft3 chamber or explain to management why a walk-in chamber is being used to test four
  • MICRO:Rosenberg (March 2001)
    nitride (TiN), titanium tungsten, cobalt silicide, tungsten silicide, tantalum, and tantalum nitride. These metal compounds are used for barrier/liner processes because they form high-stress films when deposited. However, high stress, along with plasma and thermal cycling, tends to cause refractory
  • How to Optimize Temperature Conditioning and Verification for Industrial Sensor/Transmitter Device Manufacturing - PART 2
    This two-part article, was originally published in Sensors Magazine. In Part 2 we will discuss how cooling capacity and controls affect thermal performance. Part 1 addressed the variables in a test environment and the criteria for matching chamber size to the UUT (Unit Under Test). The specified
  • What is Environmental Stress Screening (ESS)?
    Although ESS may use chambers and shakers resembling those used for an environmental test, the purpose is different. In ESS it stimulates just-produced or just-overhauled equipment (usually an electronic assembly or subassembly), usually using rapid thermal ramping and broad-spectrum random
  • MICRO: Industry News: 'Round the Circuit (September 2000)
    009;A calibration wafer developed by NIST improves chipmakers' ability to accurately measure and control temperature during rapid thermal processing (RTP). The test wafer is designed to meet the semiconductor industry's need to reduce temperature measurement uncertainty to 2 C. Thin-film
  • Bellows let chip testers run hot and cold
    automated chip test handler extend and retract pins and probes. The pins knock flashing off plastic chip packages, function as test probes, and position chips for testing and sorting. Trouble was, temperature extremes in the thermal soak chamber raised havoc with many otherwise viable actuator candidates

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